Ahmer Syed
- Electrical and Electronic Engineering top 10%
- Mechanical Engineering
- Aerospace Engineering
- Electronic, Optical and Magnetic Materials
- Mechanics of Materials
- Topics
- Electronic Packaging and Soldering Technologies (33 papers)3D IC and TSV technologies (29 papers)Copper Interconnects and Reliability (9 papers)
- Partner nations
- United StatesUnited KingdomSingapore
In The Last Decade
Ahmer Syed
36 papers receiving 387 citations
Peers
Comparison fields: 5 of 28
- Electrical and Electronic Engineering 401
- Mechanical Engineering 153
- Aerospace Engineering 51
- Electronic, Optical and Magnetic Materials 50
- Mechanics of Materials 47
Countries citing papers authored by Ahmer Syed
This map shows the geographic impact of Ahmer Syed's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Ahmer Syed with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Ahmer Syed more than expected).
Fields of papers citing papers by Ahmer Syed
This network shows the impact of papers produced by Ahmer Syed. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Ahmer Syed. The network helps show where Ahmer Syed may publish in the future.
Co-authorship network of co-authors of Ahmer Syed
This figure shows the co-authorship network connecting the top 25 collaborators of Ahmer Syed. A scholar is included among the top collaborators of Ahmer Syed based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Ahmer Syed. Ahmer Syed is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 1 | |
| 2 | 4 | |
| 3 | 4 | |
| 4 | 2 | |
| 5 | 8 | |
| 6 | 10 | |
| 7 | 4 | |
| 8 | 1 | |
| 9 | 25 | |
| 10 | 1 | |
| 11 | 22 | |
| 12 | 16 | |
| 13 | 12 | |
| 14 | 1 | |
| 15 | 22 | |
| 16 | 22 | |
| 17 | 25 | |
| 18 | 36 | |
| 19 | 32 | |
| 20 | 41 |
About Ahmer Syed
Ahmer Syed is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Automotive Engineering, having authored 36 papers that have together received 422 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (33 papers), 3D IC and TSV technologies (29 papers) and Copper Interconnects and Reliability (9 papers). The work is most often cited by research in Electrical and Electronic Engineering (401 citations), General Materials Science (21 citations) and Mechanical Engineering (153 citations). Ahmer Syed has collaborated with scholars based in United States, United Kingdom and Singapore. Frequent co-authors include Robert Darveaux, Wei Lin, Chang H. Kim, Tae‐il Kim, Min Seok Yoo, Tong Yan Tee, Young Cho, Mike Kelly, Hun Shen Ng and Tae‐Seong Kim. Their work appears in journals such as JOM, Microelectronics Reliability and Journal of Electronic Packaging.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.