Jing-en Luan
Impact in
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Electrostatic Discharge in Electronics
- Integrated Circuits and Semiconductor Failure Analysis
- Electromagnetic Compatibility and Noise Suppression
- Mechanics of Materials top 5%
- Material Properties and Processing
- Mechanical Behavior of Composites
Papers in
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- Electronic Packaging and Soldering Technologies 43
- 3D IC and TSV technologies 35
- Electrostatic Discharge in Electronics 10
- Electromagnetic Compatibility and Noise Suppression 8
- Integrated Circuits and Semiconductor Failure Analysis 4
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- Material Properties and Processing 7
- Mechanical Behavior of Composites 5
- Co-authors
- Tong Yan Tee (23 shared papers)Chwee Teck Lim (6 shared papers)E. Pek (6 shared papers)Z.W. Zhong (4 shared papers)Xavier Baraton (13 shared papers)Guojun Hu (8 shared papers)Hun Shen Ng (5 shared papers)Fa Xing (4 shared papers)
- Journals
- Journal of Electronic Packaging (2 papers)Microelectronics Reliability (2 papers)NDT & E International (1 paper)European Microelectronics and Packaging Conference (2 papers)National University of Singapore (5 papers)
- Partner nations
- SingaporeSwitzerlandItaly
In The Last Decade
Jing-en Luan
44 papers receiving 724 citations
Peers
Comparison fields: 5 of 31
- Electrical and Electronic Engineering 721
- Mechanics of Materials 273
- Mechanical Engineering 180
- Hardware and Architecture 25
- Civil and Structural Engineering 44
Countries citing papers authored by Jing-en Luan
This map shows the geographic impact of Jing-en Luan's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Jing-en Luan with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Jing-en Luan more than expected).
Fields of papers citing papers by Jing-en Luan
This network shows the impact of papers produced by Jing-en Luan. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Jing-en Luan. The network helps show where Jing-en Luan may publish in the future.
Co-authors
The 24 scholars most cited alongside Jing-en Luan, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 46 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2004 | 130 | |
| 2 | 2004 | 79 | |
| 3 | 2004 | 70 | |
| 4 | 2005 | 58 | |
| 5 | 2005 | 37 | |
| 6 | 2005 | 35 | |
| 7 | 2009 | 33 | |
| 8 | 2007 | 33 | |
| 9 | 2005 | 33 | |
| 10 | 2005 | 29 | |
| 11 | 2008 | 23 | |
| 12 | 2006 | 18 | |
| 13 | 2010 | 17 | |
| 14 | 2010 | 16 | |
| 15 | 2005 | 13 | |
| 16 | 2005 | 12 | |
| 17 | 2008 | 12 | |
| 18 | 2005 | 12 | |
| 19 | 2009 | 12 | |
| 20 | 2006 | 12 |
About Jing-en Luan
Jing-en Luan is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials, Mechanical Engineering, Hardware and Architecture and Civil and Structural Engineering, having authored 46 papers that have together received 800 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (43 papers), 3D IC and TSV technologies (35 papers), Electrostatic Discharge in Electronics (10 papers), Electromagnetic Compatibility and Noise Suppression (8 papers), Material Properties and Processing (7 papers), Mechanical Behavior of Composites (5 papers), Integrated Circuits and Semiconductor Failure Analysis (4 papers) and Advanced Welding Techniques Analysis (3 papers). The work is most often cited by research in Electrical and Electronic Engineering (721 citations), Mechanics of Materials (273 citations), Mechanical Engineering (180 citations), Hardware and Architecture (25 citations) and Civil and Structural Engineering (44 citations). Jing-en Luan has collaborated with scholars based in Singapore, Switzerland and Italy. Frequent co-authors include Tong Yan Tee, Chwee Teck Lim, E. Pek, Z.W. Zhong, Xavier Baraton, Guojun Hu, Hun Shen Ng, Fa Xing, A.A.O. Tay and K.L. Goh. Their work appears in journals such as Journal of Electronic Packaging, Microelectronics Reliability, NDT & E International, European Microelectronics and Packaging Conference and National University of Singapore.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.