Wayne Johnson

9.8k citations

360 papers · 7.8k indexed · 2 hit papers · h-index 41

Impact in

Ceramics and Composites top 2%
Aerospace Engineering top 0.5%
- Aerospace and Aviation Technology
- Aeroelasticity and Vibration Control

Papers in ⓘ

Electrical and Electronic Engineering 168
- Electronic Packaging and Soldering Technologies 94
- 3D IC and TSV technologies 69
- Silicon Carbide Semiconductor Technologies 43
Aerospace Engineering 122
- Aerospace and Aviation Technology 51
- Aeroelasticity and Vibration Control 40
- Aerospace Engineering and Control Systems 37

Co-authors: Jeff B. Casady (12 shared papers)John L. Evans (14 shared papers)Jeffrey C. Suhling (20 shared papers)J. R. Thompson (2 shared papers)Peter Jacobsen (1 shared paper)R.C. Jaeger (19 shared papers)Michael C. Hamilton (26 shared papers)Christopher J. Silva (5 shared papers)
Journals: IEEE Transactions on Components Packaging and Manufacturing Technology (17 papers)Journal of the American Helicopter Society (16 papers)IEEE Transactions on Electronics Packaging Manufacturing (16 papers)Journal of Aircraft (7 papers)Journal of Electronic Packaging (5 papers)
Partner nations: United States United Kingdom Taiwan

In The Last Decade

Wayne Johnson

337 papers receiving 7.2k citations

Hit Papers

align trajectories log scale

The Changing Automotive Environment: High-Temperature Electronics 2004 · 687 citations

What are hit papers?

Hit papers significantly outperform the citation benchmark for their cohort. A paper qualifies if any of the following hold:

it has ≥500 total citations;
it reaches ≥1.5× the top-1% citation threshold for papers in the same subfield and year (the threshold is the minimum needed to enter the top 1%, not the average within it);
it reaches the top citation threshold in at least one of its specific research topics.

2004 IEEE Transactions on Electronics Packaging Manufacturing
1996 Solid-State Electronics

Peers

Countries citing papers authored by Wayne Johnson

Since Specialization

Citations

This map shows the geographic impact of Wayne Johnson's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Wayne Johnson with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Wayne Johnson more than expected).

Fields of papers citing papers by Wayne Johnson

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Wayne Johnson. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Wayne Johnson. The network helps show where Wayne Johnson may publish in the future.

Co-authors

The 25 scholars most cited alongside Wayne Johnson, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with Wayne Johnson Line = papers co-authored together Wayne Johnson links everyone, so they are left out of the graph.

All Works

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20 of 20 papers shown

Showing the 20 most-cited of 360 papers — load more, or switch the sort, to bring in the rest.

#	Work
1	Status of silicon carbide (SiC) as a wide-bandgap semiconductor for high-temperature applications: A review Solid-State Electronics ·Jeff B. Casady, Wayne Johnson Hit paper breakdown →	1996	1189
2	The Changing Automotive Environment: High-Temperature Electronics IEEE Transactions on Electronics Packaging Manufacturing ·Wayne Johnson, John L. Evans, Peter Jacobsen, J. R. Thompson, M. Christopher Hit paper breakdown →	2004	687
3	VTOL Urban Air Mobility Concept Vehicles for Technology Development 2018 Aviation Technology, Integration, and Operations Conference ·Christopher J. Silva, Wayne Johnson, Eduardo Solis, Michael D. Patterson, Kevin Antcliff	2018	243
4	Piezoresistive Stress Sensors for Structural Analysis of Electronic Packages Journal of Electronic Packaging ·D. Bittle, Jeffrey C. Suhling, R.E. Beaty, R.C. Jaeger, Wayne Johnson	1991	156
5	Mechanism of oxidisation of polyacrylonitrile fibres Nature ·W. Watt, Wayne Johnson	1975	152
6	Reliability of Ag Sintering for Power Semiconductor Die Attach in High-Temperature Applications IEEE Transactions on Power Electronics ·Fang Yu, Jinzi Cui, Zhangming Zhou, Kun Fang, Wayne Johnson, Michael C. Hamilton	2016	124
7	CAMRAD - A COMPREHENSIVE ANALYTICAL MODEL OF ROTORCRAFT AERODYNAMICS AND DYNAMICS Wayne Johnson	1994	121
8	Reduction of lead free solder aging effects using doped SAC alloys Zijie Cai, Yifei Zhang, Jeffrey C. Suhling, Pradeep Lall, Wayne Johnson, Michael J. Bozack	2010	113
9	Models for reliability prediction of fine-pitch BGAs and CSPs in shock and drop-impact Pradeep Lall, Dhananjay Panchagade, Yueli Liu, Wayne Johnson, Jeffrey C. Suhling	2004	104
10	Power Device Packaging Technologies for Extreme Environments IEEE Transactions on Electronics Packaging Manufacturing ·Wayne Johnson, Cai Wang, Yi Liu, James D. Scofield	2007	93
11	Volunteer Dynamics of Older Americans The Journals of Gerontology Series B ·Barbara A. Butrica, Wayne Johnson, Sheila R. Zedlewski	2009	91
12	Evaluation of piezoresistive coefficient variation in silicon stress sensors using a four-point bending test fixture IEEE Transactions on Components Hybrids and Manufacturing Technology ·R.E. Beaty, R.C. Jaeger, Jeffrey C. Suhling, Wayne Johnson, Ross Butler	1992	90
13	NASA Heavy Lift Rotorcraft Systems Investigation SAE technical papers on CD-ROM/SAE technical paper series ·Wayne Johnson, Gloria K. Yamauchi, Michael E. Watts	2005	87
14	Concept Vehicles for VTOL Air Taxi Operations NASA STI Repository (National Aeronautics and Space Administration) ·Wayne Johnson, Christopher J. Silva, Eduardo Solis	2018	86
15	Investigation into the application of low melting temperature alloys as wet thermal interface materials International Journal of Heat and Mass Transfer ·Chandan K. Roy, Sushil H. Bhavnani, Michael C. Hamilton, Wayne Johnson, Jonathan Loc Nguyen, Roy W. Knight, Daniel K. Harris	2015	85
16	Thermo-physical properties of diamond nanofluids: A review International Journal of Heat and Mass Transfer ·Farzin Mashali, Ethan Languri, J. L. Davidson, D.V. Kerns, Wayne Johnson, Kashif Nawaz, Glenn Cunningham	2018	77
17	Packaging Technology for Electronic Applications in Harsh High-Temperature Environments IEEE Transactions on Industrial Electronics ·Ping Hagler, Phillip Henson, Wayne Johnson	2010	76
18	The Prediction of Transonic Flows on an Advancing Rotor Journal of the American Helicopter Society ·Chee Tung, F. X. Caradonna, Wayne Johnson	1986	72
19	The structure of silicon-selenium glasses Journal of Non-Crystalline Solids ·Wayne Johnson, David L. Price, S. Susman, M. Arai, T. I. Morrison, G. K. Shenoy	1986	65
20	The design of the Canyon Flyer, an airplane for Mars exploration 38th Aerospace Sciences Meeting and Exhibit ·Stephen L. Smith, Andrew Hahn, Wayne Johnson, David Kinney, Julie Pollitt, James Reuther	2000	58

About Wayne Johnson

Wayne Johnson is a scholar working on Electrical and Electronic Engineering, Aerospace Engineering, Mechanical Engineering, Computational Mechanics and Materials Chemistry, having authored 360 papers that have together received 7.8k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (94 papers), 3D IC and TSV technologies (69 papers), Aerospace and Aviation Technology (51 papers), Silicon Carbide Semiconductor Technologies (43 papers), Aeroelasticity and Vibration Control (40 papers), Aerospace Engineering and Control Systems (37 papers), Computational Fluid Dynamics and Aerodynamics (33 papers) and Advanced Aircraft Design and Technologies (24 papers). The work is most often cited by research in Ceramics and Composites (420 citations), Aerospace Engineering (1.8k citations), Electrical and Electronic Engineering (4.0k citations), Computational Mechanics (983 citations) and Mechanical Engineering (1.5k citations). Wayne Johnson has collaborated with scholars based in United States, United Kingdom and Taiwan. Frequent co-authors include Jeff B. Casady, John L. Evans, Jeffrey C. Suhling, J. R. Thompson, Peter Jacobsen, R.C. Jaeger, Michael C. Hamilton, Christopher J. Silva, Pradeep Lall and Eduardo Solis. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology, Journal of the American Helicopter Society, IEEE Transactions on Electronics Packaging Manufacturing, Journal of Aircraft and Journal of Electronic Packaging.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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