Kiyeong Kim
- Electrical and Electronic Engineering top 10%
- Aerospace Engineering
- Computer Networks and Communications
- Hardware and Architecture top 10%
- Electronic, Optical and Magnetic Materials
- Topics
- 3D IC and TSV technologies (25 papers)Electromagnetic Compatibility and Noise Suppression (24 papers)Electronic Packaging and Soldering Technologies (9 papers)
- Cited by
- Electrical and Electronic EngineeringHardware and ArchitectureElectronic, Optical and Magnetic Materials
- Journals
- IEEE Transactions on Electromagnetic CompatibilityIEEE Transactions on Advanced PackagingIEEE Transactions on Components Packaging and Manufacturing Technology
- Partner nations
- South KoreaUnited StatesChina
In The Last Decade
Kiyeong Kim
33 papers receiving 620 citations
Peers
Comparison fields: 5 of 26
- Electrical and Electronic Engineering 620
- Aerospace Engineering 44
- Computer Networks and Communications 39
- Hardware and Architecture 33
- Electronic, Optical and Magnetic Materials 33
Countries citing papers authored by Kiyeong Kim
This map shows the geographic impact of Kiyeong Kim's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Kiyeong Kim with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Kiyeong Kim more than expected).
Fields of papers citing papers by Kiyeong Kim
This network shows the impact of papers produced by Kiyeong Kim. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Kiyeong Kim. The network helps show where Kiyeong Kim may publish in the future.
Co-authorship network of co-authors of Kiyeong Kim
This figure shows the co-authorship network connecting the top 25 collaborators of Kiyeong Kim. A scholar is included among the top collaborators of Kiyeong Kim based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Kiyeong Kim. Kiyeong Kim is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 5 | |
| 2 | 5 | |
| 3 | 1 | |
| 4 | 21 | |
| 5 | 16 | |
| 6 | 8 | |
| 7 | 5 | |
| 8 | 4 | |
| 9 | 15 | |
| 10 | 10 | |
| 11 | Worst Case Eye Estimation Method considering Power Noise on Tx Output Driver and Channel Crosstalk & ISI in Interposer-based 2.5D Interfaces | 1 |
| 12 | 32 | |
| 13 | 45 | |
| 14 | 6 | |
| 15 | 6 | |
| 16 | 3 | |
| 17 | 134 | |
| 18 | 11 | |
| 19 | 105 | |
| 20 | 74 |
About Kiyeong Kim
Kiyeong Kim is a scholar working on Electrical and Electronic Engineering, Hardware and Architecture and Aerospace Engineering, having authored 34 papers that have together received 632 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (25 papers), Electromagnetic Compatibility and Noise Suppression (24 papers) and Electronic Packaging and Soldering Technologies (9 papers). The work is most often cited by research in Electrical and Electronic Engineering (620 citations), Hardware and Architecture (33 citations) and Electronic, Optical and Magnetic Materials (33 citations). Kiyeong Kim has collaborated with scholars based in South Korea, United States and China. Frequent co-authors include Joungho Kim, Jonghyun Cho, Jun So Pak, Kunwoo Park, Hyungdong Lee, Junho Lee, Joohee Kim, Woojin Lee, Taigon Song and Heegon Kim. Their work appears in journals such as IEEE Transactions on Electromagnetic Compatibility, IEEE Transactions on Advanced Packaging and IEEE Transactions on Components Packaging and Manufacturing Technology.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.