J. T. Wetzel

621 total citations
40 papers, 465 citations indexed

About

J. T. Wetzel is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Materials Chemistry. According to data from OpenAlex, J. T. Wetzel has authored 40 papers receiving a total of 465 indexed citations (citations by other indexed papers that have themselves been cited), including 28 papers in Electrical and Electronic Engineering, 21 papers in Electronic, Optical and Magnetic Materials and 10 papers in Materials Chemistry. Recurrent topics in J. T. Wetzel's work include Copper Interconnects and Reliability (21 papers), Semiconductor materials and devices (18 papers) and Semiconductor materials and interfaces (6 papers). J. T. Wetzel is often cited by papers focused on Copper Interconnects and Reliability (21 papers), Semiconductor materials and devices (18 papers) and Semiconductor materials and interfaces (6 papers). J. T. Wetzel collaborates with scholars based in United States, Japan and Netherlands. J. T. Wetzel's co-authors include D. A. Smith, William Krakow, Alvin L. S. Loke, S.S. Wong, C. Jin, Su-Jien Lin, Raymond N. Vrtis, P. H. Townsend, Devendra Kumar and E.S. Machlin and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Surface Science.

In The Last Decade

J. T. Wetzel

39 papers receiving 441 citations

Peers

Countries citing papers authored by J. T. Wetzel

Since Specialization

Citations

This map shows the geographic impact of J. T. Wetzel's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by J. T. Wetzel with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites J. T. Wetzel more than expected).

Fields of papers citing papers by J. T. Wetzel

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by J. T. Wetzel. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by J. T. Wetzel. The network helps show where J. T. Wetzel may publish in the future.

Co-authorship network of co-authors of J. T. Wetzel

This figure shows the co-authorship network connecting the top 25 collaborators of J. T. Wetzel. A scholar is included among the top collaborators of J. T. Wetzel based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with J. T. Wetzel. J. T. Wetzel is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

#	Work	Indexed citations
1	Implementation of an imprint damascene process for interconnect fabrication 2006 ·Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena ·Gerard M. Schmid, M. D. Stewart, J. T. Wetzel, Frank L. Palmieri, Jianjun Hao, Yukio Nishimura, (unknown), (unknown), Douglas J. Resnick, J. Alexander Liddle, C. Grant Willson	58
2	Copper drift in low-K polymer dielectrics for ULSI metallization 2002 ·Alvin L. S. Loke, J. T. Wetzel, Changsup Ryu, Won‐Jun Lee, S.S. Wong	15
3	Single and dual damascene integration of a spin-on porous ultra low-k material 2001 ·(unknown), (unknown), (unknown), (unknown), (unknown), (unknown), R. Augur, J. T. Wetzel, Robert Havemann, Atsushi Shiota	6
4	Electromigration in multilevel interconnects with polymeric low-k interlevel dielectrics 2001 ·Applied Physics Letters ·Patrick Justison, E.T. Ogawa, Paul S. Ho, M. Gall, C. Capasso, D. Jawarani, J. T. Wetzel, H. Kawasaki	1
5	A Three-phase Model for the Structure of Porous Thin Films Determined by X-ray Reflectivity and Small-Angle Neutron Scattering 2000 ·MRS Proceedings ·Wen‐Li Wu, Eric K. Lin, C. Jin, J. T. Wetzel	3
6	Evaluation of Copper Penetration in Low-κ Polymer Dielectrics by Bias-Temperature Stress 1999 ·MRS Proceedings ·Alvin L. S. Loke, S.S. Wong, N. Talwalkar, J. T. Wetzel, P. H. Townsend, (unknown), Raymond N. Vrtis, (unknown), (unknown)	6
7	Evaluation of Copper Penetration in Low-κ Polymer Dielectrics by Bias-Temperature Stress 1999 ·MRS Proceedings ·Alvin L. S. Loke, S.S. Wong, N. Talwalkar, J. T. Wetzel, P. H. Townsend, (unknown), Raymond N. Vrtis, (unknown), (unknown)	1
8	Kinetics of copper drift in low-κ polymer interlevel dielectrics 1999 ·IEEE Transactions on Electron Devices ·Alvin L. S. Loke, J. T. Wetzel, P. H. Townsend, (unknown), Raymond N. Vrtis, (unknown), Devendra Kumar, (unknown), S.S. Wong	105
9	Electrical Reliability of Cu and Low-KDielectric Integration 1998 ·MRS Proceedings ·S.S. Wong, Alvin L. S. Loke, J. T. Wetzel, P. H. Townsend, Raymond N. Vrtis, (unknown)	8
10	Electrical Extraction of The in-Plane Dielectric Constant of Fluorinated Polyimide 1997 ·MRS Proceedings ·Alvin L. S. Loke, J. T. Wetzel, John J. Stankus, S.S. Wong	1
11	Preparation of Cross Sectional TEM Samples Using Lithographic Techniques and Reactive Ion Etching 1990 ·MRS Proceedings ·J. T. Wetzel, K. L. Kavanagh	1
12	Preparation of cross‐sectional transmission electron microscopy samples by electron beam lithography and reactive ion etching 1989 ·Journal of Electron Microscopy Technique ·J. T. Wetzel	3
13	On the preparation of cross-sectional TEM samples using lithographic processing and reactive ion-etching 1989 ·Ultramicroscopy ·J. T. Wetzel, Marko Jošt, S. A. Rishton, P. M. Fryer, (unknown), D. Klaus, J. J. Bucchignano, C.‐K. Hu, Tom J. Brown	3
14	A Polishless Method For Preparation Of Cross-Sectional Tem Samples 1987 ·MRS Proceedings ·J. T. Wetzel, D. A. Danner	4
15	Analysis of computer-simulated tilted-beam images of grain boundaries 1987 ·Proceedings annual meeting Electron Microscopy Society of America ·William Krakow, J. T. Wetzel	1
16	Resistivity of AuIn2+δ thin films 1986 ·Journal of Applied Physics ·A. A. Bright, J. T. Wetzel	1
17	Dopant Diffusion in TiSi₂ 1986 ·MRS Proceedings ·F. M. d’Heurle, A. E. Michel, F. K. LeGoues, G. Scilla, J. T. Wetzel, P. Gaś	3
18	Observation and interpretation of the atomic structure of a [Sgrave] = 19/[110] (331) tilt boundary in Au thin films 1986 ·Philosophical magazine. A/Philosophical magazine. A. Physics of condensed matter. Structure, defects and mechanical properties ·William Krakow, J. T. Wetzel, D. A. Smith	59
19	Computer simulation of solute segregation to a Σ = 5 tilt boundary in Au, Cu and Ni 1984 ·Surface Science ·J. T. Wetzel, E.S. Machlin	14
20	The Microstructure of Copper Films Deposited by E-Beam Evaporation onto Thin Polyimide Films 1984 ·MRS Proceedings ·J. T. Wetzel, D. A. Smith, (unknown)	4

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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