H. Gan

733 total citations
15 papers, 608 citations indexed

About

H. Gan is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Atomic and Molecular Physics, and Optics. According to data from OpenAlex, H. Gan has authored 15 papers receiving a total of 608 indexed citations (citations by other indexed papers that have themselves been cited), including 13 papers in Electrical and Electronic Engineering, 4 papers in Electronic, Optical and Magnetic Materials and 2 papers in Atomic and Molecular Physics, and Optics. Recurrent topics in H. Gan's work include 3D IC and TSV technologies (10 papers), Electronic Packaging and Soldering Technologies (9 papers) and Copper Interconnects and Reliability (4 papers). H. Gan is often cited by papers focused on 3D IC and TSV technologies (10 papers), Electronic Packaging and Soldering Technologies (9 papers) and Copper Interconnects and Reliability (4 papers). H. Gan collaborates with scholars based in United States, China and Italy. H. Gan's co-authors include K. N. Tu, S. L. Wright, R. Polastre, Cornelia Tsang, R. Horton, L.P. Buchwalter, Paul Andry, John Knickerbocker, E. Sprogis and K. N. Tu and has published in prestigious journals such as Journal of Applied Physics, IEEE Journal of Solid-State Circuits and JOM.

In The Last Decade

H. Gan

15 papers receiving 589 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
H. Gan United States	8	583	199	120	51	45	15	608
Min-Suk Suh South Korea	9	684 1.2×	47 0.2×	66 0.6×	57 1.1×	81 1.8×	20	709
Kwang-Yoo Byun South Korea	8	711 1.2×	64 0.3×	38 0.3×	84 1.6×	78 1.7×	18	736
M.K. Iyer Singapore	12	470 0.8×	46 0.2×	90 0.8×	77 1.5×	31 0.7×	68	560
Yu-Min Lin Taiwan	15	621 1.1×	76 0.4×	53 0.4×	55 1.1×	61 1.4×	68	649
S. Kadomura Japan	11	499 0.9×	170 0.9×	29 0.2×	79 1.5×	34 0.8×	43	542
Kuan-Hsun Lu United States	6	476 0.8×	104 0.5×	79 0.7×	87 1.7×	43 1.0×	9	481
Lixi Wan China	12	494 0.8×	65 0.3×	55 0.5×	119 2.3×	27 0.6×	137	612
I. Turlik United States	15	381 0.7×	57 0.3×	142 1.2×	52 1.0×	30 0.7×	35	464
L. Baud France	14	370 0.6×	42 0.2×	115 1.0×	61 1.2×	145 3.2×	28	499
P. Coudrain France	12	423 0.7×	62 0.3×	74 0.6×	69 1.4×	11 0.2×	46	487

Countries citing papers authored by H. Gan

Since Specialization

Citations

This map shows the geographic impact of H. Gan's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by H. Gan with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites H. Gan more than expected).

Fields of papers citing papers by H. Gan

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by H. Gan. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by H. Gan. The network helps show where H. Gan may publish in the future.

Co-authorship network of co-authors of H. Gan

This figure shows the co-authorship network connecting the top 25 collaborators of H. Gan. A scholar is included among the top collaborators of H. Gan based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with H. Gan. H. Gan is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

Sort: Min cites: Since: Top N: Style:

15 of 15 papers shown

1.

Gan, H., et al.. (2021). Simulation of gas sensing with a triboelectric nanogenerator. Beilstein Journal of Nanotechnology. 12. 507–516. 2 indexed citations

2.

Wang, Junhao, et al.. (2021). Research on Transmission Characteristics of Conical-TSV for Millimeter-wave Band in 3D Integration. 428–431. 3 indexed citations

3.

Gan, H., et al.. (2012). Polymer Blends of Poly(Vinyl Chloride) and Lower-Melting Point Polyamide-6 Compatibilized by Epoxy. Advanced materials research. 550-553. 882–890. 1 indexed citations

4.

Miao, Min, Yufeng Jin, H. Gan, et al.. (2012). Investigation of a unified LTCC-based micromachining and packaging platform for high density/multifunctional microsystem integration. 377–384. 4 indexed citations

5.

Gan, H., et al.. (2010). A micro in-situ Pirani vacuum gauge for microsystem package applications. 125–129. 1 indexed citations

6.

Wright, S. L., R. Polastre, H. Gan, et al.. (2006). Characterization of Micro-Bump C4 Interconnects for Si-Carrier SOP Applications. 633–640. 73 indexed citations

7.

Knickerbocker, John, C.S. Patel, Paul Andry, et al.. (2006). 3-D Silicon Integration and Silicon Packaging Technology Using Silicon Through-Vias. IEEE Journal of Solid-State Circuits. 41(8). 1718–1725. 151 indexed citations

8.

Gan, H., S. L. Wright, R. Polastre, et al.. (2006). Pb-free Micro-joints (50 um pitch) for the Next Generation Micro-systems: the Fabrication, Assembly and Characterization. 1210–1215. 36 indexed citations

9.

Knickerbocker, John, Paul Andry, L.P. Buchwalter, et al.. (2006). System-on-Package (SOP) Technology, Characterization and Applications. 2005. 415–421. 20 indexed citations

10.

Gan, H. & K. N. Tu. (2005). Polarity effect of electromigration on kinetics of intermetallic compound formation in Pb-free solder V-groove samples. Journal of Applied Physics. 97(6). 220 indexed citations

11.

Ren, Fei, Jae-Woong Nah, H. Gan, et al.. (2005). Effect of Electromigration on Mechanical Behavior of Solder Joints. MRS Proceedings. 863. 7 indexed citations

12.

Gan, H., et al.. (2004). Unique phase changes induced by electromigration (EM) in solder joints. 71–76. 4 indexed citations

13.

Choi, Chel‐Jong, et al.. (2003). Formation of nickel disilicide using nickel implantation and rapid thermal annealing. Journal of Electronic Materials. 32(10). 1072–1078. 4 indexed citations

14.

Gan, H. & K. N. Tu. (2003). Effect of electromigration on intermetallic compound formation in Pb-free solder-Cu interfaces. 1206–1212. 26 indexed citations

15.

Gan, H., Woon‐Seop Choi, Ge Xu, & K. N. Tu. (2002). Electromigration in solder joints and solder lines. JOM. 54(6). 34–37. 56 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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