Bob Willis

468 total citations
16 papers, 292 citations indexed

About

Bob Willis is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials and Mechanical Engineering. According to data from OpenAlex, Bob Willis has authored 16 papers receiving a total of 292 indexed citations (citations by other indexed papers that have themselves been cited), including 8 papers in Electrical and Electronic Engineering, 2 papers in Mechanics of Materials and 2 papers in Mechanical Engineering. Recurrent topics in Bob Willis's work include Electronic Packaging and Soldering Technologies (6 papers), 3D IC and TSV technologies (5 papers) and Modular Robots and Swarm Intelligence (2 papers). Bob Willis is often cited by papers focused on Electronic Packaging and Soldering Technologies (6 papers), 3D IC and TSV technologies (5 papers) and Modular Robots and Swarm Intelligence (2 papers). Bob Willis collaborates with scholars based in United Kingdom and United States. Bob Willis's co-authors include C. H. Lea and has published in prestigious journals such as Soldering and Surface Mount Technology, Circuit World and Microelectronics International.

In The Last Decade

Bob Willis

14 papers receiving 270 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Bob Willis United Kingdom 9 213 106 44 37 25 16 292
Chao-Pin Yeh United States 11 259 1.2× 75 0.7× 30 0.7× 135 3.6× 30 1.2× 29 325
Jun Zou China 9 160 0.8× 78 0.7× 64 1.5× 58 1.6× 26 1.0× 25 293
Scott McCann United States 12 206 1.0× 48 0.5× 37 0.8× 44 1.2× 8 0.3× 26 306
B. Bjørneklett Norway 6 218 1.0× 97 0.9× 32 0.7× 37 1.0× 48 1.9× 9 391
Nokibul Islam United States 12 349 1.6× 81 0.8× 26 0.6× 73 2.0× 33 1.3× 31 405
Kyu‐Seob Kim South Korea 9 272 1.3× 147 1.4× 8 0.2× 32 0.9× 26 1.0× 25 337
Yu-Po Wang Taiwan 11 229 1.1× 33 0.3× 39 0.9× 20 0.5× 17 0.7× 76 309
Tao Guan China 9 170 0.8× 35 0.3× 20 0.5× 37 1.0× 8 0.3× 33 322
Vladimír Kindl Czechia 11 329 1.5× 127 1.2× 24 0.5× 12 0.3× 8 0.3× 76 373

Countries citing papers authored by Bob Willis

Since Specialization
Citations

This map shows the geographic impact of Bob Willis's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Bob Willis with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Bob Willis more than expected).

Fields of papers citing papers by Bob Willis

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Bob Willis. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Bob Willis. The network helps show where Bob Willis may publish in the future.

Co-authorship network of co-authors of Bob Willis

This figure shows the co-authorship network connecting the top 25 collaborators of Bob Willis. A scholar is included among the top collaborators of Bob Willis based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Bob Willis. Bob Willis is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

16 of 16 papers shown
1.
2.
Willis, Bob. (2008). Assessment of blind via holes – an alternative approach. Circuit World. 34(2). 34–38. 1 indexed citations
3.
4.
Willis, Bob. (2005). Implementing Lead-Free Electronics. Soldering and Surface Mount Technology. 17(2). 29 indexed citations
5.
Willis, Bob. (2005). Implementing Lead-Free Electronics. Circuit World. 31(4). 6 indexed citations
6.
Willis, Bob. (2004). Printed Circuit Board Basics – An Introduction to the PCB Industry. Circuit World. 30(3). 1 indexed citations
7.
Willis, Bob. (2004). Understanding Automotive Electronics. Microelectronics International. 21(1). 38 indexed citations
8.
Willis, Bob. (2003). Reflow Soldering Processes and Troubleshooting SMT, BGA, CSP and Flip Chip Technologies. Soldering and Surface Mount Technology. 15(1). 34 indexed citations
9.
Willis, Bob. (2003). Six Sigma for Electronics Design and Manufacturing. Microelectronics International. 20(1). 22 indexed citations
10.
Willis, Bob. (2003). Environmental-Friendly Electronics: Lead-Free Technology. Soldering and Surface Mount Technology. 15(1). 9 indexed citations
11.
Willis, Bob. (2003). Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies. Microelectronics International. 20(1). 77 indexed citations
12.
Willis, Bob. (2003). Green Electronics/Green Bottom Line. Soldering and Surface Mount Technology. 15(1). 3 indexed citations
13.
Willis, Bob. (2003). Fundamentals of Microsystems Packaging. Soldering and Surface Mount Technology. 15(1). 41 indexed citations
14.
Willis, Bob. (2003). Fundamentals of Microsystems Packaging. Microelectronics International. 20(1). 9 indexed citations
15.
Willis, Bob. (2003). Microvias for Low Cost High Density Interconnects. Microelectronics International. 20(1). 20 indexed citations
16.
Lea, C. H. & Bob Willis. (1992). SMART group news. Soldering and Surface Mount Technology. 4(1). 46–50.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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