Robert Darveaux
Impact in
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Integrated Circuits and Semiconductor Failure Analysis
- Silicon Carbide Semiconductor Technologies
- Mechanical Engineering top 2%
- Aluminum Alloys Composites Properties
- Advanced Welding Techniques Analysis
- Metal Forming Simulation Techniques
Papers in
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- Electronic Packaging and Soldering Technologies 43
- 3D IC and TSV technologies 27
- Electromagnetic Compatibility and Noise Suppression 6
- Integrated Circuits and Semiconductor Failure Analysis 3
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- Metal Forming Simulation Techniques 4
- Aluminum Alloys Composites Properties 4
- Intermetallics and Advanced Alloy Properties 4
- Co-authors
- K. Banerji (2 shared papers)I. Turlik (6 shared papers)Pradeep Lall (4 shared papers)Jeffrey C. Suhling (2 shared papers)Nokibul Islam (5 shared papers)Naveen K. Singh (1 shared paper)Md Nazmul Islam (1 shared paper)Lih‐Tyng Hwang (2 shared papers)
- Journals
- IEEE Transactions on Components and Packaging Technologies (2 papers)Journal of Electronic Materials (1 paper)Journal of Electronic Packaging (1 paper)Microelectronics Reliability (1 paper)JOM (1 paper)
- Partner nations
- United StatesBelgiumJapan
In The Last Decade
Robert Darveaux
49 papers receiving 1.9k citations
Robert Darveaux's Hit Papers
Peers
Comparison fields: 5 of 48
- Electrical and Electronic Engineering 1.9k
- Mechanical Engineering 821
- Mechanics of Materials 462
- Aerospace Engineering 265
- Statistics, Probability and Uncertainty 74
Countries citing papers authored by Robert Darveaux
This map shows the geographic impact of Robert Darveaux's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Robert Darveaux with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Robert Darveaux more than expected).
Fields of papers citing papers by Robert Darveaux
This network shows the impact of papers produced by Robert Darveaux. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Robert Darveaux. The network helps show where Robert Darveaux may publish in the future.
Co-authors
The 25 scholars most cited alongside Robert Darveaux, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 50 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | Effect of simulation methodology on solder joint crack growth correlation Hit paper breakdown → | 2002 | 423 |
| 2 | Constitutive relations for tin-based solder joints Hit paper breakdown → | 1992 | 384 |
| 3 | 2002 | 227 | |
| 4 | Solder Joint Fatigue Life Model | 1997 | 153 |
| 5 | 2004 | 106 | |
| 6 | 2011 | 89 | |
| 7 | 2005 | 87 | |
| 8 | 2006 | 49 | |
| 9 | 2003 | 49 | |
| 10 | 2008 | 35 | |
| 11 | 2002 | 35 | |
| 12 | 2007 | 34 | |
| 13 | 2000 | 32 | |
| 14 | Crack Initiation and Growth in Surface Mount Solder Joints | 1993 | 30 |
| 15 | 1989 | 30 | |
| 16 | 2016 | 28 | |
| 17 | 2006 | 26 | |
| 18 | Reliability of Copper Baseplate High Current Power Modules | 1996 | 20 |
| 19 | 2004 | 17 | |
| 20 | 2008 | 15 |
About Robert Darveaux
Robert Darveaux is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Mechanics of Materials, Aerospace Engineering and Materials Chemistry, having authored 50 papers that have together received 2.1k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (43 papers), 3D IC and TSV technologies (27 papers), Electromagnetic Compatibility and Noise Suppression (6 papers), Metal Forming Simulation Techniques (4 papers), Aluminum Alloys Composites Properties (4 papers), Intermetallics and Advanced Alloy Properties (4 papers), Aluminum Alloy Microstructure Properties (3 papers) and Integrated Circuits and Semiconductor Failure Analysis (3 papers). The work is most often cited by research in Electrical and Electronic Engineering (1.9k citations), Mechanical Engineering (821 citations), Mechanics of Materials (462 citations), Aerospace Engineering (265 citations) and Statistics, Probability and Uncertainty (74 citations). Robert Darveaux has collaborated with scholars based in United States, Belgium and Japan. Frequent co-authors include K. Banerji, I. Turlik, Pradeep Lall, Jeffrey C. Suhling, Nokibul Islam, Naveen K. Singh, Md Nazmul Islam, Lih‐Tyng Hwang, Ahmer Syed and Arnold Reisman. Their work appears in journals such as IEEE Transactions on Components and Packaging Technologies, Journal of Electronic Materials, Journal of Electronic Packaging, Microelectronics Reliability and JOM.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.