Jeff Suhling

3.2k total citations
200 papers, 2.5k citations indexed

About

Jeff Suhling is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Mechanics of Materials. According to data from OpenAlex, Jeff Suhling has authored 200 papers receiving a total of 2.5k indexed citations (citations by other indexed papers that have themselves been cited), including 182 papers in Electrical and Electronic Engineering, 71 papers in Mechanical Engineering and 60 papers in Mechanics of Materials. Recurrent topics in Jeff Suhling's work include Electronic Packaging and Soldering Technologies (172 papers), 3D IC and TSV technologies (52 papers) and Integrated Circuits and Semiconductor Failure Analysis (48 papers). Jeff Suhling is often cited by papers focused on Electronic Packaging and Soldering Technologies (172 papers), 3D IC and TSV technologies (52 papers) and Integrated Circuits and Semiconductor Failure Analysis (48 papers). Jeff Suhling collaborates with scholars based in United States, South Korea and United Kingdom. Jeff Suhling's co-authors include Pradeep Lall, Sameep Gupte, Sandeep Shantaram, Dhananjay Panchagade, David Locker, Vikas Yadav, Nokibul Islam, Chandan Bhat, Deepti Iyengar and Md Nazmul Islam and has published in prestigious journals such as Engineering Fracture Mechanics, Experimental Mechanics and Microelectronics Reliability.

In The Last Decade

Jeff Suhling

186 papers receiving 2.4k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Jeff Suhling United States 26 2.0k 815 636 354 325 200 2.5k
Seungbae Park United States 24 1.7k 0.9× 631 0.8× 1.1k 1.7× 248 0.7× 143 0.4× 164 2.8k
Ying Guo China 25 694 0.4× 855 1.0× 770 1.2× 158 0.4× 93 0.3× 127 2.0k
Vladimir Babitsky United Kingdom 26 910 0.5× 1.5k 1.9× 264 0.4× 499 1.4× 88 0.3× 80 2.3k
Elijah Kannatey‐Asibu United States 22 504 0.3× 1.5k 1.9× 398 0.6× 149 0.4× 103 0.3× 69 1.9k
Yu Huang China 31 1.1k 0.5× 1.6k 2.0× 312 0.5× 99 0.3× 128 0.4× 172 2.6k
Zhenyuan Jia China 22 369 0.2× 652 0.8× 168 0.3× 120 0.3× 129 0.4× 120 1.3k
Jeffrey C. Suhling United States 40 5.6k 2.9× 2.6k 3.2× 1.1k 1.8× 134 0.4× 1.3k 3.9× 313 6.0k
Robert Darveaux United States 18 1.9k 1.0× 821 1.0× 462 0.7× 54 0.2× 265 0.8× 50 2.1k
Xing Ai China 29 626 0.3× 1.9k 2.3× 576 0.9× 133 0.4× 146 0.4× 165 2.3k
Kim A. Stelson United States 22 298 0.2× 863 1.1× 430 0.7× 117 0.3× 149 0.5× 126 1.5k

Countries citing papers authored by Jeff Suhling

Since Specialization
Citations

This map shows the geographic impact of Jeff Suhling's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Jeff Suhling with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Jeff Suhling more than expected).

Fields of papers citing papers by Jeff Suhling

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Jeff Suhling. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Jeff Suhling. The network helps show where Jeff Suhling may publish in the future.

Co-authorship network of co-authors of Jeff Suhling

This figure shows the co-authorship network connecting the top 25 collaborators of Jeff Suhling. A scholar is included among the top collaborators of Jeff Suhling based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Jeff Suhling. Jeff Suhling is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
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Lall, Pradeep, et al.. (2022). Effect of Underfill Property Evolution on Solder Joint Reliability in Automotive Applications. 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). 455–466. 5 indexed citations
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Wei, Xin, Jeff Suhling, Sa’d Hamasha, et al.. (2022). Indentation Creep Properties Evolution of Lead-Free Solder Joints Subjected to Thermal Cycling. 1–8. 4 indexed citations
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Lall, Pradeep, et al.. (2021). Evolution of Viscoelastic Properties of Underfills Exposed to High Temperature. 851–860. 5 indexed citations
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Lall, Pradeep, Vikas Yadav, Jeff Suhling, & David Locker. (2021). High Temperature-Vibration Reliability of SnAgCu Leadfree Assemblies in Automotive Environments. 836–849. 3 indexed citations
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Lall, Pradeep, Vikas Yadav, Jeff Suhling, & David Locker. (2020). Evolution of Anand Parameters With Elevated Temperature Aging for SnAgCu Lead-free Alloys. Journal of Electronic Packaging. 143(2). 5 indexed citations
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Lall, Pradeep, Vikas Yadav, Jeff Suhling, & David Locker. (2017). High strain rate mechanical behavior of SAC-Q solder. 1447–1455. 14 indexed citations
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Lall, Pradeep, Di Zhang, & Jeff Suhling. (2015). High strain rate properties of SAC305 leadfree solder at high operating temperature after long-term storage. 640–651. 23 indexed citations
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Angadi, Santosh, et al.. (2008). Reliability and life study of hydraulic solenoid valve. Part 1: A multi-physics finite element model. Engineering Failure Analysis. 16(3). 874–887. 73 indexed citations
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Lall, Pradeep, et al.. (2006). Prognostics and Health Management of Electronic Packaging. IEEE Transactions on Components and Packaging Technologies. 29(3). 666–677. 92 indexed citations
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Suhling, Jeff, et al.. (1990). An energy based fracture criterion for mode II crack in fiber composites. Engineering Fracture Mechanics. 36(1). 49–59. 3 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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