Pradeep Lall
Impact in
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Integrated Circuits and Semiconductor Failure Analysis
- Mechanical Engineering top 0.5%
- Aluminum Alloys Composites Properties
- Intermetallics and Advanced Alloy Properties
- Advanced Welding Techniques Analysis
Papers in
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- Electronic Packaging and Soldering Technologies 521
- 3D IC and TSV technologies 199
- Integrated Circuits and Semiconductor Failure Analysis 133
- Nanomaterials and Printing Technologies 54
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- Additive Manufacturing and 3D Printing Technologies 73
- Co-authors
- Jeffrey C. SuhlingJeff SuhlingMichael J. BozackZijie CaiDhananjay PanchagadeKai GoebelMohammad MotalabSameep Gupte
- Journals
- Journal of Electronic Packaging (26 papers)IEEE Transactions on Components and Packaging Technologies (15 papers)Microelectronics Reliability (8 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (5 papers)IEEE Transactions on Electronics Packaging Manufacturing (4 papers)
- Partner nations
- United StatesSingaporeUnited Kingdom
In The Last Decade
Pradeep Lall
652 papers receiving 7.5k citations
Peers
Comparison fields: 5 of 87
- Electrical and Electronic Engineering 6.7k
- Mechanical Engineering 3.0k
- Mechanics of Materials 1.5k
- Aerospace Engineering 1.5k
- General Materials Science 151
Countries citing papers authored by Pradeep Lall
This map shows the geographic impact of Pradeep Lall's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Pradeep Lall with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Pradeep Lall more than expected).
Fields of papers citing papers by Pradeep Lall
This network shows the impact of papers produced by Pradeep Lall. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Pradeep Lall. The network helps show where Pradeep Lall may publish in the future.
Co-authors
The 25 scholars most cited alongside Pradeep Lall, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2025 | 0 | |
| 2 | 2025 | 0 | |
| 3 | 2024 | 0 | |
| 4 | 2024 | 0 | |
| 5 | 2024 | 0 | |
| 6 | 2024 | 0 | |
| 7 | 2024 | 1 | |
| 8 | 2024 | 0 | |
| 9 | 2024 | 2 | |
| 10 | 2024 | 2 | |
| 11 | 2023 | 0 | |
| 12 | 2023 | 2 | |
| 13 | 2023 | 0 | |
| 14 | 2023 | 1 | |
| 15 | 2023 | 0 | |
| 16 | 2022 | 5 | |
| 17 | 2021 | 5 | |
| 18 | 2014 | 8 | |
| 19 | 2012 | 2 | |
| 20 | 1970 | 1 |
About Pradeep Lall
Pradeep Lall is a scholar working on Electrical and Electronic Engineering, Automotive Engineering, Mechanics of Materials, Mechanical Engineering and Industrial and Manufacturing Engineering, having authored 718 papers that have together received 7.7k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (521 papers), 3D IC and TSV technologies (199 papers), Integrated Circuits and Semiconductor Failure Analysis (133 papers), Aluminum Alloy Microstructure Properties (92 papers), Aluminum Alloys Composites Properties (88 papers), Additive Manufacturing and 3D Printing Technologies (73 papers), Advanced Sensor and Energy Harvesting Materials (57 papers) and Nanomaterials and Printing Technologies (54 papers). The work is most often cited by research in Electrical and Electronic Engineering (6.7k citations), Mechanical Engineering (3.0k citations), Mechanics of Materials (1.5k citations), Aerospace Engineering (1.5k citations) and General Materials Science (151 citations). Pradeep Lall has collaborated with scholars based in United States, Singapore and United Kingdom. Frequent co-authors include Jeffrey C. Suhling, Jeff Suhling, Michael J. Bozack, Zijie Cai, Dhananjay Panchagade, Kai Goebel, Mohammad Motalab, Sameep Gupte, Sudan Ahmed and Ryan Lowe. Their work appears in journals such as Journal of Electronic Packaging, IEEE Transactions on Components and Packaging Technologies, Microelectronics Reliability, IEEE Transactions on Components Packaging and Manufacturing Technology and IEEE Transactions on Electronics Packaging Manufacturing.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.