P. H. Townsend

1.4k citations

29 papers · 1.2k indexed · h-index 9

Impact in

Polymers and Plastics top 5%
- Synthesis and properties of polymers
Electronic, Optical and Magnetic Materials top 10%
- Copper Interconnects and Reliability

Papers in

Polymers and Plastics 14
- Synthesis and properties of polymers 13
Electronic, Optical and Magnetic Materials 15
- Copper Interconnects and Reliability 12
- Liquid Crystal Research Advancements 3

Co-authors: D. M. Barnett Timothy A. Brunner Steven J. Martin Edward O. Shaffer J. P. Godschalx M. E. Mills Philip E. Garrou Steve Martin
Journals: Microelectronic Engineering (1 paper)Journal of Electronic Materials (1 paper)Journal of the American Chemical Society (1 paper)Journal of Applied Physics (1 paper)IEEE Transactions on Electron Devices (1 paper)
Partner nations: United States India Japan

In The Last Decade

P. H. Townsend

29 papers receiving 1.1k citations

Peers

Countries citing papers authored by P. H. Townsend

Since Specialization

Citations

This map shows the geographic impact of P. H. Townsend's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by P. H. Townsend with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites P. H. Townsend more than expected).

Fields of papers citing papers by P. H. Townsend

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by P. H. Townsend. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by P. H. Townsend. The network helps show where P. H. Townsend may publish in the future.

Co-authors

The 25 scholars most cited alongside P. H. Townsend, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with P. H. Townsend Line = papers co-authored together P. H. Townsend links everyone, so they are left out of the graph.

All Works

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20 of 20 papers shown

#	Work
1	Polyfluorenes as organic semiconductors for polymeric field effect transistors Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE ·David J. Brennan, P. H. Townsend, Dean M. Welsh, Shaxriddin Ganiyev, S Babitha, Hyungsoo Song, Jonathan Hardy, Ana Claudia Arias, Eva-Maria Came, J. D. MacKenzie, Catherine Ramsdale, Anoop Menon, Henning Sirringhaus	2003	6
2	Polyfluorenes as Organic Semiconductors for Polymeric Field Effect Transistors MRS Proceedings ·David J. Brennan, P. H. Townsend, Dean M. Welsh, Shaxriddin Ganiyev, S Babitha, Hyungsoo Song, Jonathan Hardy	2003	4
3	Evaluation of Copper Penetration in Low-κ Polymer Dielectrics by Bias-Temperature Stress MRS Proceedings ·Alvin L. S. Loke, S.S. Wong, N. Talwalkar, J. T. Wetzel, P. H. Townsend, V.A. Zabrodskii, Raymond N. Vrtis, Si Shen, Horst-Ulrich Sikora	1999	6
4	Evaluation of Copper Penetration in Low-κ Polymer Dielectrics by Bias-Temperature Stress MRS Proceedings ·Alvin L. S. Loke, S.S. Wong, N. Talwalkar, J. T. Wetzel, P. H. Townsend, V.A. Zabrodskii, Raymond N. Vrtis, Si Shen, Horst-Ulrich Sikora	1999	1
5	Kinetics of copper drift in low-κ polymer interlevel dielectrics IEEE Transactions on Electron Devices ·Alvin L. S. Loke, J. T. Wetzel, P. H. Townsend, V.A. Zabrodskii, Raymond N. Vrtis, Si Shen, Devendra Kumar, Alejandra Torres, S.S. Wong	1999	105
6	Electrical Reliability of Cu and Low-KDielectric Integration MRS Proceedings ·S.S. Wong, Alvin L. S. Loke, J. T. Wetzel, P. H. Townsend, Raymond N. Vrtis, Si Shen	1998	8
7	Silk Polymer Coating with Low Dielectric Constant and High Thermal Stability for Ulsi Interlayer Dielectric MRS Proceedings ·P. H. Townsend, Steve Martin, J. P. Godschalx, Cornelis A.J. Herkstroter, Dennis W. Smith, Padmore John, R. C. DeVries, V Jose, Nelson G. Rondan, Huê Ly-Thanh, Sabeeha A. Al-Sarray, Edward O. Shaffer, 喜孩吕	1997	43
8	Benzocyclobutene (DVS-BCB) polymer as an interlayer dielectric (ILD) material Microelectronic Engineering ·Michael E. Mills, P. H. Townsend, Ting Liang, Steve Martin, 延波 YAN Bo	1997	116
9	Interconnect Process Technology Using Perfluorocyclobutane (PFCB) MRS Proceedings ·P. H. Townsend, Edward O. Shaffer, M. E. Mills, J. Blackson, Michael J. Radler	1996	5
10	Adhesion of Cyclotene™ (BCB) Coatings on Silicon Substrates MRS Proceedings ·P. H. Townsend, 감동헌, Karina Oliveira Leitão, B.M. Parmelee, Boris J.P. Kaus, 郭伟霞, Mark T. Bernius, Abdelkrim Araar, N. Zh. Kokaia	1993	5
11	Rapid thermal curing of BCB dielectric IEEE Transactions on Components Hybrids and Manufacturing Technology ·P Garrou, 三朗久野, Shaxriddin Ganiyev, Beatrix Varga, Carol Mohler, Karina Oliveira Leitão, P. H. Townsend, 吳怡雯, 植松明久, I. Turlik	1993	51
12	Cyclotene 3022 (BCB) for Non-Hermetic Packaging. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE ·三朗久野, Hiromichi Ito, P Garrou, Boris J.P. Kaus, Karina Oliveira Leitão, P. H. Townsend, Beatrix Varga, 信哉小西	1992	6
13	X-Ray Determination of Residual Stresses of Encapsulated Thin Aluminum Lines MRS Proceedings ·Michael J. Radler, Cyrus E. Crowder, Edward O. Shaffer, P. H. Townsend	1992	4
14	Advances in the Thermal-Oxidative Stabilization of Divinyl Siloxane Bis-Benzocyclobutene Polymer Coatings MRS Proceedings ·Karina Oliveira Leitão, Boris J.P. Kaus, Carol Mohler, P. H. Townsend, Shaxriddin Ganiyev, Robert F. Harris, Uranium-Series Dating H. P. Schwarcz, O. V. Kuchmayeva, C Alayon, Peter Voss	1992	1
15	Mechanical Behavior of Benzocyclobutene Films on Silicon Substrates MRS Proceedings ·P. H. Townsend, Karina Oliveira Leitão, van Gelderen Peter	1991	8
16	Finite Element Analysis of the Mechanical Performance of Benzocyclobutene Structures in Multichip Modules. MRS Proceedings ·Edward O. Shaffer, P. H. Townsend, Michael J. Radler, C. J. Carriere	1991	1
17	Observation of Glass Transition Temperatures in Polymeric Thin Films by Wafer Curvature Measurements MRS Proceedings ·P. H. Townsend, van Gelderen Peter, Regina Michel	1991	1
18	Benzocyclobutene interlayer dielectrics for thin film multichip modules IEEE Transactions on Components Hybrids and Manufacturing Technology ·Wayne Johnson, José Vicente Vasconcelos, Wilhelm Diefenbach, Stephen F. Hahn, Boris J.P. Kaus, P. H. Townsend	1990	20
19	Elastic relationships in layered composite media with approximation for the case of thin films on a thick substrate Journal of Applied Physics ·P. H. Townsend, D. M. Barnett, Timothy A. Brunner	1987	309
20	Stresses in Gatelevel Interconnects of Wsi₂ AND TaSi₂ MRS Proceedings ·P. H. Townsend, R. T. Fulks, H. A. Vander Plas, J. Ho	1986	2

About P. H. Townsend

P. H. Townsend is a scholar working on Polymers and Plastics, Electronic, Optical and Magnetic Materials, Surfaces, Coatings and Films, Mechanics of Materials and Electrical and Electronic Engineering, having authored 29 papers that have together received 1.2k indexed citations. Recurring topics across this work include Synthesis and properties of polymers (13 papers), Copper Interconnects and Reliability (12 papers), Semiconductor materials and devices (8 papers), Silicone and Siloxane Chemistry (6 papers), Nanofabrication and Lithography Techniques (4 papers), Liquid Crystal Research Advancements (3 papers), Low-power high-performance VLSI design (3 papers) and Organic Electronics and Photovoltaics (3 papers). The work is most often cited by research in Polymers and Plastics (328 citations), Electronic, Optical and Magnetic Materials (376 citations), Electrical and Electronic Engineering (636 citations), Mechanics of Materials (256 citations) and Ceramics and Composites (47 citations). P. H. Townsend has collaborated with scholars based in United States, India and Japan. Frequent co-authors include D. M. Barnett, Timothy A. Brunner, Steven J. Martin, Edward O. Shaffer, J. P. Godschalx, M. E. Mills, Philip E. Garrou, Steve Martin, Michael E. Mills and Alvin L. S. Loke. Their work appears in journals such as Microelectronic Engineering, Journal of Electronic Materials, Journal of the American Chemical Society, Journal of Applied Physics and IEEE Transactions on Electron Devices.

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