Robin Bornoff

532 total citations
43 papers, 420 citations indexed

About

Robin Bornoff is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Condensed Matter Physics. According to data from OpenAlex, Robin Bornoff has authored 43 papers receiving a total of 420 indexed citations (citations by other indexed papers that have themselves been cited), including 24 papers in Electrical and Electronic Engineering, 14 papers in Mechanical Engineering and 7 papers in Condensed Matter Physics. Recurrent topics in Robin Bornoff's work include Heat Transfer and Optimization (12 papers), Silicon Carbide Semiconductor Technologies (12 papers) and GaN-based semiconductor devices and materials (7 papers). Robin Bornoff is often cited by papers focused on Heat Transfer and Optimization (12 papers), Silicon Carbide Semiconductor Technologies (12 papers) and GaN-based semiconductor devices and materials (7 papers). Robin Bornoff collaborates with scholars based in United Kingdom, Hungary and Netherlands. Robin Bornoff's co-authors include John Parry, A. Poppe, M. Rencz, Lorenzo Codecasa, Vincenzo d’Alessandro, N. Rinaldi, Alessandro Magnani, J. Dyson, Gábor Farkas and Zoltán Sárkány and has published in prestigious journals such as Atmospheric Environment, Energies and Microelectronics Reliability.

In The Last Decade

Robin Bornoff

41 papers receiving 398 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Robin Bornoff United Kingdom 14 212 122 105 44 40 43 420
Zhigang Wu China 15 66 0.3× 187 1.5× 15 0.1× 98 2.2× 7 0.2× 74 669
Dirk Hente Germany 9 302 1.4× 25 0.2× 51 0.5× 20 0.5× 11 0.3× 13 348
Xinye Li China 12 49 0.2× 55 0.5× 12 0.1× 38 0.9× 83 2.1× 51 402
Guozheng Li China 13 168 0.8× 96 0.8× 11 0.1× 56 1.3× 38 0.9× 40 429
Jiang Guo China 9 74 0.3× 59 0.5× 6 0.1× 82 1.9× 12 0.3× 35 330
Van Su Luong Vietnam 12 214 1.0× 108 0.9× 6 0.1× 41 0.9× 33 0.8× 45 412
Lun Yang China 16 553 2.6× 17 0.1× 64 0.6× 173 3.9× 4 0.1× 48 921
T. Ericsen United States 15 665 3.1× 49 0.4× 29 0.3× 14 0.3× 9 0.2× 23 797
Junchao Li China 12 54 0.3× 130 1.1× 43 0.4× 45 1.0× 2 0.1× 47 383

Countries citing papers authored by Robin Bornoff

Since Specialization
Citations

This map shows the geographic impact of Robin Bornoff's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Robin Bornoff with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Robin Bornoff more than expected).

Fields of papers citing papers by Robin Bornoff

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Robin Bornoff. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Robin Bornoff. The network helps show where Robin Bornoff may publish in the future.

Co-authorship network of co-authors of Robin Bornoff

This figure shows the co-authorship network connecting the top 25 collaborators of Robin Bornoff. A scholar is included among the top collaborators of Robin Bornoff based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Robin Bornoff. Robin Bornoff is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Parry, John, et al.. (2024). Sustainable Immersion Cooling of Servers. 1–7. 1 indexed citations
2.
Codecasa, Lorenzo, Vincenzo d’Alessandro, & Robin Bornoff. (2021). Galerkin’s Projection Framework for BCI CTMs—Part I: Extended FANTASTIC Approach. IEEE Transactions on Components Packaging and Manufacturing Technology. 11(11). 1792–1803. 7 indexed citations
3.
Bornoff, Robin, et al.. (2019). FROM MEASUREMENTS TO STANDARDISED MULTI-DOMAIN COMPACT MODELS OF LEDS USING LED E-DATASHEETS. 379–386. 2 indexed citations
4.
5.
Bornoff, Robin. (2019). Extraction of Boundary Condition Independent Dynamic Compact Thermal Models of LEDs—A Delphi4LED Methodology. Energies. 12(9). 1628–1628. 14 indexed citations
6.
Hantos, Gusztáv, et al.. (2019). Implementation of a Multi-domain LED Model and its Application for Optimized LED Luminaire Design. 1 indexed citations
7.
Codecasa, Lorenzo, Robin Bornoff, J. Dyson, et al.. (2018). Versatile MOR-based boundary condition independent compact thermal models with multiple heat sources. Microelectronics Reliability. 87. 194–205. 15 indexed citations
8.
9.
Bornoff, Robin, et al.. (2018). Quantified Insights into LED Variability. TU/e Research Portal. 1–6. 15 indexed citations
10.
Bornoff, Robin, et al.. (2018). Automated structure function object mapping. 114–118. 2 indexed citations
11.
Bornoff, Robin, et al.. (2017). Dynamic compact thermal model extraction for LED packages using model order reduction techniques. TU/e Research Portal. 12. 1–6. 7 indexed citations
12.
Codecasa, Lorenzo, Vincenzo d’Alessandro, Alessandro Magnani, et al.. (2017). Partition-based approach to parametric dynamic compact thermal modeling. Microelectronics Reliability. 79. 361–370. 8 indexed citations
13.
Bornoff, Robin, et al.. (2017). Full-circuit 3D electro-thermal modeling of an IGBT Power Inverter. 29–35. 2 indexed citations
14.
15.
Bornoff, Robin & John Parry. (2015). An additive design heatsink geometry topology identification and optimisation algorithm. 303–308. 30 indexed citations
16.
Sárkány, Zoltán, et al.. (2015). Mission profile driven component design for adjusting product lifetime on system level. 385–389. 3 indexed citations
17.
Bornoff, Robin, et al.. (2013). A detailed IC package numerical model calibration methodology. 65–70. 15 indexed citations
18.
Bornoff, Robin, et al.. (2011). Accurate thermal characterization of power semiconductor packages by thermal simulation and measurements. 324–329. 10 indexed citations
19.
Bornoff, Robin, et al.. (2011). Heat sink design optimization using the thermal bottleneck concept. 29. 76–80. 9 indexed citations
20.
Bornoff, Robin. (2001). A numerical study of interacting buoyant cooling-tower plumes. Atmospheric Environment. 35(3). 589–598. 35 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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