Nokibul Islam
- Electrical and Electronic Engineering top 10%
- Civil and Structural Engineering top 10%
- Mechanical Engineering
- Mechanics of Materials
- Materials Chemistry
- Co-authors
- Jeff SuhlingPradeep LallRobert DarveauxChandan BhatJay LeeJohn L. EvansJesse GallowayJeffrey C. Suhling
- Topics
- Electronic Packaging and Soldering Technologies (29 papers)3D IC and TSV technologies (18 papers)Integrated Circuits and Semiconductor Failure Analysis (9 papers)
- Cited by
- Electrical and Electronic EngineeringStatistics, Probability and UncertaintyHardware and Architecture
- Journals
- Microelectronics ReliabilityIEEE Transactions on Components and Packaging TechnologiesJournal of Electronic Packaging
- Partner nations
- United StatesChinaHungary
In The Last Decade
Nokibul Islam
28 papers receiving 387 citations
Peers
Comparison fields: 5 of 25
- Electrical and Electronic Engineering 349
- Civil and Structural Engineering 85
- Mechanical Engineering 81
- Mechanics of Materials 73
- Materials Chemistry 34
Countries citing papers authored by Nokibul Islam
This map shows the geographic impact of Nokibul Islam's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Nokibul Islam with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Nokibul Islam more than expected).
Fields of papers citing papers by Nokibul Islam
This network shows the impact of papers produced by Nokibul Islam. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Nokibul Islam. The network helps show where Nokibul Islam may publish in the future.
Co-authorship network of co-authors of Nokibul Islam
This figure shows the co-authorship network connecting the top 25 collaborators of Nokibul Islam. A scholar is included among the top collaborators of Nokibul Islam based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Nokibul Islam. Nokibul Islam is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 0 | |
| 2 | 0 | |
| 3 | 10 | |
| 4 | 6 | |
| 5 | 11 | |
| 6 | 7 | |
| 7 | 3 | |
| 8 | 1 | |
| 9 | 3 | |
| 10 | 9 | |
| 11 | 10 | |
| 12 | 5 | |
| 13 | 49 | |
| 14 | 20 | |
| 15 | 15 | |
| 16 | 58 | |
| 17 | 26 | |
| 18 | 0 | |
| 19 | 2 | |
| 20 | Reliability of small BGAs in the automotive environment | 4 |
About Nokibul Islam
Nokibul Islam is a scholar working on Electrical and Electronic Engineering, General Materials Science and Automotive Engineering, having authored 31 papers that have together received 405 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (29 papers), 3D IC and TSV technologies (18 papers) and Integrated Circuits and Semiconductor Failure Analysis (9 papers). The work is most often cited by research in Electrical and Electronic Engineering (349 citations), Statistics, Probability and Uncertainty (30 citations) and Hardware and Architecture (28 citations). Nokibul Islam has collaborated with scholars based in United States, China and Hungary. Frequent co-authors include Jeff Suhling, Pradeep Lall, Robert Darveaux, Chandan Bhat, Jay Lee, John L. Evans, Jesse Galloway, Jeffrey C. Suhling, Seung Wook Yoon and Tony Chen. Their work appears in journals such as Microelectronics Reliability, IEEE Transactions on Components and Packaging Technologies and Journal of Electronic Packaging.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.