C.S. Patel
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- 3D IC and TSV technologies 25
- Electronic Packaging and Soldering Technologies 17
- Semiconductor Lasers and Optical Devices 6
- Semiconductor materials and devices 6
- Integrated Circuits and Semiconductor Failure Analysis 4
- Advanced Wireless Communication Techniques 4
- VLSI and FPGA Design Techniques 3
- Hardware and Architecture top 5%
- Automotive Engineering top 5%
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- Semiconductor materials and interfaces 3
- Co-authors
- Thomas G. PrattG.L. StüberCornelia TsangJohn KnickerbockerR. HortonPaul AndryS. L. WrightR. Polastre
- Cited by
- Electrical and Electronic EngineeringHardware and ArchitectureComputer Networks and Communications
- Journals
- IBM Journal of Research and Development (5 papers)IEEE Transactions on Communications (2 papers)IEEE Transactions on Electronics Packaging Manufacturing (1 paper)
- Partner nations
- United StatesJapanChina
In The Last Decade
C.S. Patel
33 papers receiving 1.9k citations
Hit Papers
Peers
Comparison fields: 5 of 57
- Electrical and Electronic Engineering 1.9k
- Hardware and Architecture 142
- Computer Networks and Communications 460
- Automotive Engineering 191
- Electronic, Optical and Magnetic Materials 133
Countries citing papers authored by C.S. Patel
This map shows the geographic impact of C.S. Patel's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by C.S. Patel with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites C.S. Patel more than expected).
Fields of papers citing papers by C.S. Patel
This network shows the impact of papers produced by C.S. Patel. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by C.S. Patel. The network helps show where C.S. Patel may publish in the future.
Co-authorship network
The 25 scholars most cited alongside C.S. Patel, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2008 | 126 | |
| 2 | 2008 | 27 | |
| 3 | 2008 | 4 | |
| 4 | 2008 | 183 | |
| 5 | Three-dimensional silicon integrationbreakdown → | 2008 | 396 |
| 6 | 2006 | 18 | |
| 7 | 2006 | 15 | |
| 8 | 2006 | 13 | |
| 9 | 2006 | 151 | |
| 10 | 2006 | 22 | |
| 11 | 2005 | 199 | |
| 12 | 2005 | 29 | |
| 13 | 2005 | 167 | |
| 14 | 2005 | 2 | |
| 15 | 2003 | 52 | |
| 16 | 2003 | 3 | |
| 17 | 2002 | 5 | |
| 18 | 2002 | 5 | |
| 19 | 2001 | 8 | |
| 20 | 1997 | 69 |
About C.S. Patel
C.S. Patel is a scholar working on Electrical and Electronic Engineering, Hardware and Architecture and Computer Networks and Communications, having authored 33 papers that have together received 2.0k indexed citations. Recurring topics across this work include 3D IC and TSV technologies (25 papers), Electronic Packaging and Soldering Technologies (17 papers), Semiconductor Lasers and Optical Devices (6 papers), Semiconductor materials and devices (6 papers), Integrated Circuits and Semiconductor Failure Analysis (4 papers), Advanced Wireless Communication Techniques (4 papers), VLSI and FPGA Design Techniques (3 papers) and Semiconductor materials and interfaces (3 papers). The work is most often cited by research in Electrical and Electronic Engineering (1.9k citations), Hardware and Architecture (142 citations) and Computer Networks and Communications (460 citations). C.S. Patel has collaborated with scholars based in United States, Japan and China. Frequent co-authors include Thomas G. Pratt, G.L. Stüber, Cornelia Tsang, John Knickerbocker, R. Horton, Paul Andry, S. L. Wright, R. Polastre, Bucknell C. Webb and B. Dang. Their work appears in journals such as IBM Journal of Research and Development, IEEE Transactions on Communications, IEEE Transactions on Electronics Packaging Manufacturing, IEEE Journal of Solid-State Circuits and Journal of Microelectromechanical Systems.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.