Nelson Fan
Impact in
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Integrated Circuits and Semiconductor Failure Analysis
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- Advanced Surface Polishing Techniques
- Nanofabrication and Lithography Techniques
Papers in
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- 3D IC and TSV technologies 8
- Electronic Packaging and Soldering Technologies 8
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- Additive Manufacturing and 3D Printing Technologies 3
- Co-authors
- Jingshen Wu (1 shared paper)Kim S. Lau (1 shared paper)John H. Lau (9 shared papers)Margie Li (5 shared papers)Eric Kuah (5 shared papers)K. H. Tan (5 shared papers)Kai Wu (6 shared papers)Sze Pei Lim (4 shared papers)
- Journals
- IEEE Transactions on Components Packaging and Manufacturing Technology (2 papers)Journal of Electronic Packaging (1 paper)IMAPSource Proceedings (2 papers)
- Partner nations
- United StatesChinaUnited Kingdom
In The Last Decade
Nelson Fan
7 papers receiving 129 citations
Peers
Comparison fields: 5 of 24
- Electrical and Electronic Engineering 138
- Biomedical Engineering 60
- Ceramics and Composites 5
- Electronic, Optical and Magnetic Materials 16
- Hardware and Architecture 5
Countries citing papers authored by Nelson Fan
This map shows the geographic impact of Nelson Fan's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Nelson Fan with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Nelson Fan more than expected).
Fields of papers citing papers by Nelson Fan
This network shows the impact of papers produced by Nelson Fan. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Nelson Fan. The network helps show where Nelson Fan may publish in the future.
Co-authors
The 25 scholars most cited alongside Nelson Fan, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2004 | 58 | |
| 2 | 2018 | 40 | |
| 3 | 2017 | 27 | |
| 4 | 2017 | 11 | |
| 5 | 2015 | 7 | |
| 6 | 2017 | 5 | |
| 7 | 2018 | 3 | |
| 8 | 2017 | 3 | |
| 9 | 2017 | 1 | |
| 10 | 2015 | 1 |
About Nelson Fan
Nelson Fan is a scholar working on Electrical and Electronic Engineering, Automotive Engineering, Electronic, Optical and Magnetic Materials, Mechanics of Materials and Biomedical Engineering, having authored 10 papers that have together received 156 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (8 papers), Electronic Packaging and Soldering Technologies (8 papers), Additive Manufacturing and 3D Printing Technologies (3 papers), Copper Interconnects and Reliability (3 papers), Material Properties and Processing (2 papers), Advanced ceramic materials synthesis (1 paper), Nanofabrication and Lithography Techniques (1 paper) and Advanced Surface Polishing Techniques (1 paper). The work is most often cited by research in Electrical and Electronic Engineering (138 citations), Biomedical Engineering (60 citations), Ceramics and Composites (5 citations), Electronic, Optical and Magnetic Materials (16 citations) and Hardware and Architecture (5 citations). Nelson Fan has collaborated with scholars based in United States, China and United Kingdom. Frequent co-authors include Jingshen Wu, Kim S. Lau, John H. Lau, Margie Li, Eric Kuah, K. H. Tan, Kai Wu, Sze Pei Lim, Xi Cao and Rozalia Beica. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology, Journal of Electronic Packaging and IMAPSource Proceedings.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.