A. Syed
Impact in
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Integrated Circuits and Semiconductor Failure Analysis
- Electromagnetic Compatibility and Noise Suppression
- Silicon Carbide Semiconductor Technologies
- Mechanical Engineering top 10%
- Aluminum Alloys Composites Properties
- Advanced Welding Techniques Analysis
Papers in
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- Electronic Packaging and Soldering Technologies 12
- 3D IC and TSV technologies 8
-
- Aluminum Alloy Microstructure Properties 5
- Co-authors
- Seung Mo Kim (3 shared papers)Toni T. Mattila (1 shared paper)J.K. Kivilahti (1 shared paper)Wei Lin (1 shared paper)Jin‐Young Kim (2 shared papers)Jesse Galloway (2 shared papers)Sungsu Park (1 shared paper)Jae-Dong Kim (1 shared paper)
- Journals
- Journal of Composites for Construction (1 paper)IEEE Transactions on Components and Packaging Technologies (1 paper)Engineering Structures (1 paper)Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) (1 paper)
- Partner nations
- United StatesGermanyFinland
In The Last Decade
A. Syed
14 papers receiving 530 citations
Peers
Comparison fields: 5 of 28
- Electrical and Electronic Engineering 529
- Mechanical Engineering 227
- Statistics, Probability and Uncertainty 27
- Mechanics of Materials 86
- Aerospace Engineering 79
Countries citing papers authored by A. Syed
This map shows the geographic impact of A. Syed's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by A. Syed with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites A. Syed more than expected).
Fields of papers citing papers by A. Syed
This network shows the impact of papers produced by A. Syed. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by A. Syed. The network helps show where A. Syed may publish in the future.
Co-authors
The 9 scholars most cited alongside A. Syed, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2004 | 273 | |
| 2 | 2002 | 98 | |
| 3 | 2006 | 54 | |
| 4 | 2002 | 33 | |
| 5 | 2005 | 27 | |
| 6 | 2003 | 22 | |
| 7 | 2007 | 19 | |
| 8 | 2005 | 19 | |
| 9 | 2004 | 8 | |
| 10 | 2010 | 2 | |
| 11 | 2004 | 2 | |
| 12 | 2025 | 1 | |
| 13 | 2025 | 1 | |
| 14 | 2004 | 1 |
About A. Syed
A. Syed is a scholar working on Electrical and Electronic Engineering, Aerospace Engineering, Mechanical Engineering, Mechanics of Materials and Civil and Structural Engineering, having authored 14 papers that have together received 560 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (12 papers), 3D IC and TSV technologies (8 papers), Aluminum Alloy Microstructure Properties (5 papers), Advanced Welding Techniques Analysis (2 papers), Adhesion, Friction, and Surface Interactions (2 papers), Structural Behavior of Reinforced Concrete (2 papers), Structural Load-Bearing Analysis (2 papers) and High Temperature Alloys and Creep (2 papers). The work is most often cited by research in Electrical and Electronic Engineering (529 citations), Mechanical Engineering (227 citations), Statistics, Probability and Uncertainty (27 citations), Mechanics of Materials (86 citations) and Aerospace Engineering (79 citations). A. Syed has collaborated with scholars based in United States, Germany and Finland. Frequent co-authors include Seung Mo Kim, Toni T. Mattila, J.K. Kivilahti, Wei Lin, Jin‐Young Kim, Jesse Galloway, Sungsu Park, Jae-Dong Kim and Robert Darveaux. Their work appears in journals such as Journal of Composites for Construction, IEEE Transactions on Components and Packaging Technologies, Engineering Structures and Additional Conferences (Device Packaging HiTEC HiTEN & CICMT).
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.