Robert Darveaux

2.6k total citations · 2 hit papers
50 papers, 2.1k citations indexed

About

Robert Darveaux is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Mechanics of Materials. According to data from OpenAlex, Robert Darveaux has authored 50 papers receiving a total of 2.1k indexed citations (citations by other indexed papers that have themselves been cited), including 47 papers in Electrical and Electronic Engineering, 17 papers in Mechanical Engineering and 7 papers in Mechanics of Materials. Recurrent topics in Robert Darveaux's work include Electronic Packaging and Soldering Technologies (43 papers), 3D IC and TSV technologies (27 papers) and Electromagnetic Compatibility and Noise Suppression (6 papers). Robert Darveaux is often cited by papers focused on Electronic Packaging and Soldering Technologies (43 papers), 3D IC and TSV technologies (27 papers) and Electromagnetic Compatibility and Noise Suppression (6 papers). Robert Darveaux collaborates with scholars based in United States, Belgium and Japan. Robert Darveaux's co-authors include K. Banerji, I. Turlik, Pradeep Lall, Nokibul Islam, Jeffrey C. Suhling, Naveen K. Singh, Md Nazmul Islam, Ahmer Syed, Curtis Zwenger and Lih‐Tyng Hwang and has published in prestigious journals such as JOM, Journal of Electronic Materials and Microelectronics Reliability.

In The Last Decade

Robert Darveaux

49 papers receiving 1.9k citations

Hit Papers

Effect of simulation methodology on solder joint crack gr... 1992 2026 2003 2014 2002 1992 100 200 300 400
What are hit papers?

Hit papers significantly outperform the citation benchmark for their cohort. A paper qualifies if it has ≥500 total citations, achieves ≥1.5× the top-1% citation threshold for papers in the same subfield and year (this is the minimum needed to enter the top 1%, not the average within it), or reaches the top citation threshold in at least one of its specific research topics.

  1. Effect of simulation methodology on solder joint crack growth correlation
    2002 423 citations Robert Darveaux profile →
  2. Constitutive relations for tin-based solder joints
    1992 384 citations Robert Darveaux, K. Banerji IEEE Transactions on Components Hybrids and Manufacturing Technology profile →

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Robert Darveaux United States 18 1.9k 821 462 265 136 50 2.1k
R. Dudek Germany 18 1.3k 0.7× 507 0.6× 421 0.9× 117 0.4× 75 0.6× 133 1.5k
Fa Xing Singapore 27 2.5k 1.3× 1.1k 1.4× 459 1.0× 250 0.9× 140 1.0× 153 2.8k
Tong Yan Tee Singapore 24 1.5k 0.8× 309 0.4× 529 1.1× 67 0.3× 94 0.7× 72 1.6k
Sven Rzepka Germany 15 906 0.5× 319 0.4× 249 0.5× 50 0.2× 102 0.8× 169 1.1k
Taejung Yeo South Korea 19 1.1k 0.6× 575 0.7× 178 0.4× 261 1.0× 181 1.3× 29 1.8k
Reza Ghaffarian United States 15 634 0.3× 203 0.2× 177 0.4× 63 0.2× 65 0.5× 101 841
James M. Pitarresi United States 17 670 0.3× 260 0.3× 331 0.7× 65 0.2× 31 0.2× 55 872
John T. Roth United States 21 1.2k 0.6× 576 0.7× 207 0.4× 55 0.2× 419 3.1× 82 1.6k
Ian Culbert Canada 15 1.1k 0.6× 626 0.8× 119 0.3× 32 0.1× 697 5.1× 30 1.6k
Michele Degano United Kingdom 27 2.0k 1.0× 569 0.7× 75 0.2× 51 0.2× 52 0.4× 174 2.3k

Countries citing papers authored by Robert Darveaux

Since Specialization
Citations

This map shows the geographic impact of Robert Darveaux's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Robert Darveaux with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Robert Darveaux more than expected).

Fields of papers citing papers by Robert Darveaux

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Robert Darveaux. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Robert Darveaux. The network helps show where Robert Darveaux may publish in the future.

Co-authorship network of co-authors of Robert Darveaux

This figure shows the co-authorship network connecting the top 25 collaborators of Robert Darveaux. A scholar is included among the top collaborators of Robert Darveaux based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Robert Darveaux. Robert Darveaux is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Darveaux, Robert. (2014). Thermal cycle fatigue life prediction for flip chip solder joints. 703–711. 10 indexed citations
2.
Syed, Ahmer, Gil Sharon, & Robert Darveaux. (2012). Factors affecting Pb-free flip chip bump reliability modeling for life prediction. 1715–1725. 4 indexed citations
3.
Darveaux, Robert, et al.. (2010). Solidification behavior of lead free and tin lead solder bumps. 1442–1447. 2 indexed citations
4.
Darveaux, Robert, et al.. (2009). Board Level Reliability Comparison of Lead Free Alloys. 11(1). 35–47. 1 indexed citations
5.
Yoo, Min Seok, et al.. (2009). Study of FC<sup>M</sup>BGA with low CTE core substrate. 2007. 301–304. 3 indexed citations
6.
Darveaux, Robert, et al.. (2009). Field use environment for a FCBGA in a laptop computer application. 1234–1239. 2 indexed citations
7.
Lee, Kiwook, Kwangho Kim, Jae-Dong Kim, et al.. (2008). Application of through mold via (TMV) as PoP base package. 1089–1092. 35 indexed citations
8.
Darveaux, Robert, et al.. (2008). Effect of joint size and pad metallization on solder mechanical properties. 113–122. 15 indexed citations
9.
Darveaux, Robert, et al.. (2006). Interface Failure in Lead Free Solder Joints. 906–917. 49 indexed citations
10.
Munukutla, Lakshmi, et al.. (2005). Graduate education with industry relevance. 22(2). 34–39.
11.
Darveaux, Robert. (2005). Shear deformation of lead free solder joints. 2. 882–893. 87 indexed citations
12.
Darveaux, Robert & Lakshmi Munukutla. (2005). Critical challenges in packaging MEMS devices. 210–216. 10 indexed citations
13.
Lall, Pradeep, Nokibul Islam, Jeffrey C. Suhling, & Robert Darveaux. (2003). BGA Reliability in Automotive Underhood Applications. 823–830. 2 indexed citations
14.
Darveaux, Robert, et al.. (2002). Temperature dependent mechanical behavior of plastic packaging materials. 1054–1058. 12 indexed citations
15.
Darveaux, Robert, et al.. (2002). Solder joint fatigue life of fleXBGA/sup TM/ assemblies. 707–712. 5 indexed citations
16.
Darveaux, Robert. (2002). Effect of Simulation Methodology on Solder Joint Crack Growth Correlation and Fatigue Life Prediction. Journal of Electronic Packaging. 124(3). 147–154. 227 indexed citations
17.
Darveaux, Robert, et al.. (1996). Reliability of Copper Baseplate High Current Power Modules. 2920(2). 389. 20 indexed citations
18.
Darveaux, Robert. (1993). Crack Initiation and Growth in Surface Mount Solder Joints. 2105. 86. 30 indexed citations
19.
Darveaux, Robert & K. Banerji. (1992). Constitutive relations for tin-based solder joints. IEEE Transactions on Components Hybrids and Manufacturing Technology. 15(6). 1013–1024. 384 indexed citations breakdown →
20.
Darveaux, Robert, Lih‐Tyng Hwang, Arnold Reisman, & I. Turlik. (1989). Thermal analysis of a multi-chip package design. Journal of Electronic Materials. 18(2). 267–274. 14 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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