Sayuri Kohara
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- 3D IC and TSV technologies 44
- Electronic Packaging and Soldering Technologies 41
- Electromagnetic Compatibility and Noise Suppression 4
- Semiconductor materials and devices 4
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- Additive Manufacturing and 3D Printing Technologies 10
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- Copper Interconnects and Reliability 5
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- VLSI and Analog Circuit Testing 4
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- Advanced Surface Polishing Techniques 7
- Co-authors
- Yasumitsu OriiKeishi OkamotoKazushige ToriyamaHiroyuki MoriK. MatsumotoKatsuyuki SakumaKeisuke UenishiPaul Andry
- Journals
- Journal of Electronic Packaging (1 paper)Journal of Micromechanics and Microengineering (1 paper)Journal of The Japan Institute of Electronics Packaging (1 paper)
- Partner nations
- JapanUnited StatesCanada
In The Last Decade
Sayuri Kohara
46 papers receiving 293 citations
Peers
Comparison fields: 5 of 28
- Electrical and Electronic Engineering 279
- Automotive Engineering 51
- Nuclear Energy and Engineering 1
- Electronic, Optical and Magnetic Materials 31
- Hardware and Architecture 10
Countries citing papers authored by Sayuri Kohara
This map shows the geographic impact of Sayuri Kohara's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Sayuri Kohara with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Sayuri Kohara more than expected).
Fields of papers citing papers by Sayuri Kohara
This network shows the impact of papers produced by Sayuri Kohara. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Sayuri Kohara. The network helps show where Sayuri Kohara may publish in the future.
Co-authorship network
The 25 scholars most cited alongside Sayuri Kohara, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2023 | 2 | |
| 2 | 2022 | 9 | |
| 3 | 2021 | 3 | |
| 4 | Electrical Characterization of Solder Joint by Plating-free Bumping with Cu nanopaste and Injection Molded Solder Method | 2020 | 2 |
| 5 | 2019 | 2 | |
| 6 | 2016 | 3 | |
| 7 | 2015 | 2 | |
| 8 | 2015 | 5 | |
| 9 | 2015 | 17 | |
| 10 | 2015 | 8 | |
| 11 | 2014 | 2 | |
| 12 | Scaling challenges of packaging in the Era of Big Data | 2013 | 0 |
| 13 | 2012 | 19 | |
| 14 | 2012 | 2 | |
| 15 | 2012 | 4 | |
| 16 | 2012 | 6 | |
| 17 | 2011 | 5 | |
| 18 | 2011 | 1 | |
| 19 | 2010 | 53 | |
| 20 | 1956 | 8 |
About Sayuri Kohara
Sayuri Kohara is a scholar working on Automotive Engineering, Electrical and Electronic Engineering, Hardware and Architecture, Electronic, Optical and Magnetic Materials and Biomedical Engineering, having authored 52 papers that have together received 310 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (44 papers), Electronic Packaging and Soldering Technologies (41 papers), Additive Manufacturing and 3D Printing Technologies (10 papers), Advanced Surface Polishing Techniques (7 papers), Copper Interconnects and Reliability (5 papers), VLSI and Analog Circuit Testing (4 papers), Electromagnetic Compatibility and Noise Suppression (4 papers) and Semiconductor materials and devices (4 papers). The work is most often cited by research in Electrical and Electronic Engineering (279 citations), Automotive Engineering (51 citations), Nuclear Energy and Engineering (1 citation), Electronic, Optical and Magnetic Materials (31 citations) and Hardware and Architecture (10 citations). Sayuri Kohara has collaborated with scholars based in Japan, United States and Canada. Frequent co-authors include Yasumitsu Orii, Keishi Okamoto, Kazushige Toriyama, Hiroyuki Mori, K. Matsumoto, Katsuyuki Sakuma, Keisuke Uenishi, Paul Andry, John Knickerbocker and Cornelia Tsang. Their work appears in journals such as Journal of Electronic Packaging, Journal of Micromechanics and Microengineering, Journal of The Japan Institute of Electronics Packaging, 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) and Acta Metallurgica.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.