Chao-Pin Yeh

428 total citations
29 papers, 325 citations indexed

About

Chao-Pin Yeh is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials and Mechanical Engineering. According to data from OpenAlex, Chao-Pin Yeh has authored 29 papers receiving a total of 325 indexed citations (citations by other indexed papers that have themselves been cited), including 22 papers in Electrical and Electronic Engineering, 10 papers in Mechanics of Materials and 9 papers in Mechanical Engineering. Recurrent topics in Chao-Pin Yeh's work include Electronic Packaging and Soldering Technologies (19 papers), 3D IC and TSV technologies (11 papers) and Metal Forming Simulation Techniques (4 papers). Chao-Pin Yeh is often cited by papers focused on Electronic Packaging and Soldering Technologies (19 papers), 3D IC and TSV technologies (11 papers) and Metal Forming Simulation Techniques (4 papers). Chao-Pin Yeh collaborates with scholars based in United States, China and Taiwan. Chao-Pin Yeh's co-authors include K. Wyatt, Jing Wu, Kai Hu, Robert E. Fulton, John W. Stafford, Charles Ume, Xiaohua Wu, K.X. Hu, Keh‐Chih Hwang and Xin Wu and has published in prestigious journals such as IEEE Transactions on Components and Packaging Technologies, Journal of Electronic Packaging and Journal of Tissue Viability.

In The Last Decade

Chao-Pin Yeh

27 papers receiving 298 citations

Peers

Chao-Pin Yeh

EEE

MM

ME

IME

BE

Shuai Shao United States

Sandeep Shantaram United States

Huayan Wang United States

Guicui Fu China

Insung Hwang South Korea

A.J. Wilkinson United Kingdom

Bob Willis United Kingdom

Ning Guan China

Chengdi Xiao China

C. Maul United Kingdom

Shuai Shao United States

Chao-Pin Yeh

215 ×0.8

EEE

46 ×0.3

MM

72 ×1.0

ME

24 ×0.8

IME

45 ×1.5

BE

Citations per year, relative to Chao-Pin Yeh Chao-Pin Yeh (= 1×) peers Shuai Shao

Countries citing papers authored by Chao-Pin Yeh

Since Specialization

Citations

This map shows the geographic impact of Chao-Pin Yeh's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Chao-Pin Yeh with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Chao-Pin Yeh more than expected).

Fields of papers citing papers by Chao-Pin Yeh

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Chao-Pin Yeh. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Chao-Pin Yeh. The network helps show where Chao-Pin Yeh may publish in the future.

Co-authorship network of co-authors of Chao-Pin Yeh

This figure shows the co-authorship network connecting the top 25 collaborators of Chao-Pin Yeh. A scholar is included among the top collaborators of Chao-Pin Yeh based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Chao-Pin Yeh. Chao-Pin Yeh is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

1.

Yeh, Chao-Pin, et al.. (2024). Differences of bioelectrical impedance in the development and healing phase of pressure ulcers and erythema in mouse model. Journal of Tissue Viability. 33(2). 225–230. 1 indexed citations

2.

Yeh, Chao-Pin, Weng‐Sing Hwang, & Cherng‐Yuan Lin. (2009). Numerical simulation of residual stresses for a brake disc casting. International Journal of Cast Metals Research. 22(4). 127–130. 3 indexed citations

3.

Lu, Hua, Chao-Pin Yeh, & Jiabin Dai. (2003). Experimental evaluation of effect of global to local interaction on HDI solder joint deformation. 469–474. 1 indexed citations

4.

Su, P. P., et al.. (2003). Behavior of polymeric materials and their effects on high density PWB. 1224–1228. 1 indexed citations

5.

Wu, Xiaohua, et al.. (2002). Solder joint design optimization for fine pitch component applications. 236–240. 1 indexed citations

6.

Hua, Lu, et al.. (2002). Process induced warpage and residual stress in populated ball grid array substrate panel. 19. 151–152. 2 indexed citations

7.

Zheng, Dawei, et al.. (2002). Warpage analysis of 144-pin TQFP during reflow using image processing. 1176–1181. 5 indexed citations

8.

Wu, Xiaohua, et al.. (2002). Solder joint formation simulation and finite element analysis. 436–443. 11 indexed citations

9.

Yeh, Chao-Pin, et al.. (2002). Experimental and analytical investigation of thermally induced warpage for printed wiring boards. 382–387. 15 indexed citations

10.

Su, P. P., et al.. (2000). Behaviors of polymeric materials and their effects on high density PWB. IEEE Transactions on Components and Packaging Technologies. 23(3). 428–433. 5 indexed citations

11.

Qian, Zhengfang, et al.. (1998). Thermo-mechanical characterization of evolving packaging materials and structures : presented at the 1998 ASME International Mechanical Engineering Congress and Exposition : November 15-20, 1998, Anaheim, California. American Society of Mechanical Engineers eBooks. 1 indexed citations

12.

Gao, Qiang, et al.. (1998). <title>Experimental study on mechanical, thermomechanical, and optomechanical behaviors of holographic materials</title>. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 3294. 145–151. 1 indexed citations

13.

Fulton, Robert E., et al.. (1997). CAD-BASED ANALYSIS TOOLS FOR ELECTRONIC PACKAGING DESIGN (A New Modeling Methodology for a Virtual Development Environment ). 9 indexed citations

14.

Hu, Kai, Chao-Pin Yeh, & K. Wyatt. (1997). Electro-thermo-mechanical responses of conductive adhesive materials. IEEE Transactions on Components Packaging and Manufacturing Technology Part A. 20(4). 470–477. 26 indexed citations

15.

Wu, Xiaohua, et al.. (1997). Solder Joint Formation Simulation and Component Tombstoning Prediction During Reflow. 391–395. 1 indexed citations

16.

Wu, Sean, et al.. (1996). Cure Kinetics for Conductive Adhesives. 23–27. 1 indexed citations

17.

Hu, Kai, Chao-Pin Yeh, Xin Wu, & K. Wyatt. (1996). An Interfacial Delamination Analysis for Multichip Module Thin Film Interconnects. Journal of Electronic Packaging. 118(4). 206–213. 21 indexed citations

18.

Hu, Kai, Y. Huang, Chao-Pin Yeh, & K. Wyatt. (1996). Stress Analysis of Printed Circuit Boards With Highly Populated Solder Joints and Components: A Micromechanics Approach. Journal of Electronic Packaging. 118(2). 87–93. 1 indexed citations

19.

Yeh, Chao-Pin, et al.. (1995). Process Modeling for Multichip Module Thin Film Interconnects. 175–179. 1 indexed citations

20.

Yeh, Chao-Pin, Charles Ume, Robert E. Fulton, K. Wyatt, & John W. Stafford. (1993). Correlation of analytical and experimental approaches to determine thermally induced PWB warpage. IEEE Transactions on Components Hybrids and Manufacturing Technology. 16(8). 986–995. 39 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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