Ahmer Syed

553 total citations
36 papers, 422 citations indexed

About

Ahmer Syed is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Automotive Engineering. According to data from OpenAlex, Ahmer Syed has authored 36 papers receiving a total of 422 indexed citations (citations by other indexed papers that have themselves been cited), including 36 papers in Electrical and Electronic Engineering, 9 papers in Electronic, Optical and Magnetic Materials and 4 papers in Automotive Engineering. Recurrent topics in Ahmer Syed's work include Electronic Packaging and Soldering Technologies (33 papers), 3D IC and TSV technologies (29 papers) and Copper Interconnects and Reliability (9 papers). Ahmer Syed is often cited by papers focused on Electronic Packaging and Soldering Technologies (33 papers), 3D IC and TSV technologies (29 papers) and Copper Interconnects and Reliability (9 papers). Ahmer Syed collaborates with scholars based in United States, United Kingdom and Singapore. Ahmer Syed's co-authors include Robert Darveaux, Young Cho, Min Seok Yoo, Wei Lin, Tong Yan Tee, Chang H. Kim, Tae‐il Kim, Hun Shen Ng, Mike Kelly and Tae‐Seong Kim and has published in prestigious journals such as JOM, Microelectronics Reliability and Journal of Electronic Packaging.

In The Last Decade

Ahmer Syed

36 papers receiving 387 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Ahmer Syed United States 13 401 153 51 50 47 36 422
Masazumi Amagai United States 9 508 1.3× 315 2.1× 72 1.4× 18 0.4× 147 3.1× 29 549
Anthony Primavera United States 8 291 0.7× 171 1.1× 31 0.6× 9 0.2× 62 1.3× 14 333
A. Syed United States 10 579 1.4× 243 1.6× 90 1.8× 11 0.2× 100 2.1× 18 620
Thomas A. Siewert United States 7 167 0.4× 142 0.9× 26 0.5× 14 0.3× 55 1.2× 26 283
Don Son Jiang Taiwan 9 298 0.7× 210 1.4× 55 1.1× 30 0.6× 39 0.8× 36 359
B.S. Xiong Singapore 13 643 1.6× 387 2.5× 117 2.3× 11 0.2× 114 2.4× 16 661
Young-Eui Shin South Korea 10 329 0.8× 222 1.5× 59 1.2× 9 0.2× 60 1.3× 44 386
Awni Qasaimeh United States 11 319 0.8× 178 1.2× 78 1.5× 5 0.1× 98 2.1× 19 352
A. Looser Switzerland 12 297 0.7× 149 1.0× 48 0.9× 56 1.1× 20 0.4× 17 374
Dmitry Golovanov United Kingdom 11 351 0.9× 126 0.8× 31 0.6× 126 2.5× 12 0.3× 26 419

Countries citing papers authored by Ahmer Syed

Since Specialization
Citations

This map shows the geographic impact of Ahmer Syed's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Ahmer Syed with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Ahmer Syed more than expected).

Fields of papers citing papers by Ahmer Syed

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Ahmer Syed. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Ahmer Syed. The network helps show where Ahmer Syed may publish in the future.

Co-authorship network of co-authors of Ahmer Syed

This figure shows the co-authorship network connecting the top 25 collaborators of Ahmer Syed. A scholar is included among the top collaborators of Ahmer Syed based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Ahmer Syed. Ahmer Syed is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Schwarz, M. Philip, et al.. (2021). Investigation of the Factors Affecting the Warpage Prediction of Multi-Chip Package. 1514–1520. 3 indexed citations
2.
Wang, Wei, Wei Zhao, M. Philip Schwarz, et al.. (2020). Numerical Model for Understanding Failure Mechanism of Back End of Line (BEOL) in Bump Shear. 229–235. 1 indexed citations
3.
Niu, Yuling, et al.. (2019). Warpage Variation Analysis and Model Prediction for Molded Packages. 819–824. 4 indexed citations
4.
Syed, Ahmer, et al.. (2019). Module/SiP Packaging Trends. 82–84. 4 indexed citations
5.
Wang, Wei, Yangyang Sun, Xuefeng Zhang, et al.. (2019). Study of BEOL Failure Mode in Flip Chip Packages at High Temperature Conditions. 392–396. 3 indexed citations
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Syed, Ahmer, Gil Sharon, & Robert Darveaux. (2012). Factors affecting Pb-free flip chip bump reliability modeling for life prediction. 1715–1725. 4 indexed citations
8.
Syed, Ahmer, et al.. (2012). A Methodology for Chip - Package Interaction (CPI) Modeling in 3D IC Structures. Additional Conferences (Device Packaging HiTEC HiTEN & CICMT). 2012(DPC). 1373–1393. 1 indexed citations
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Islam, Nokibul, et al.. (2011). Lead Free Flip Chip Reliability for Various Package Types. 609–615. 1 indexed citations
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Syed, Ahmer, et al.. (2010). A Comparison of Flip Chip Bump Electromigration Reliability for Cu Pillar, High Pb, SnAg, and SnPb Bump Structures. Additional Conferences (Device Packaging HiTEC HiTEN & CICMT). 2010(DPC). 1443–1464. 2 indexed citations
13.
Tee, Tong Yan, et al.. (2009). Design for board trace reliability of WLCSP under drop test. 1. 1–8. 16 indexed citations
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Syed, Ahmer, Tae‐il Kim, Young Cho, Chang H. Kim, & Min Seok Yoo. (2006). Alloying effect of Ni, Co, and Sb in SAC solder for improved drop performance of chip scale packages with Cu OSP pad finish. 36 indexed citations
19.
Darveaux, Robert, et al.. (2000). Solder joint fatigue life of fine pitch BGAs – impact of design and material choices. Microelectronics Reliability. 40(7). 1117–1127. 32 indexed citations
20.
Syed, Ahmer. (1995). Creep Crack Growth Prediction of Solder Joints During Temperature Cycling—An Engineering Approach. Journal of Electronic Packaging. 117(2). 116–122. 41 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact

Breakdown of academic impact, for papers by Masazumi Amagai Breakdown of academic impact, for papers by Anthony Primavera Breakdown of academic impact, for papers by A. Syed Breakdown of academic impact, for papers by Thomas A. Siewert Breakdown of academic impact, for papers by Don Son Jiang Breakdown of academic impact, for papers by B.S. Xiong Breakdown of academic impact, for papers by Young-Eui Shin Breakdown of academic impact, for papers by Awni Qasaimeh Breakdown of academic impact, for papers by A. Looser Breakdown of academic impact, for papers by Dmitry Golovanov
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