E.T. Ogawa
- Electrical and Electronic Engineering top 10%
- Electronic, Optical and Magnetic Materials top 5%
- Mechanics of Materials
- Atomic and Molecular Physics, and Optics
- Materials Chemistry
- Co-authors
- Paul S. HoV. BlaschkeKi‐Don LeeJ. W. McPhersonTz-Cheng ChiuJin‐Young KimH. C. MogulLancy Tsung
- Topics
- Copper Interconnects and Reliability (14 papers)Semiconductor materials and devices (12 papers)Electronic Packaging and Soldering Technologies (11 papers)
- Cited by
- Electronic, Optical and Magnetic MaterialsElectrical and Electronic EngineeringHardware and Architecture
- Journals
- Applied Physics LettersJournal of materials research/Pratt's guide to venture capital sourcesIEEE Transactions on Reliability
- Partner nations
- United StatesNetherlandsTaiwan
In The Last Decade
E.T. Ogawa
14 papers receiving 469 citations
Peers
Comparison fields: 5 of 26
- Electrical and Electronic Engineering 484
- Electronic, Optical and Magnetic Materials 418
- Mechanics of Materials 62
- Atomic and Molecular Physics, and Optics 38
- Materials Chemistry 26
Countries citing papers authored by E.T. Ogawa
This map shows the geographic impact of E.T. Ogawa's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by E.T. Ogawa with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites E.T. Ogawa more than expected).
Fields of papers citing papers by E.T. Ogawa
This network shows the impact of papers produced by E.T. Ogawa. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by E.T. Ogawa. The network helps show where E.T. Ogawa may publish in the future.
Co-authorship network of co-authors of E.T. Ogawa
This figure shows the co-authorship network connecting the top 25 collaborators of E.T. Ogawa. A scholar is included among the top collaborators of E.T. Ogawa based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with E.T. Ogawa. E.T. Ogawa is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 24 | |
| 2 | 1 | |
| 3 | 33 | |
| 4 | 1 | |
| 5 | 9 | |
| 6 | 17 | |
| 7 | 2 | |
| 8 | 109 | |
| 9 | 81 | |
| 10 | 33 | |
| 11 | 1 | |
| 12 | 191 | |
| 13 | 1 | |
| 14 | 8 |
About E.T. Ogawa
E.T. Ogawa is a scholar working on Electronic, Optical and Magnetic Materials, Electrical and Electronic Engineering and Polymers and Plastics, having authored 14 papers that have together received 511 indexed citations. Recurring topics across this work include Copper Interconnects and Reliability (14 papers), Semiconductor materials and devices (12 papers) and Electronic Packaging and Soldering Technologies (11 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (418 citations), Electrical and Electronic Engineering (484 citations) and Hardware and Architecture (19 citations). E.T. Ogawa has collaborated with scholars based in United States, Netherlands and Taiwan. Frequent co-authors include Paul S. Ho, V. Blaschke, Ki‐Don Lee, J. W. McPherson, Tz-Cheng Chiu, Jin‐Young Kim, H. C. Mogul, Lancy Tsung, T. Bonifield and Manoj Kumar Jain. Their work appears in journals such as Applied Physics Letters, Journal of materials research/Pratt's guide to venture capital sources and IEEE Transactions on Reliability.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.