Bucknell C. Webb
Impact in
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Electromagnetic Compatibility and Noise Suppression
- Integrated Circuits and Semiconductor Failure Analysis
- Automotive Engineering top 5%
- Additive Manufacturing and 3D Printing Technologies
Papers in
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- Analytical Chemistry and Sensors 4
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- Magnetic Properties and Applications 10
- Co-authors
- Paul AndryCornelia TsangS. L. WrightB. DangJohn KnickerbockerE. SprogisR. PolastreR. Horton
- Journals
- IEEE Transactions on Magnetics (8 papers)IBM Journal of Research and Development (5 papers)Journal of Applied Physics (5 papers)IEEE Journal of Solid-State Circuits (1 paper)Solid State Communications (1 paper)
- Partner nations
- United StatesJapanUnited Kingdom
In The Last Decade
Bucknell C. Webb
49 papers receiving 1.8k citations
Hit Papers
Peers
Comparison fields: 5 of 62
- Electrical and Electronic Engineering 1.7k
- Automotive Engineering 262
- Hardware and Architecture 99
- Electronic, Optical and Magnetic Materials 258
- Atomic and Molecular Physics, and Optics 293
Countries citing papers authored by Bucknell C. Webb
This map shows the geographic impact of Bucknell C. Webb's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Bucknell C. Webb with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Bucknell C. Webb more than expected).
Fields of papers citing papers by Bucknell C. Webb
This network shows the impact of papers produced by Bucknell C. Webb. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Bucknell C. Webb. The network helps show where Bucknell C. Webb may publish in the future.
Co-authorship network
The 25 scholars most cited alongside Bucknell C. Webb, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2015 | 1 | |
| 2 | 2014 | 10 | |
| 3 | 2013 | 9 | |
| 4 | 2012 | 141 | |
| 5 | 2012 | 1 | |
| 6 | 2011 | 4 | |
| 7 | 2011 | 8 | |
| 8 | 2008 | 126 | |
| 9 | 2008 | 183 | |
| 10 | 2007 | 70 | |
| 11 | 2005 | 199 | |
| 12 | 1992 | 4 | |
| 13 | 1991 | 36 | |
| 14 | 1991 | 4 | |
| 15 | 1990 | 5 | |
| 16 | 1990 | 16 | |
| 17 | 1988 | 5 | |
| 18 | 1986 | 3 | |
| 19 | 1976 | 22 | |
| 20 | 1975 | 5 |
About Bucknell C. Webb
Bucknell C. Webb is a scholar working on Bioengineering, Electronic, Optical and Magnetic Materials, Electrical and Electronic Engineering, Condensed Matter Physics and Atomic and Molecular Physics, and Optics, having authored 52 papers that have together received 1.9k indexed citations. Recurring topics across this work include 3D IC and TSV technologies (20 papers), Electronic Packaging and Soldering Technologies (14 papers), Semiconductor materials and devices (12 papers), Magnetic properties of thin films (11 papers), Magnetic Properties and Applications (10 papers), Advanced DC-DC Converters (4 papers), Analytical Chemistry and Sensors (4 papers) and Physics of Superconductivity and Magnetism (3 papers). The work is most often cited by research in Electrical and Electronic Engineering (1.7k citations), Automotive Engineering (262 citations), Hardware and Architecture (99 citations), Electronic, Optical and Magnetic Materials (258 citations) and Atomic and Molecular Physics, and Optics (293 citations). Bucknell C. Webb has collaborated with scholars based in United States, Japan and United Kingdom. Frequent co-authors include Paul Andry, Cornelia Tsang, S. L. Wright, B. Dang, John Knickerbocker, E. Sprogis, R. Polastre, R. Horton, C.S. Patel and Katsuyuki Sakuma. Their work appears in journals such as IEEE Transactions on Magnetics, IBM Journal of Research and Development, Journal of Applied Physics, IEEE Journal of Solid-State Circuits and Solid State Communications.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.