Jeffrey C. Suhling
- Electrical and Electronic Engineering top 0.5%
- Mechanical Engineering top 0.5%
- Aerospace Engineering top 0.5%
- Mechanics of Materials top 1%
- Biomedical Engineering top 5%
- Co-authors
- Pradeep LallR.C. JaegerHongtao MaMichael J. BozackWayne JohnsonZijie CaiMohammad MotalabSudan Ahmed
- Topics
- Electronic Packaging and Soldering Technologies (246 papers)3D IC and TSV technologies (118 papers)Aluminum Alloys Composites Properties (62 papers)
- Journals
- Journal of Materials ScienceIEEE Journal of Solid-State CircuitsIEEE Transactions on Electron Devices
- Partner nations
- United StatesSouth KoreaGermany
In The Last Decade
Jeffrey C. Suhling
298 papers receiving 5.8k citations
Hit Papers
Peers
Comparison fields: 5 of 65
- Electrical and Electronic Engineering 5.6k
- Mechanical Engineering 2.6k
- Aerospace Engineering 1.3k
- Mechanics of Materials 1.1k
- Biomedical Engineering 708
Countries citing papers authored by Jeffrey C. Suhling
This map shows the geographic impact of Jeffrey C. Suhling's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Jeffrey C. Suhling with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Jeffrey C. Suhling more than expected).
Fields of papers citing papers by Jeffrey C. Suhling
This network shows the impact of papers produced by Jeffrey C. Suhling. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Jeffrey C. Suhling. The network helps show where Jeffrey C. Suhling may publish in the future.
Co-authorship network of co-authors of Jeffrey C. Suhling
This figure shows the co-authorship network connecting the top 25 collaborators of Jeffrey C. Suhling. A scholar is included among the top collaborators of Jeffrey C. Suhling based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Jeffrey C. Suhling. Jeffrey C. Suhling is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 0 | |
| 2 | 1 | |
| 3 | 0 | |
| 4 | 2 | |
| 5 | 12 | |
| 6 | 12 | |
| 7 | 16 | |
| 8 | 10 | |
| 9 | 22 | |
| 10 | 0 | |
| 11 | 8 | |
| 12 | 0 | |
| 13 | 17 | |
| 14 | 15 | |
| 15 | 6 | |
| 16 | 28 | |
| 17 | Reliability of small BGAs in the automotive environment | 4 |
| 18 | Measurement of Backside Flip Chip Die Stresses using Piezoresistive Test Die | 26 |
| 19 | FET mobility degradation and device mismatch due to packaging induced die stress | 13 |
| 20 | 1 |
About Jeffrey C. Suhling
Jeffrey C. Suhling is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Mechanics of Materials, having authored 313 papers that have together received 6.0k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (246 papers), 3D IC and TSV technologies (118 papers) and Aluminum Alloys Composites Properties (62 papers). The work is most often cited by research in Electrical and Electronic Engineering (5.6k citations), Mechanical Engineering (2.6k citations) and Aerospace Engineering (1.3k citations). Jeffrey C. Suhling has collaborated with scholars based in United States, South Korea and Germany. Frequent co-authors include Pradeep Lall, R.C. Jaeger, Hongtao Ma, Michael J. Bozack, Wayne Johnson, Zijie Cai, Mohammad Motalab, Sudan Ahmed, Muhannad Mustafa and Munshi Basit. Their work appears in journals such as Journal of Materials Science, IEEE Journal of Solid-State Circuits and IEEE Transactions on Electron Devices.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.