King Jien Chui

422 total citations
28 papers, 321 citations indexed

About

King Jien Chui is a scholar working on Electrical and Electronic Engineering, Atomic and Molecular Physics, and Optics and Mechanical Engineering. According to data from OpenAlex, King Jien Chui has authored 28 papers receiving a total of 321 indexed citations (citations by other indexed papers that have themselves been cited), including 25 papers in Electrical and Electronic Engineering, 4 papers in Atomic and Molecular Physics, and Optics and 4 papers in Mechanical Engineering. Recurrent topics in King Jien Chui's work include 3D IC and TSV technologies (17 papers), Electronic Packaging and Soldering Technologies (10 papers) and Semiconductor materials and devices (9 papers). King Jien Chui is often cited by papers focused on 3D IC and TSV technologies (17 papers), Electronic Packaging and Soldering Technologies (10 papers) and Semiconductor materials and devices (9 papers). King Jien Chui collaborates with scholars based in Singapore and United States. King Jien Chui's co-authors include Xiaowu Zhang, Kah‐Wee Ang, N. Balasubramanian, Ganesh S. Samudra, Sunil Wickramanayaka, Anyan Du, Liang Ding, Rahul Dutta, Ka Fai Chang and Songbai Zhang and has published in prestigious journals such as Applied Physics Letters, IEEE Electron Device Letters and Applied Physics Reviews.

In The Last Decade

King Jien Chui

27 papers receiving 314 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
King Jien Chui Singapore 8 296 66 38 35 32 28 321
Kazuhisa Kudou Japan 11 219 0.7× 146 2.2× 43 1.1× 70 2.0× 45 1.4× 31 316
Scott Pozder United States 14 580 2.0× 51 0.8× 54 1.4× 26 0.7× 52 1.6× 25 607
S. Chéramy France 14 490 1.7× 71 1.1× 40 1.1× 20 0.6× 21 0.7× 61 522
Josef Weber Germany 8 295 1.0× 59 0.9× 36 0.9× 25 0.7× 15 0.5× 20 323
T. Vandeweyer Belgium 15 622 2.1× 135 2.0× 14 0.4× 61 1.7× 62 1.9× 43 648
Adeel Bajwa United States 13 366 1.2× 68 1.0× 98 2.6× 12 0.3× 21 0.7× 26 415
Taeyoung Chung South Korea 10 275 0.9× 132 2.0× 14 0.4× 49 1.4× 37 1.2× 30 373
M. J. Interrante United States 6 463 1.6× 71 1.1× 24 0.6× 47 1.3× 32 1.0× 7 487
Sebastiano Strangio Italy 17 767 2.6× 169 2.6× 18 0.5× 36 1.0× 65 2.0× 44 807

Countries citing papers authored by King Jien Chui

Since Specialization
Citations

This map shows the geographic impact of King Jien Chui's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by King Jien Chui with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites King Jien Chui more than expected).

Fields of papers citing papers by King Jien Chui

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by King Jien Chui. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by King Jien Chui. The network helps show where King Jien Chui may publish in the future.

Co-authorship network of co-authors of King Jien Chui

This figure shows the co-authorship network connecting the top 25 collaborators of King Jien Chui. A scholar is included among the top collaborators of King Jien Chui based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with King Jien Chui. King Jien Chui is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Feng, Huicheng, Gongyue Tang, Xiaowu Zhang, et al.. (2024). Two-Phase Liquid Cooling for High-Power Microelectronics via Embedded Micro-Pin Fin Heat Sink. IEEE Transactions on Components Packaging and Manufacturing Technology. 14(3). 397–405. 8 indexed citations
2.
3.
Feng, Huicheng, Gongyue Tang, Xiaowu Zhang, et al.. (2023). Development of Crossflow Manifold for Two-Phase Liquid Cooling of 3D ICs via 3D Printing. 1012–1016. 5 indexed citations
4.
Lim, Teck Guan, Sasi Kumar Tippabhotla, Jiaqi Wu, et al.. (2023). High-Performance Amplifier Package Design for Heterogenous Integration on Si-interposer. 1838–1843. 4 indexed citations
5.
Wang, Xiangyu, et al.. (2022). Via-Last TSV (From Top) Fabrication on a LNA SOI Wafer for 3D Heterogeneous Chiplet Integration. 119–123. 2 indexed citations
6.
7.
Tang, Gongyue, Xiaowu Zhang, Boon Long Lau, et al.. (2022). Design and Development of Manifolds for Parallel Flow and Counter Flow in Two-Phase Cooling of 3D ICs. 880–884. 7 indexed citations
8.
Bera, L. K., et al.. (2022). Multi-Layer High-K Gate Stack Materials for Low D<sub>it</sub> 4H-SiC Based MOSFETs. Materials science forum. 1062. 528–532. 1 indexed citations
9.
10.
Wang, Weijie, Wen‐Dong Song, I‐Ting Wang, et al.. (2020). Endurance and Variability Control for Analog Switching in Dual Oxide Layer RRAM Devices. 115. 1–4. 2 indexed citations
11.
Chui, King Jien, et al.. (2019). High Aspect Ratio (>10:1) Via-Middle TSV with High-k Dielectric Liner Oxide. 4 indexed citations
12.
Song, Wen‐Dong, Weijie Wang, Minghua Li, et al.. (2019). Analog switching characteristics in TiW/Al2O3/Ta2O5/Ta RRAM devices. Applied Physics Letters. 115(13). 33 indexed citations
13.
Chui, King Jien, et al.. (2017). Passive Devices Fabrication on FOWLP and Characterization for RF Applications. 96. 312–318. 2 indexed citations
14.
Chui, King Jien, et al.. (2016). Evaluation on multiple layer PBO-based Cu RDL process for Fan-Out Wafer Level Packaging (FOWLP). 662–665. 2 indexed citations
15.
Chui, King Jien, et al.. (2015). A cost model analysis comparing via-middle and via-last TSV processes. 1–4. 8 indexed citations
16.
17.
Chui, King Jien, et al.. (2015). TSV via last etch integration challenges and etch optimization. 1–3. 1 indexed citations
18.
Chui, King Jien, et al.. (2014). Through silicon via (TSV) scallop smoothening technique. 676–678. 5 indexed citations
19.
Ang, Kah‐Wee, King Jien Chui, Hoong Chor Chin, et al.. (2006). 50 nm Silicon-On-Insulator N-MOSFET Featuring Multiple Stressors: Silicon-Carbon Source/Drain Regions and Tensile Stress Silicon Nitride Liner. 22. 66–67. 15 indexed citations
20.
Chui, King Jien, Kah‐Wee Ang, Hoong Chor Chin, et al.. (2006). Strained-SOI n-Channel Transistor With Silicon–Carbon Source/Drain Regions for Carrier Transport Enhancement. IEEE Electron Device Letters. 27(9). 778–780. 13 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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