Sameep Gupte
- Electrical and Electronic Engineering top 10%
- Civil and Structural Engineering top 10%
- Mechanics of Materials top 10%
- Industrial and Manufacturing Engineering top 5%
- Mechanical Engineering
- Co-authors
- Pradeep LallJeff SuhlingJeffrey C. SuhlingDhananjay PanchagadeRobert DarveauxPrashant Gupta
- Topics
- Electronic Packaging and Soldering Technologies (13 papers)Integrated Circuits and Semiconductor Failure Analysis (7 papers)Electrostatic Discharge in Electronics (6 papers)
- Cited by
- Electrical and Electronic EngineeringIndustrial and Manufacturing EngineeringCivil and Structural Engineering
- Journals
- IEEE Transactions on Components and Packaging TechnologiesIEEE Transactions on Electronics Packaging Manufacturing
- Partner nations
- United States
In The Last Decade
Sameep Gupte
14 papers receiving 481 citations
Peers
Comparison fields: 5 of 30
- Electrical and Electronic Engineering 425
- Civil and Structural Engineering 118
- Mechanics of Materials 112
- Industrial and Manufacturing Engineering 68
- Mechanical Engineering 64
Countries citing papers authored by Sameep Gupte
This map shows the geographic impact of Sameep Gupte's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Sameep Gupte with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Sameep Gupte more than expected).
Fields of papers citing papers by Sameep Gupte
This network shows the impact of papers produced by Sameep Gupte. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Sameep Gupte. The network helps show where Sameep Gupte may publish in the future.
Co-authorship network of co-authors of Sameep Gupte
This figure shows the co-authorship network connecting the top 25 collaborators of Sameep Gupte. A scholar is included among the top collaborators of Sameep Gupte based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Sameep Gupte. Sameep Gupte is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 6 | |
| 2 | 8 | |
| 3 | 57 | |
| 4 | 59 | |
| 5 | 14 | |
| 6 | 64 | |
| 7 | 92 | |
| 8 | 1 | |
| 9 | 1 | |
| 10 | 50 | |
| 11 | 73 | |
| 12 | 69 | |
| 13 | 1 | |
| 14 | 2 |
About Sameep Gupte
Sameep Gupte is a scholar working on Mechanics of Materials, Electrical and Electronic Engineering and Industrial and Manufacturing Engineering, having authored 14 papers that have together received 497 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (13 papers), Integrated Circuits and Semiconductor Failure Analysis (7 papers) and Electrostatic Discharge in Electronics (6 papers). The work is most often cited by research in Electrical and Electronic Engineering (425 citations), Industrial and Manufacturing Engineering (68 citations) and Civil and Structural Engineering (118 citations). Sameep Gupte has collaborated with scholars based in United States. Frequent co-authors include Pradeep Lall, Jeff Suhling, Jeffrey C. Suhling, Dhananjay Panchagade, Robert Darveaux and Prashant Gupta. Their work appears in journals such as IEEE Transactions on Components and Packaging Technologies and IEEE Transactions on Electronics Packaging Manufacturing.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.