Ying Ying Lim

445 total citations
39 papers, 305 citations indexed

About

Ying Ying Lim is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Aerospace Engineering. According to data from OpenAlex, Ying Ying Lim has authored 39 papers receiving a total of 305 indexed citations (citations by other indexed papers that have themselves been cited), including 35 papers in Electrical and Electronic Engineering, 8 papers in Biomedical Engineering and 5 papers in Aerospace Engineering. Recurrent topics in Ying Ying Lim's work include 3D IC and TSV technologies (13 papers), Electronic Packaging and Soldering Technologies (12 papers) and Microwave Engineering and Waveguides (10 papers). Ying Ying Lim is often cited by papers focused on 3D IC and TSV technologies (13 papers), Electronic Packaging and Soldering Technologies (12 papers) and Microwave Engineering and Waveguides (10 papers). Ying Ying Lim collaborates with scholars based in Singapore, Japan and United Kingdom. Ying Ying Lim's co-authors include P. Chinnamuthu, Vasarla Nagendra Sekhar, John H. Lau, Mihai Rotaru, Jehova Jire L. Hmar, Yee Mey Goh, Changqing Liu, Jaibir Sharma, Gaurav Sharma and Shun Watanabe and has published in prestigious journals such as Scientific Reports, Industrial & Engineering Chemistry Research and Japanese Journal of Applied Physics.

In The Last Decade

Ying Ying Lim

37 papers receiving 282 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Ying Ying Lim Singapore 9 262 69 43 33 33 39 305
Jae Woo Joung South Korea 5 256 1.0× 186 2.7× 60 1.4× 61 1.8× 15 0.5× 9 334
Samuel Suhard Belgium 12 268 1.0× 95 1.4× 42 1.0× 55 1.7× 17 0.5× 48 355
Zhuo Yang China 11 311 1.2× 57 0.8× 87 2.0× 14 0.4× 61 1.8× 50 421
Xiaodong Qi China 12 154 0.6× 75 1.1× 81 1.9× 49 1.5× 13 0.4× 25 336
Ashish Prajapati Israel 12 242 0.9× 164 2.4× 67 1.6× 23 0.7× 8 0.2× 33 307
Zhiming Bai China 9 231 0.9× 74 1.1× 75 1.7× 99 3.0× 56 1.7× 16 357
Markku Rouvala Finland 10 271 1.0× 104 1.5× 50 1.2× 29 0.9× 10 0.3× 18 375
Guangyao Liu China 10 286 1.1× 38 0.6× 178 4.1× 48 1.5× 7 0.2× 20 361

Countries citing papers authored by Ying Ying Lim

Since Specialization
Citations

This map shows the geographic impact of Ying Ying Lim's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Ying Ying Lim with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Ying Ying Lim more than expected).

Fields of papers citing papers by Ying Ying Lim

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Ying Ying Lim. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Ying Ying Lim. The network helps show where Ying Ying Lim may publish in the future.

Co-authorship network of co-authors of Ying Ying Lim

This figure shows the co-authorship network connecting the top 25 collaborators of Ying Ying Lim. A scholar is included among the top collaborators of Ying Ying Lim based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Ying Ying Lim. Ying Ying Lim is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Lim, Ying Ying, et al.. (2026). Warpage control by mesh ground structures in organic interposers. Japanese Journal of Applied Physics. 65(5). 05SP23–05SP23. 1 indexed citations
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Lim, Ying Ying, et al.. (2023). Preliminary study on ZIF-8 containing hollow fiber mixed matrix membranes (HFMMMs) for CO2 and CH4 gas permeation. Materials Today Proceedings. 6 indexed citations
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Lim, Ying Ying, et al.. (2022). Temperature dependency on Ce-doped CuO nanoparticles: a comparative study via XRD line broadening analysis. Applied Physics A. 128(3). 28 indexed citations
6.
Lim, Ying Ying, et al.. (2021). Electrical and dielectric parameters in TiO2-NW/Ge-NW heterostructure MOS device synthesized by glancing angle deposition technique. Scientific Reports. 11(1). 19837–19837. 4 indexed citations
7.
Kumagai, Shohei, Akifumi Yamamura, Junto Tsurumi, et al.. (2019). Scalable Fabrication of Organic Single-Crystalline Wafers for Reproducible TFT Arrays. Scientific Reports. 9(1). 15897–15897. 49 indexed citations
8.
Lim, Ying Ying, et al.. (2019). Hardness Characteristics of Au Cone-Shaped Bumps Targeted for 3-D Packaging Applications. IEEE Transactions on Components Packaging and Manufacturing Technology. 9(3). 419–426. 1 indexed citations
9.
Lim, Ying Ying, Yee Mey Goh, Changqing Liu, & David A. Hutt. (2015). Surface modification of an ambient UV-cured dielectric to realise electrically conducting traces. Surface and Coatings Technology. 266. 93–104. 2 indexed citations
10.
Chen, Bangtao, et al.. (2013). Low-Loss Broadband Package Platform With Surface Passivation and TSV for Wafer-Level Packaging of RF-MEMS Devices. IEEE Transactions on Components Packaging and Manufacturing Technology. 3(9). 1443–1452. 33 indexed citations
11.
Lim, Ying Ying, Yee Mey Goh, & C. Liu. (2012). RF performance of inkjet and stencil printed traces for flexible electronics applications. 98. 556–562. 2 indexed citations
12.
Lim, Ying Ying, R. Rajoo, & Ser Choong Chong. (2010). Design and fabrication of embedded passives on thin flexible substrates and reliability evaluation of passives performance. 681–686. 1 indexed citations
13.
Lim, Ying Ying, Srinivasa Rao Vempati, Aditya Kumar, et al.. (2010). High Quality and Low Loss Millimeter Wave Passives Demonstrated to 77-GHz for SiP Technologies Using Embedded Wafer-Level Packaging Platform (EMWLP). IEEE Transactions on Advanced Packaging. 33(4). 1061–1071. 12 indexed citations
14.
Lim, Ying Ying, Srinivasa Rao Vempati, Aditya Kumar, et al.. (2009). Demonstration of high quality and low loss millimeter wave passives on embedded wafer level packaging platform (EMWLP). 55. 508–515. 8 indexed citations
15.
Vempati, Srinivasa Rao, et al.. (2009). Development of 3-D silicon die stacked package using flip chip technology with micro bump interconnects. Rare & Special e-Zone (The Hong Kong University of Science and Technology). 980–987. 35 indexed citations
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Sharma, Gaurav, et al.. (2009). Low temperature dielectric material for embedded micro wafer level packaging. 197–201. 1 indexed citations
18.
Lau, John H., Ying Ying Lim, Teck Guan Lim, et al.. (2008). Design and analysis of 3D stacked optoelectronics on optical printed circuit boards. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 6899. 689907–689907. 7 indexed citations
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Lim, Ying Ying, et al.. (2005). Simple and improved dielectric parameter extraction of thin organic packaging materials using open-ended coaxial line technique. IEE Proceedings - Microwaves Antennas and Propagation. 152(4). 214–214. 5 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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