M. Gall

483 total citations
43 papers, 331 citations indexed

About

M. Gall is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Mechanics of Materials. According to data from OpenAlex, M. Gall has authored 43 papers receiving a total of 331 indexed citations (citations by other indexed papers that have themselves been cited), including 41 papers in Electrical and Electronic Engineering, 31 papers in Electronic, Optical and Magnetic Materials and 3 papers in Mechanics of Materials. Recurrent topics in M. Gall's work include Copper Interconnects and Reliability (31 papers), Electronic Packaging and Soldering Technologies (26 papers) and Semiconductor materials and devices (25 papers). M. Gall is often cited by papers focused on Copper Interconnects and Reliability (31 papers), Electronic Packaging and Soldering Technologies (26 papers) and Semiconductor materials and devices (25 papers). M. Gall collaborates with scholars based in United States, Germany and France. M. Gall's co-authors include H. Kawasaki, Paul S. Ho, Meike Hauschildt, D. Jawarani, C. Capasso, Patrick Justison, Ehrenfried Zschech, Ch. S. N. Murthy, G. Talut and Oliver Aubel and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Journal of Power Sources.

In The Last Decade

M. Gall

38 papers receiving 310 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
M. Gall United States	11	311	228	32	30	21	43	331
R. Schulz United States	7	296 1.0×	124 0.5×	30 0.9×	29 1.0×	22 1.0×	14	326
Patrick Justison United States	13	439 1.4×	305 1.3×	43 1.3×	24 0.8×	14 0.7×	45	454
M. Shinosky United States	13	307 1.0×	208 0.9×	19 0.6×	28 0.9×	19 0.9×	22	319
S. Luce United States	6	259 0.8×	146 0.6×	43 1.3×	38 1.3×	11 0.5×	11	300
Oliver Aubel Germany	11	315 1.0×	270 1.2×	47 1.5×	32 1.1×	5 0.2×	45	357
Meike Hauschildt Germany	11	284 0.9×	249 1.1×	38 1.2×	30 1.0×	4 0.2×	31	298
E.T. Ogawa United States	9	484 1.6×	418 1.8×	62 1.9×	38 1.3×	19 0.9×	14	511
R. G. Filippi United States	11	413 1.3×	345 1.5×	52 1.6×	46 1.5×	10 0.5×	42	447
Geraldine Jamieson Belgium	11	319 1.0×	125 0.5×	20 0.6×	81 2.7×	13 0.6×	26	345
K. Motoyama United States	10	203 0.7×	156 0.7×	27 0.8×	37 1.2×	5 0.2×	36	246

Countries citing papers authored by M. Gall

Since Specialization

Citations

This map shows the geographic impact of M. Gall's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by M. Gall with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites M. Gall more than expected).

Fields of papers citing papers by M. Gall

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by M. Gall. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by M. Gall. The network helps show where M. Gall may publish in the future.

Co-authorship network of co-authors of M. Gall

This figure shows the co-authorship network connecting the top 25 collaborators of M. Gall. A scholar is included among the top collaborators of M. Gall based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with M. Gall. M. Gall is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Hauschildt, Meike, et al.. (2024). A Novel Method for the Determination of Electromigration-Induced Void Nucleation Stresses. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 47. 10A.4–1. 1 indexed citations

Srinivasan, P., et al.. (2024). Thermal Considerations on RF Reliability and Aging in SOI CMOS Based Power Amplifiers. 1–6. 2 indexed citations

Sukharev, Valeriy, et al.. (2024). A Unified Physics-Based Stochastic Model for EM-Induced Resistance Degradation in BEoL Interconnect Segments. 1–10.

Srinivasan, P., Hui Xu, Oscar D. Restrepo, et al.. (2023). RF long term aging behavior and reliability in 22FDX WiFi Power Amplifier designs for 5G applications. 1–6. 3 indexed citations

Srinivasan, P., et al.. (2022). Superior Reliability and Low Self-Heating of a 45nm CMOS 39-GHz Power Amplifier for 5G mmWave Applications. thlb 2. 195–198. 1 indexed citations

Hauschildt, Meike, et al.. (2021). Strategy to Characterize Electromigration Short Length Effects in Cu/low-k Interconnects. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 1–5. 4 indexed citations

Otto, Michael, et al.. (2018). Analysis of 28 nm SRAM cell stability under mechanical load applied by nanoindentation. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 5B.1–1. 6 indexed citations

Otto, Michael, et al.. (2018). Prediction of SRAM Reliability Under Mechanical Stress Induced by Harsh En§ironments. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 178–181. 3 indexed citations

Zschech, Ehrenfried, et al.. (2015). 3D IC Stack Characterization Using Multi-Scale X-Ray Tomography. 20(1).

10.

Hauschildt, Meike, M. Gall, C. Hennesthal, et al.. (2014). Electromigration void nucleation and growth analysis using large-scale early failure statistics. AIP conference proceedings. 89–98. 6 indexed citations

11.

Sander, C., et al.. (2014). Advanced methods for mechanical and structural characterization of nanoscale materials for 3D IC integration. Microelectronics Reliability. 54(9-10). 1959–1962. 1 indexed citations

12.

Hauschildt, Meike, et al.. (2009). Large-Scale Statistics for Cu Electromigration. AIP conference proceedings. 31–46. 2 indexed citations

13.

Hauschildt, Meike, et al.. (2008). The influence of process parameters on electromigration lifetime statistics. Journal of Applied Physics. 104(4). 5 indexed citations

14.

Gall, M., et al.. (2006). Impact of stress-induced backflow on full-chip electromigration risk assessment. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. 25(6). 1038–1046. 11 indexed citations

15.

Gall, M., et al.. (2005). Optimization of charge parameters for lead–acid batteries used in photovoltaic systems. Journal of Power Sources. 144(2). 346–351. 4 indexed citations

16.

Gall, M., D. Jawarani, D. Menke, et al.. (2003). A comparison of via overetch variations between conventional Al-W and dual-inlaid copper integrations. 106–108. 1 indexed citations

17.

Justison, Patrick, E.T. Ogawa, M. Gall, et al.. (2002). Electromigration in multi-level interconnects with polymeric low-k interlevel dielectrics. 202–204. 1 indexed citations

18.

Justison, Patrick, E.T. Ogawa, Paul S. Ho, et al.. (2001). Electromigration in multilevel interconnects with polymeric low-k interlevel dielectrics. Applied Physics Letters. 79(26). 4414–4416. 1 indexed citations

19.

Gall, M., et al.. (2000). Detection and analysis of early failures in electromigration. Applied Physics Letters. 76(7). 843–845. 15 indexed citations

20.

Gall, M., et al.. (1998). Critical Length and Resistance Saturation Effects in Al(Cu) Interconnects. MRS Proceedings. 516. 3 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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