Jing-en Luan

990 total citations
46 papers, 799 citations indexed

About

Jing-en Luan is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials and Mechanical Engineering. According to data from OpenAlex, Jing-en Luan has authored 46 papers receiving a total of 799 indexed citations (citations by other indexed papers that have themselves been cited), including 44 papers in Electrical and Electronic Engineering, 12 papers in Mechanics of Materials and 8 papers in Mechanical Engineering. Recurrent topics in Jing-en Luan's work include Electronic Packaging and Soldering Technologies (43 papers), 3D IC and TSV technologies (35 papers) and Electrostatic Discharge in Electronics (10 papers). Jing-en Luan is often cited by papers focused on Electronic Packaging and Soldering Technologies (43 papers), 3D IC and TSV technologies (35 papers) and Electrostatic Discharge in Electronics (10 papers). Jing-en Luan collaborates with scholars based in Singapore, Switzerland and Italy. Jing-en Luan's co-authors include Tong Yan Tee, Chwee Teck Lim, E. Pek, Z.W. Zhong, Xavier Baraton, Guojun Hu, Hun Shen Ng, Fa Xing, A.A.O. Tay and K.L. Goh and has published in prestigious journals such as Microelectronics Reliability, NDT & E International and Journal of Electronic Packaging.

In The Last Decade

Jing-en Luan

44 papers receiving 722 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Jing-en Luan Singapore 14 721 272 179 60 44 46 799
E. Pek Singapore 7 602 0.8× 229 0.8× 97 0.5× 45 0.8× 39 0.9× 9 640
Hun Shen Ng Singapore 13 607 0.8× 165 0.6× 116 0.6× 35 0.6× 17 0.4× 26 630
Nokibul Islam United States 12 349 0.5× 73 0.3× 81 0.5× 34 0.6× 85 1.9× 31 405
W. Engelmaier United States 11 577 0.8× 196 0.7× 289 1.6× 33 0.6× 24 0.5× 20 656
Vahid Samavatian Iran 17 465 0.6× 111 0.4× 252 1.4× 100 1.7× 29 0.7× 33 670
Sueo KAWAI Japan 10 318 0.4× 281 1.0× 174 1.0× 51 0.8× 44 1.0× 40 474
Kamal Sikka United States 13 264 0.4× 58 0.2× 300 1.7× 82 1.4× 31 0.7× 62 530
Jiefeng Xu United States 14 328 0.5× 81 0.3× 117 0.7× 27 0.5× 18 0.4× 24 382
Dhananjay Panchagade United States 15 605 0.8× 155 0.6× 93 0.5× 60 1.0× 146 3.3× 31 703
Jae B. Kwak South Korea 11 302 0.4× 114 0.4× 102 0.6× 29 0.5× 24 0.5× 36 387

Countries citing papers authored by Jing-en Luan

Since Specialization
Citations

This map shows the geographic impact of Jing-en Luan's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Jing-en Luan with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Jing-en Luan more than expected).

Fields of papers citing papers by Jing-en Luan

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Jing-en Luan. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Jing-en Luan. The network helps show where Jing-en Luan may publish in the future.

Co-authorship network of co-authors of Jing-en Luan

This figure shows the co-authorship network connecting the top 25 collaborators of Jing-en Luan. A scholar is included among the top collaborators of Jing-en Luan based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Jing-en Luan. Jing-en Luan is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Gu, Bin & Jing-en Luan. (2022). Warpage Simulation Including Effect of Process and MC Curing Shrinkage. 712–715. 1 indexed citations
2.
3.
Zhang, Ray, et al.. (2017). Silver alloy wire bonding and optimization using robust development approach. 1–5. 2 indexed citations
4.
Hu, Guojun, Roberto Rossi, Jing-en Luan, & Xavier Baraton. (2010). Interface delamination analysis of TQFP package during solder reflow. Microelectronics Reliability. 50(7). 1014–1020. 18 indexed citations
5.
Hu, Guojun, et al.. (2010). Numerical and Experimental Study of Interface Delamination in Flip Chip BGA Package. Journal of Electronic Packaging. 132(1). 16 indexed citations
6.
Luan, Jing-en, et al.. (2009). Effect of microstructure design on reliability of FBGA lead-free solder joints. European Microelectronics and Packaging Conference. 1–6. 1 indexed citations
7.
Hu, Guojun, et al.. (2009). Thermoelastic properties of printed circuit boards: Effect of copper trace. European Microelectronics and Packaging Conference. 1–6. 11 indexed citations
8.
Luan, Jing-en, et al.. (2009). Challenges for extra large embedded wafer level ball grid array development. 202–207. 12 indexed citations
9.
Hu, Guojun, Jing-en Luan, Xavier Baraton, & A.A.O. Tay. (2009). Analysis of interfacial delamination in IC packaging: Use stress or fracture mechanics?. National University of Singapore. 19. 584–590. 8 indexed citations
10.
Xing, Fa, et al.. (2009). Drop impact life model development for FBGA assembly with lead-free solder joint. 656–662. 4 indexed citations
11.
Luan, Jing-en, et al.. (2008). A novel methodology for virtual qualification of IC packages under board level drop test. 1212–1217. 5 indexed citations
12.
Xing, Fa, Jing-en Luan, D. Yap, K.L. Goh, & Xavier Baraton. (2008). Thermal cycling fatigue model development for FBGA assembly with Sn-Ag-based lead-free solder. 1–6. 9 indexed citations
13.
Luan, Jing-en, Tong Yan Tee, E. Pek, Chwee Teck Lim, & Z.W. Zhong. (2007). Dynamic responses and solder joint reliability under board level drop test. Microelectronics Reliability. 47(2-3). 450–460. 33 indexed citations
14.
Luan, Jing-en. (2007). Design for Improvement of Drop Impact Performance of Package-on Package. 937–942. 4 indexed citations
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16.
17.
Tee, Tong Yan, et al.. (2006). 4-Dimensional Design Analysis and Optimization of System-in-Package. 1. 321–327. 2 indexed citations
18.
19.
Luan, Jing-en & Tong Yan Tee. (2005). Novel board level drop test simulation using implicit transient analysis with input-G method. 671–677. 57 indexed citations
20.
Tee, Tong Yan, Jing-en Luan, & Hun Shen Ng. (2005). Development and application of innovational drop impact modeling techniques. 2. 504–512. 37 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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2026