A. Syed

804 total citations
18 papers, 620 citations indexed

About

A. Syed is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Aerospace Engineering. According to data from OpenAlex, A. Syed has authored 18 papers receiving a total of 620 indexed citations (citations by other indexed papers that have themselves been cited), including 14 papers in Electrical and Electronic Engineering, 6 papers in Mechanical Engineering and 5 papers in Aerospace Engineering. Recurrent topics in A. Syed's work include Electronic Packaging and Soldering Technologies (14 papers), 3D IC and TSV technologies (9 papers) and Aluminum Alloy Microstructure Properties (5 papers). A. Syed is often cited by papers focused on Electronic Packaging and Soldering Technologies (14 papers), 3D IC and TSV technologies (9 papers) and Aluminum Alloy Microstructure Properties (5 papers). A. Syed collaborates with scholars based in United States, Germany and Finland. A. Syed's co-authors include Seung Mo Kim, Wei Lin, J.K. Kivilahti, Toni T. Mattila, Jin‐Young Kim, Robert Darveaux, Chang Woo Kim, Jesse Galloway, Sungsu Park and Jae-Dong Kim and has published in prestigious journals such as Engineering Structures, Journal of Composites for Construction and IEEE Transactions on Components and Packaging Technologies.

In The Last Decade

A. Syed

18 papers receiving 589 citations

Peers

Countries citing papers authored by A. Syed

Since Specialization

Citations

This map shows the geographic impact of A. Syed's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by A. Syed with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites A. Syed more than expected).

Fields of papers citing papers by A. Syed

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by A. Syed. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by A. Syed. The network helps show where A. Syed may publish in the future.

Co-authorship network of co-authors of A. Syed

This figure shows the co-authorship network connecting the top 25 collaborators of A. Syed. A scholar is included among the top collaborators of A. Syed based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with A. Syed. A. Syed is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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18 of 18 papers shown

#	Work	Indexed citations
1	Analysis of slender FRP-reinforced concrete columns subjected to unequal end moments 2025 ·Engineering Structures ·A. Syed, (unknown)	1
2	Simplified Second-Order Analysis of Slender FRP-Reinforced Concrete Columns Using the Nominal Curvature Method 2025 ·Journal of Composites for Construction ·A. Syed, (unknown)	1
3	Effect of Slenderness on the Design of FRP reinforced Concrete Columns 2023 ·Report ·A. Syed, (unknown)	1
4	Slenderness limit for GFRP reinforced concrete columns based on axial force ratio 2023 ·Engineering Structures ·A. Syed, (unknown)	6
5	Advances in WLCSP Technologies to Enable Cost-Reduction 2010 ·Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) ·(unknown), (unknown), (unknown), A. Syed	2
6	Effect of joint size and pad metallization on solder mechanical properties 2008 ·Robert Darveaux, (unknown), (unknown), (unknown), A. Syed, Chang Woo Kim, (unknown), (unknown)	15
7	Reliability of SnAgCu Interconnections with Minor Additions of Ni or Bi under Mechanical Shock Loading at Different Temperatures 2007 ·Toni T. Mattila, (unknown), A. Syed, J.K. Kivilahti	19
8	A Methodology for Drop Performance Modeling and Application for Design Optimization of Chip-Scale Packages 2007 ·IEEE Transactions on Electronics Packaging Manufacturing ·A. Syed, Seung Mo Kim, Wei Lin, (unknown), (unknown), (unknown)	41
9	Updated Life Prediction Models for Solder Joints with Removal of Modeling Assumptions and Effect of Constitutive Equations 2006 ·A. Syed	53
10	Mechanical, thermal, and electrical analysis of a compliant interconnect 2005 ·IEEE Transactions on Components and Packaging Technologies ·Jesse Galloway, A. Syed, (unknown), Jin‐Young Kim, (unknown), (unknown), Seung Mo Kim, (unknown), (unknown), (unknown)	19
11	A methodology for drop performance prediction and application for design optimization of chip scale packages 2005 ·A. Syed, Seung Mo Kim, Wei Lin, (unknown), (unknown), (unknown), (unknown)	27
12	Accumulated creep strain and energy density based thermal fatigue life prediction models for SnAgCu solder joints 2004 ·A. Syed	271
13	Board level reliability study on three-dimensional thin stacked package 2004 ·Jin‐Young Kim, (unknown), (unknown), (unknown), (unknown), Sungsu Park, Jae-Dong Kim, (unknown), (unknown), A. Syed	8
14	Mechanical, thermal and electrical analysis of a compliant interconnect 2004 ·Jesse Galloway, A. Syed, (unknown), (unknown), (unknown), (unknown), Seung Mo Kim, (unknown), (unknown), (unknown)	2
15	Board level reliability evaluation of RF PA module vias 2004 ·Robert Darveaux, (unknown), A. Syed, (unknown), (unknown), (unknown)	1
16	Are we over designing for solder joint reliability? Field vs. accelerated conditions, realistic vs. specified requirements 2003 ·A. Syed, (unknown)	22
17	Predicting solder joint reliability for thermal, power, and bend cycle within 25% accuracy 2002 ·A. Syed	98
18	Reliability and Au embrittlement of lead free solders for BGA applications 2002 ·A. Syed	33

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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