Jesse Galloway
Impact in
- Mechanical Engineering top 5%
- Heat Transfer and Boiling Studies
- Heat Transfer and Optimization
- Computational Mechanics top 10%
Papers in
-
- Electronic Packaging and Soldering Technologies 14
- 3D IC and TSV technologies 11
- Silicon Carbide Semiconductor Technologies 5
- Electromagnetic Compatibility and Noise Suppression 3
-
- Heat Transfer and Optimization 12
- Heat Transfer and Boiling Studies 5
- Co-authors
- Issam Mudawar (4 shared papers)Nokibul Islam (2 shared papers)Debra A. Brock (1 shared paper)Tamara S. Haselkorn (1 shared paper)Justine R. Garcia (1 shared paper)David C. Queller (1 shared paper)Joan E. Strassmann (1 shared paper)Tracy E. Douglas (1 shared paper)
- Journals
- International Journal of Heat and Mass Transfer (3 papers)Journal of Heat Transfer (1 paper)Frontiers in Cellular and Infection Microbiology (1 paper)IEEE Transactions on Components and Packaging Technologies (1 paper)IEEE Transactions on Components Packaging and Manufacturing Technology Part A (1 paper)
- Partner nations
- United States
In The Last Decade
Jesse Galloway
28 papers receiving 575 citations
Peers
Comparison fields: 5 of 53
- Mechanical Engineering 358
- Computational Mechanics 143
- Mechanics of Materials 120
- Aerospace Engineering 105
- Electrical and Electronic Engineering 238
Countries citing papers authored by Jesse Galloway
This map shows the geographic impact of Jesse Galloway's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Jesse Galloway with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Jesse Galloway more than expected).
Fields of papers citing papers by Jesse Galloway
This network shows the impact of papers produced by Jesse Galloway. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Jesse Galloway. The network helps show where Jesse Galloway may publish in the future.
Co-authors
The 21 scholars most cited alongside Jesse Galloway, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 29 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 1997 | 148 | |
| 2 | 1993 | 141 | |
| 3 | 1993 | 125 | |
| 4 | 2018 | 34 | |
| 5 | 2008 | 24 | |
| 6 | 2005 | 19 | |
| 7 | 2010 | 15 | |
| 8 | 1992 | 12 | |
| 9 | 2008 | 10 | |
| 10 | 2012 | 9 | |
| 11 | 1995 | 9 | |
| 12 | 2017 | 9 | |
| 13 | 2012 | 8 | |
| 14 | 2011 | 6 | |
| 15 | 2014 | 6 | |
| 16 | 2008 | 6 | |
| 17 | 2004 | 5 | |
| 18 | 2009 | 3 | |
| 19 | 2015 | 3 | |
| 20 | 2017 | 3 |
About Jesse Galloway
Jesse Galloway is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Materials Chemistry, Mechanics of Materials and Computational Mechanics, having authored 29 papers that have together received 611 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (14 papers), Heat Transfer and Optimization (12 papers), 3D IC and TSV technologies (11 papers), Thermal properties of materials (10 papers), Silicon Carbide Semiconductor Technologies (5 papers), Heat Transfer and Boiling Studies (5 papers), Adhesion, Friction, and Surface Interactions (4 papers) and Electromagnetic Compatibility and Noise Suppression (3 papers). The work is most often cited by research in Mechanical Engineering (358 citations), Computational Mechanics (143 citations), Mechanics of Materials (120 citations), Aerospace Engineering (105 citations) and Electrical and Electronic Engineering (238 citations). Jesse Galloway has collaborated with scholars based in United States. Frequent co-authors include Issam Mudawar, Nokibul Islam, Debra A. Brock, Tamara S. Haselkorn, Justine R. Garcia, David C. Queller, Joan E. Strassmann, Tracy E. Douglas, Qun Wan and Scott T. McCain. Their work appears in journals such as International Journal of Heat and Mass Transfer, Journal of Heat Transfer, Frontiers in Cellular and Infection Microbiology, IEEE Transactions on Components and Packaging Technologies and IEEE Transactions on Components Packaging and Manufacturing Technology Part A.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.