Xiangkun Yin

731 total citations
54 papers, 489 citations indexed

About

Xiangkun Yin is a scholar working on Electrical and Electronic Engineering, Atomic and Molecular Physics, and Optics and Aerospace Engineering. According to data from OpenAlex, Xiangkun Yin has authored 54 papers receiving a total of 489 indexed citations (citations by other indexed papers that have themselves been cited), including 52 papers in Electrical and Electronic Engineering, 10 papers in Atomic and Molecular Physics, and Optics and 5 papers in Aerospace Engineering. Recurrent topics in Xiangkun Yin's work include 3D IC and TSV technologies (35 papers), Microwave Engineering and Waveguides (25 papers) and Electromagnetic Compatibility and Noise Suppression (17 papers). Xiangkun Yin is often cited by papers focused on 3D IC and TSV technologies (35 papers), Microwave Engineering and Waveguides (25 papers) and Electromagnetic Compatibility and Noise Suppression (17 papers). Xiangkun Yin collaborates with scholars based in China, United Kingdom and Singapore. Xiangkun Yin's co-authors include Zhangming Zhu, Yintang Yang, Xiaoxian Liu, Yang Liu, Qijun Lu, Fengjuan Wang, Ruixue Ding, Yuan Yang, Ningmei Yu and Ningmei Yu and has published in prestigious journals such as Optics Express, IEEE Access and IEEE Transactions on Microwave Theory and Techniques.

In The Last Decade

Xiangkun Yin

44 papers receiving 476 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Xiangkun Yin China 12 446 81 52 37 32 54 489
Qijun Lu China 12 360 0.8× 58 0.7× 41 0.8× 30 0.8× 9 0.3× 28 374
Teck Guan Lim Singapore 11 390 0.9× 60 0.7× 29 0.6× 42 1.1× 18 0.6× 47 401
Jung Han Choi Germany 9 391 0.9× 56 0.7× 40 0.8× 101 2.7× 23 0.7× 47 461
Bernd Deutschmann Austria 11 394 0.9× 33 0.4× 17 0.3× 38 1.0× 43 1.3× 103 461
Pilsoon Choi United States 14 525 1.2× 22 0.3× 64 1.2× 87 2.4× 47 1.5× 31 582
Myunghoi Kim South Korea 12 361 0.8× 150 1.9× 22 0.4× 17 0.5× 46 1.4× 45 374
Roberto Suaya United States 7 427 1.0× 59 0.7× 122 2.3× 17 0.5× 15 0.5× 24 458
Scott S. Gerber United States 15 372 0.8× 109 1.3× 20 0.4× 42 1.1× 13 0.4× 40 438
Donghao Li China 11 407 0.9× 153 1.9× 22 0.4× 26 0.7× 24 0.8× 36 442
A.C.W. Lu Singapore 8 338 0.8× 163 2.0× 15 0.3× 73 2.0× 26 0.8× 34 398

Countries citing papers authored by Xiangkun Yin

Since Specialization
Citations

This map shows the geographic impact of Xiangkun Yin's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Xiangkun Yin with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Xiangkun Yin more than expected).

Fields of papers citing papers by Xiangkun Yin

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Xiangkun Yin. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Xiangkun Yin. The network helps show where Xiangkun Yin may publish in the future.

Co-authorship network of co-authors of Xiangkun Yin

This figure shows the co-authorship network connecting the top 25 collaborators of Xiangkun Yin. A scholar is included among the top collaborators of Xiangkun Yin based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Xiangkun Yin. Xiangkun Yin is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Liu, Le, Fengjuan Wang, Xiangkun Yin, et al.. (2025). Low-Loss Flexible Filter Based on Compact Double Interdigital Coupling SIR With TPV Technology for Bendable Wireless Communications. IEEE Microwave and Wireless Technology Letters. 1–4.
2.
Yin, Xiangkun, Xiangyu Ma, Libo Qian, et al.. (2025). Parasitic-induced multi-zero generation and port-fusion compact filter based on 3-D through-silicon via technology. Microelectronics Journal. 158. 106618–106618.
3.
Wang, Fengjuan, Xiangkun Yin, Yuan Yang, et al.. (2025). Investigation on Electromigration Failure Mechanism and Lifetime Prediction of Interconnects Under Multifield Coupling for Chiplet Applications. IEEE Transactions on Electron Devices. 73(1). 552–560.
4.
Deng, Yue, et al.. (2025). Ultracompact On-Chip Branch Line Coupler Based on Through-Silicon Via Technology. IEEE Transactions on Components Packaging and Manufacturing Technology. 15(3). 623–626. 11 indexed citations
5.
Deng, Yue, Fengjuan Wang, Xiangkun Yin, et al.. (2024). A High Coupling Coefficient and Symmetric Transformer Based on TSV. IEEE Transactions on Components Packaging and Manufacturing Technology. 15(1). 165–172. 8 indexed citations
6.
Zhang, Tao, Haohui Chen, Wenwei Lu, et al.. (2024). A Wideband Compact Digitally-Assisted Variable Gain Phase Shifter for Ka-Band Applications. IEEE Transactions on Circuits & Systems II Express Briefs. 72(2). 404–408.
7.
Wang, Fengjuan, Ying Lu, Xiangkun Yin, et al.. (2023). Miniaturized silicon-based substrate integrated waveguide filter for 6G applications. Microelectronics Journal. 138. 105837–105837. 4 indexed citations
8.
Wang, Fengjuan, et al.. (2023). A Compact Sixth-Order Common-Mode Noise Suppression Filter Based on 3-D Integration Technology. IEEE Transactions on Components Packaging and Manufacturing Technology. 13(4). 502–510. 7 indexed citations
9.
Wang, Fengjuan, et al.. (2023). A Miniaturized Wideband SIR Interdigital Bandpass Filter With High Performance Based on TSV Technology for W-Band Application. IEEE Transactions on Components Packaging and Manufacturing Technology. 13(6). 906–909. 9 indexed citations
10.
Wang, Fengjuan, et al.. (2023). A Fully Symmetric High-Performance Transformer Balun Based on TSV for RF Applications. IEEE Transactions on Components Packaging and Manufacturing Technology. 13(7). 1074–1077. 2 indexed citations
11.
Wang, Fengjuan, et al.. (2023). TSV-based SIW bandpass filter with adjustable transmission zeros for D-band applications. IEICE Electronics Express. 20(10). 20230116–20230116. 1 indexed citations
12.
Liu, Yang, Xiaoxian Liu, Qijun Lu, Tao Zhang, & Xiangkun Yin. (2021). A T-Model With Parameter Extraction Method for Modeling 3-D Spiral Inductor. IEEE Microwave and Wireless Components Letters. 32(1). 37–40. 5 indexed citations
13.
Yin, Xiangkun, Fengjuan Wang, Qijun Lu, et al.. (2021). A Miniatured Passive Low-Pass Filter With Ultrawide Stopband Based on 3-D Integration Technology. IEEE Microwave and Wireless Components Letters. 32(1). 29–32. 19 indexed citations
14.
Liu, Xiaoxian, Zhangming Zhu, Yang Liu, et al.. (2020). Compact Bandpass Filter and Diplexer With Wide-Stopband Suppression Based on Balanced Substrate-Integrated Waveguide. IEEE Transactions on Microwave Theory and Techniques. 69(1). 54–64. 52 indexed citations
15.
Yin, Xiangkun, Zhangming Zhu, Yang Liu, et al.. (2018). Ultra-Compact TSV-Based L-C Low-Pass Filter With Stopband Up to 40 GHz for Microwave Application. IEEE Transactions on Microwave Theory and Techniques. 67(2). 738–745. 55 indexed citations
16.
Liu, Xiaoxian, Zhangming Zhu, Yang Liu, et al.. (2018). Wideband Substrate Integrated Waveguide Bandpass Filter Based on 3-D ICs. IEEE Transactions on Components Packaging and Manufacturing Technology. 9(4). 728–735. 32 indexed citations
17.
Lu, Qijun, Zhangming Zhu, Yang Liu, Xiaoxian Liu, & Xiangkun Yin. (2017). Wideband Electromagnetic Modeling of Coaxial-Annular Through-Silicon Vias. IEEE Transactions on Electromagnetic Compatibility. 60(6). 1915–1922. 17 indexed citations
18.
Yin, Xiangkun, Zhangming Zhu, Yintang Yang, & Ruixue Ding. (2015). Metal Proportion Optimization of Annular Through-Silicon via Considering Temperature and Keep-Out Zone. IEEE Transactions on Components Packaging and Manufacturing Technology. 5(8). 1093–1099. 45 indexed citations
19.
Yin, Xiangkun, Zhangming Zhu, Yintang Yang, & Ruixue Ding. (2015). Thermo-Mechanical Characterization of Single-Walled Carbon Nanotube (SWCNT)-Based Through-Silicon via (TSV) in (100) Silicon. Nanoscience and Nanotechnology Letters. 7(6). 481–485. 5 indexed citations
20.
Seah, L.K., et al.. (2007). C-band external-cavity wavelength-tunable laser based on a liquid-crystal deflector. Applied Optics. 46(23). 5866–5866. 2 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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