Emilie Bourjot
Impact in
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Integrated Circuits and Semiconductor Failure Analysis
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- Additive Manufacturing and 3D Printing Technologies
Papers in
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- 3D IC and TSV technologies 8
- Electronic Packaging and Soldering Technologies 7
- Silicon and Solar Cell Technologies 3
- Ferroelectric and Negative Capacitance Devices 1
- Silicon Carbide Semiconductor Technologies 1
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- Semiconductor materials and interfaces 4
- Co-authors
- Frank Fournel (8 shared papers)Loïc Sanchez (4 shared papers)F. Nemouchi (4 shared papers)N. Bresson (3 shared papers)S. Chéramy (2 shared papers)Pierre Montméat (4 shared papers)Johanna Swan (2 shared papers)S. Borel (1 shared paper)
- Journals
- Microelectronic Engineering (1 paper)Journal of Applied Physics (1 paper)ECS Transactions (2 papers)2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (1 paper)HAL (Le Centre pour la Communication Scientifique Directe) (5 papers)
- Partner nations
- FranceUnited StatesAustria
In The Last Decade
Emilie Bourjot
10 papers receiving 73 citations
Peers
Comparison fields: 5 of 12
- Electrical and Electronic Engineering 69
- Automotive Engineering 13
- Industrial and Manufacturing Engineering 7
- Atomic and Molecular Physics, and Optics 15
- Biomedical Engineering 16
Countries citing papers authored by Emilie Bourjot
This map shows the geographic impact of Emilie Bourjot's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Emilie Bourjot with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Emilie Bourjot more than expected).
Fields of papers citing papers by Emilie Bourjot
This network shows the impact of papers produced by Emilie Bourjot. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Emilie Bourjot. The network helps show where Emilie Bourjot may publish in the future.
Co-authors
The 25 scholars most cited alongside Emilie Bourjot, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2021 | 16 | |
| 2 | 2022 | 12 | |
| 3 | 2020 | 11 | |
| 4 | 2019 | 9 | |
| 5 | 2023 | 9 | |
| 6 | 2013 | 7 | |
| 7 | 2017 | 4 | |
| 8 | 2013 | 4 | |
| 9 | 2022 | 3 | |
| 10 | 2015 | 2 | |
| 11 | 2023 | 0 | |
| 12 | 2023 | 0 |
About Emilie Bourjot
Emilie Bourjot is a scholar working on Electrical and Electronic Engineering, Atomic and Molecular Physics, and Optics, Mechanical Engineering, Biomedical Engineering and Industrial and Manufacturing Engineering, having authored 12 papers that have together received 77 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (8 papers), Electronic Packaging and Soldering Technologies (7 papers), Semiconductor materials and interfaces (4 papers), Silicon and Solar Cell Technologies (3 papers), Modular Robots and Swarm Intelligence (2 papers), Ferroelectric and Negative Capacitance Devices (1 paper), Silicon Carbide Semiconductor Technologies (1 paper) and Industrial Vision Systems and Defect Detection (1 paper). The work is most often cited by research in Electrical and Electronic Engineering (69 citations), Automotive Engineering (13 citations), Industrial and Manufacturing Engineering (7 citations), Atomic and Molecular Physics, and Optics (15 citations) and Biomedical Engineering (16 citations). Emilie Bourjot has collaborated with scholars based in France, United States and Austria. Frequent co-authors include Frank Fournel, Loïc Sanchez, F. Nemouchi, N. Bresson, S. Chéramy, Pierre Montméat, Johanna Swan, S. Borel, T. Enot and M. Grégoire. Their work appears in journals such as Microelectronic Engineering, Journal of Applied Physics, ECS Transactions, 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) and HAL (Le Centre pour la Communication Scientifique Directe).
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.