Jeff Suhling
Impact in
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- Electronic Packaging and Soldering Technologies
- Integrated Circuits and Semiconductor Failure Analysis
- 3D IC and TSV technologies
- Silicon and Solar Cell Technologies
- Mechanics of Materials top 2%
Papers in
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- Electronic Packaging and Soldering Technologies 172
- 3D IC and TSV technologies 52
- Integrated Circuits and Semiconductor Failure Analysis 48
- Electrostatic Discharge in Electronics 19
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- Aluminum Alloys Composites Properties 26
- Co-authors
- Pradeep Lall (186 shared papers)Sandeep Shantaram (16 shared papers)Sameep Gupte (9 shared papers)Dhananjay Panchagade (16 shared papers)David Locker (34 shared papers)Vikas Yadav (31 shared papers)Nokibul Islam (11 shared papers)Chandan Bhat (5 shared papers)
- Journals
- Journal of Electronic Packaging (9 papers)IEEE Transactions on Components and Packaging Technologies (5 papers)Engineering Fracture Mechanics (4 papers)Experimental Mechanics (3 papers)Engineering Failure Analysis (2 papers)
- Partner nations
- United StatesSouth KoreaUnited Kingdom
In The Last Decade
Jeff Suhling
186 papers receiving 2.4k citations
Peers
Comparison fields: 5 of 61
- Electrical and Electronic Engineering 2.0k
- Mechanics of Materials 636
- Mechanical Engineering 815
- Industrial and Manufacturing Engineering 201
- Civil and Structural Engineering 354
Countries citing papers authored by Jeff Suhling
This map shows the geographic impact of Jeff Suhling's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Jeff Suhling with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Jeff Suhling more than expected).
Fields of papers citing papers by Jeff Suhling
This network shows the impact of papers produced by Jeff Suhling. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Jeff Suhling. The network helps show where Jeff Suhling may publish in the future.
Co-authors
The 25 scholars most cited alongside Jeff Suhling, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 200 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2006 | 92 | |
| 2 | 2007 | 92 | |
| 3 | 2013 | 77 | |
| 4 | 2008 | 73 | |
| 5 | 2006 | 73 | |
| 6 | 2005 | 69 | |
| 7 | 2007 | 64 | |
| 8 | 2004 | 58 | |
| 9 | 2008 | 57 | |
| 10 | 2007 | 56 | |
| 11 | 2006 | 51 | |
| 12 | 2017 | 50 | |
| 13 | 2007 | 46 | |
| 14 | 1985 | 46 | |
| 15 | 2008 | 45 | |
| 16 | 2007 | 45 | |
| 17 | 2007 | 44 | |
| 18 | 2005 | 41 | |
| 19 | Keynote Presentation Feature Extraction and Health Monitoring using Image Correlation for Survivability of Leadfree Packaging under Shock and Vibration | 2008 | 38 |
| 20 | 2016 | 37 |
About Jeff Suhling
Jeff Suhling is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Mechanics of Materials, Aerospace Engineering and Materials Chemistry, having authored 200 papers that have together received 2.5k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (172 papers), 3D IC and TSV technologies (52 papers), Integrated Circuits and Semiconductor Failure Analysis (48 papers), Aluminum Alloy Microstructure Properties (28 papers), Aluminum Alloys Composites Properties (26 papers), Electrostatic Discharge in Electronics (19 papers), Metallurgy and Material Forming (18 papers) and Mechanical Behavior of Composites (16 papers). The work is most often cited by research in Electrical and Electronic Engineering (2.0k citations), Mechanics of Materials (636 citations), Mechanical Engineering (815 citations), Industrial and Manufacturing Engineering (201 citations) and Civil and Structural Engineering (354 citations). Jeff Suhling has collaborated with scholars based in United States, South Korea and United Kingdom. Frequent co-authors include Pradeep Lall, Sandeep Shantaram, Sameep Gupte, Dhananjay Panchagade, David Locker, Vikas Yadav, Nokibul Islam, Chandan Bhat, Md Nazmul Islam and Deepti Iyengar. Their work appears in journals such as Journal of Electronic Packaging, IEEE Transactions on Components and Packaging Technologies, Engineering Fracture Mechanics, Experimental Mechanics and Engineering Failure Analysis.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.