Bob Willis
Impact in
-
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Integrated Circuits and Semiconductor Failure Analysis
- General Materials Science top 10%
Papers in ⓘ
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- Industrial Vision Systems and Defect Detection 1
- Manufacturing Process and Optimization 1
- Co-authors
- C. H. Lea (1 shared paper)
- Journals
- Soldering and Surface Mount Technology (7 papers)Microelectronics International (5 papers)Circuit World (3 papers)
- Partner nations
- United KingdomUnited States
In The Last Decade
Bob Willis
14 papers receiving 270 citations
Peers
Comparison fields: 5 of 46
- Electrical and Electronic Engineering 213
- General Materials Science 11
- Mechanical Engineering 106
- Industrial and Manufacturing Engineering 25
- Automotive Engineering 23
Countries citing papers authored by Bob Willis
This map shows the geographic impact of Bob Willis's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Bob Willis with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Bob Willis more than expected).
Fields of papers citing papers by Bob Willis
This network shows the impact of papers produced by Bob Willis. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Bob Willis. The network helps show where Bob Willis may publish in the future.
Co-authors
The 1 scholars most cited alongside Bob Willis, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2003 | 77 | |
| 2 | 2003 | 41 | |
| 3 | 2004 | 38 | |
| 4 | 2003 | 34 | |
| 5 | 2005 | 29 | |
| 6 | 2003 | 22 | |
| 7 | 2003 | 20 | |
| 8 | 2003 | 9 | |
| 9 | 2003 | 9 | |
| 10 | 2005 | 6 | |
| 11 | 2003 | 3 | |
| 12 | 2006 | 2 | |
| 13 | 2008 | 1 | |
| 14 | 2004 | 1 | |
| 15 | 2009 | 0 | |
| 16 | 1992 | 0 |
About Bob Willis
Bob Willis is a scholar working on Industrial and Manufacturing Engineering, Hardware and Architecture, Electrical and Electronic Engineering, Mechanics of Materials and Mechanical Engineering, having authored 16 papers that have together received 292 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (6 papers), 3D IC and TSV technologies (5 papers), Modular Robots and Swarm Intelligence (2 papers), Material Properties and Processing (2 papers), Semiconductor materials and devices (1 paper), Industrial Vision Systems and Defect Detection (1 paper), Manufacturing Process and Optimization (1 paper) and Integrated Circuits and Semiconductor Failure Analysis (1 paper). The work is most often cited by research in Electrical and Electronic Engineering (213 citations), General Materials Science (11 citations), Mechanical Engineering (106 citations), Industrial and Manufacturing Engineering (25 citations) and Automotive Engineering (23 citations). Bob Willis has collaborated with scholars based in United Kingdom and United States. Frequent co-authors include C. H. Lea. Their work appears in journals such as Soldering and Surface Mount Technology, Microelectronics International and Circuit World.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.