John L. Evans

2.2k total citations · 1 hit paper
77 papers, 1.7k citations indexed

About

John L. Evans is a scholar working on Electrical and Electronic Engineering, Aerospace Engineering and Mechanical Engineering. According to data from OpenAlex, John L. Evans has authored 77 papers receiving a total of 1.7k indexed citations (citations by other indexed papers that have themselves been cited), including 53 papers in Electrical and Electronic Engineering, 19 papers in Aerospace Engineering and 18 papers in Mechanical Engineering. Recurrent topics in John L. Evans's work include Electronic Packaging and Soldering Technologies (49 papers), 3D IC and TSV technologies (33 papers) and Aluminum Alloy Microstructure Properties (17 papers). John L. Evans is often cited by papers focused on Electronic Packaging and Soldering Technologies (49 papers), 3D IC and TSV technologies (33 papers) and Aluminum Alloy Microstructure Properties (17 papers). John L. Evans collaborates with scholars based in United States, United Kingdom and Jordan. John L. Evans's co-authors include Wayne Johnson, J. R. Thompson, Peter Jacobsen, Michael J. Bozack, Jeffrey C. Suhling, Pradeep Lall, Jiawei Zhang, Mohammad Motalab, Marshall E. Blume and Irwin Friend and has published in prestigious journals such as The Journal of Finance, The Analyst and Materials.

In The Last Decade

John L. Evans

68 papers receiving 1.6k citations

Hit Papers

The Changing Automotive Environment: High-Temperature Ele... 2004 2026 2011 2018 2004 200 400 600
What are hit papers?

Hit papers significantly outperform the citation benchmark for their cohort. A paper qualifies if it has ≥500 total citations, achieves ≥1.5× the top-1% citation threshold for papers in the same subfield and year (this is the minimum needed to enter the top 1%, not the average within it), or reaches the top citation threshold in at least one of its specific research topics.

  1. The Changing Automotive Environment: High-Temperature Electronics
    2004 687 citations Wayne Johnson, John L. Evans et al. profile →

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
John L. Evans United States 19 1.2k 550 286 285 220 77 1.7k
Ranran Liu China 25 1.5k 1.2× 171 0.3× 636 2.2× 57 0.2× 54 0.2× 92 1.9k
Shuaishuai Liu China 23 178 0.1× 596 1.1× 373 1.3× 169 0.6× 124 0.6× 64 1.3k
Jie Jiao China 22 494 0.4× 224 0.4× 587 2.1× 105 0.4× 590 2.7× 100 1.3k
Xiaohan Liu China 21 750 0.6× 98 0.2× 288 1.0× 76 0.3× 181 0.8× 91 1.4k
Changying Wang China 17 394 0.3× 501 0.9× 256 0.9× 31 0.1× 297 1.4× 47 960
Yingli Li China 26 150 0.1× 734 1.3× 276 1.0× 242 0.8× 833 3.8× 109 2.3k
Chih-Hao Yang Taiwan 17 283 0.2× 165 0.3× 321 1.1× 83 0.3× 102 0.5× 38 869
Qi Wu China 22 473 0.4× 225 0.4× 379 1.3× 194 0.7× 220 1.0× 145 1.4k
Chia‐Ching Lin Taiwan 22 1.1k 0.9× 225 0.4× 657 2.3× 92 0.3× 76 0.3× 74 1.9k
Sergio Rivera Colombia 19 666 0.5× 203 0.4× 355 1.2× 67 0.2× 106 0.5× 111 1.3k

Countries citing papers authored by John L. Evans

Since Specialization
Citations

This map shows the geographic impact of John L. Evans's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by John L. Evans with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites John L. Evans more than expected).

Fields of papers citing papers by John L. Evans

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by John L. Evans. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by John L. Evans. The network helps show where John L. Evans may publish in the future.

Co-authorship network of co-authors of John L. Evans

This figure shows the co-authorship network connecting the top 25 collaborators of John L. Evans. A scholar is included among the top collaborators of John L. Evans based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with John L. Evans. John L. Evans is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Hunt, Christine, et al.. (2025). Optimizing patient understanding of spine MRI reports using AI: A prospective single center study. Interventional Pain Medicine. 4(1). 100550–100550. 2 indexed citations
2.
Liu, Jia, et al.. (2025). Interpretable data-driven framework for life prediction of homogenous lead-free solder joints in ball grid array packages. Journal of Intelligent Manufacturing. 37(2). 659–677. 4 indexed citations
3.
Hamasha, Sa’d, et al.. (2025). Microstructural Evolution of SAC-Based Solder Joints Exposed to Thermal Cycling: Effect of Paste Alloy, Paste Volume, and Surface Finish. IEEE Transactions on Components Packaging and Manufacturing Technology. 16(2). 291–306. 1 indexed citations
4.
5.
Wang, Menghong, et al.. (2024). The Effect of Board Design on the Drop Shock Performance of Lead-Free Solder Alloys. 26(1). 612–620. 1 indexed citations
6.
Evans, John L., et al.. (2019). Psychology at the table: Voices of elected officials and advocates.. Psychological Services. 17(S1). 56–61. 1 indexed citations
7.
Hamasha, Sa’d, et al.. (2018). Effect of Surface Finish and High Bi Solder Alloy on Component Reliability in Thermal Cycling. 2032–2040. 26 indexed citations
8.
9.
Evans, John L., Fadel M. Megahed, George T. Flowers, et al.. (2016). Proportional Hazard Model of doped low creep lead free solder paste under vibration. 34. 1209–1217. 8 indexed citations
10.
Zhang, Jiawei, et al.. (2015). Reliability Comparison of Aged SAC Fine-Pitch Ball Grid Array Packages Versus Surface Finishes. IEEE Transactions on Components Packaging and Manufacturing Technology. 5(6). 828–837. 45 indexed citations
11.
Motalab, Mohammad, Muhannad Mustafa, Jeffrey C. Suhling, et al.. (2013). Correlation of reliability models including aging effects with thermal cycling reliability data. 986–1004. 82 indexed citations
12.
Zhang, J.S., John L. Evans, M. J. Bozack, et al.. (2012). Correlation of Aging Effects on Creep Rate and Reliability in Lead Free Solder Joints. 25(3). 19–28.
13.
Motalab, Mohammad, Zijie Cai, Jeffrey C. Suhling, et al.. (2012). Improved predictions of lead free solder joint reliability that include aging effects. 513–531. 86 indexed citations
14.
15.
Evans, John L., et al.. (2005). The Financial and Governance Characteristics of Australian Companies Going Private. International Journal of Business. 13(1). 1–24. 17 indexed citations
16.
Suhling, Jeffrey C., Wayne Johnson, Pradeep Lall, et al.. (2004). Thermal cycling reliability of lead‐free chip resistor solder joints. Soldering and Surface Mount Technology. 16(2). 77–87. 29 indexed citations
17.
Suhling, Jeffrey C., Wayne Johnson, John L. Evans, et al.. (2002). Reliability of small BGAs in the automotive environment. IMAPSource Proceedings. 524–532. 4 indexed citations
18.
19.
Evans, John L., et al.. (1997). Economic Evaluation of Oral Sumatriptan Compared with Oral Caffeine/Ergotamine for Migraine. PharmacoEconomics. 12(5). 565–577. 28 indexed citations
20.
Evans, John L., et al.. (1994). It's just not (and not just) cricket.. 25(3). 9–12. 18 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact

Breakdown of academic impact, for papers by Ranran Liu Breakdown of academic impact, for papers by Shuaishuai Liu Breakdown of academic impact, for papers by Jie Jiao Breakdown of academic impact, for papers by Xiaohan Liu Breakdown of academic impact, for papers by Changying Wang Breakdown of academic impact, for papers by Yingli Li Breakdown of academic impact, for papers by Chih-Hao Yang Breakdown of academic impact, for papers by Qi Wu Breakdown of academic impact, for papers by Chia‐Ching Lin Breakdown of academic impact, for papers by Sergio Rivera
Rankless by CCL
2026