Nelson Fan

783 total citations
10 papers, 156 citations indexed

About

Nelson Fan is a scholar working on Electrical and Electronic Engineering, Automotive Engineering and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, Nelson Fan has authored 10 papers receiving a total of 156 indexed citations (citations by other indexed papers that have themselves been cited), including 9 papers in Electrical and Electronic Engineering, 3 papers in Automotive Engineering and 3 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in Nelson Fan's work include 3D IC and TSV technologies (8 papers), Electronic Packaging and Soldering Technologies (8 papers) and Copper Interconnects and Reliability (3 papers). Nelson Fan is often cited by papers focused on 3D IC and TSV technologies (8 papers), Electronic Packaging and Soldering Technologies (8 papers) and Copper Interconnects and Reliability (3 papers). Nelson Fan collaborates with scholars based in United States, China and United Kingdom. Nelson Fan's co-authors include Jingshen Wu, Kim S. Lau, John H. Lau, Eric Kuah, Margie Li, Kai Wu, K. H. Tan, Cheng-Ta Ko, Rozalia Beica and Sze Pei Lim and has published in prestigious journals such as Journal of Electronic Packaging, IEEE Transactions on Components Packaging and Manufacturing Technology and IMAPSource Proceedings.

In The Last Decade

Nelson Fan

7 papers receiving 129 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
Nelson Fan United States	6	138	60	22	16	12	10	156
Siddharth Ravichandran United States	12	287 2.1×	50 0.8×	13 0.6×	18 1.1×	7 0.6×	24	327
El Mehdi Bazizi United States	8	228 1.7×	43 0.7×	13 0.6×	12 0.8×	6 0.5×	50	250
V. Balan France	8	141 1.0×	36 0.6×	7 0.3×	35 2.2×	7 0.6×	21	156
Vincent Fiori France	11	292 2.1×	71 1.2×	45 2.0×	52 3.3×	38 3.2×	50	321
Arnaud Garnier France	7	102 0.7×	19 0.3×	15 0.7×	12 0.8×	6 0.5×	27	123
H.Y. Li Singapore	10	304 2.2×	77 1.3×	17 0.8×	35 2.2×	6 0.5×	35	328
Gokul Kumar United States	6	223 1.6×	48 0.8×	11 0.5×	19 1.2×	5 0.4×	15	243
Dan Kinzer United States	11	318 2.3×	15 0.3×	24 1.1×	20 1.3×	8 0.7×	31	333
K. Soejima Japan	8	272 2.0×	46 0.8×	16 0.7×	30 1.9×	27 2.3×	16	297
T. Kangasvieri Finland	12	374 2.7×	24 0.4×	63 2.9×	15 0.9×	10 0.8×	30	394

Countries citing papers authored by Nelson Fan

Since Specialization

Citations

This map shows the geographic impact of Nelson Fan's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Nelson Fan with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Nelson Fan more than expected).

Fields of papers citing papers by Nelson Fan

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Nelson Fan. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Nelson Fan. The network helps show where Nelson Fan may publish in the future.

Co-authorship network of co-authors of Nelson Fan

This figure shows the co-authorship network connecting the top 25 collaborators of Nelson Fan. A scholar is included among the top collaborators of Nelson Fan based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Nelson Fan. Nelson Fan is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

Sort: Min cites: Since: Top N: Style:

10 of 10 papers shown

1.

Lau, John H., W. Kai, Nelson Fan, et al.. (2018). Warpage Measurements and Characterizations of Fan-Out Wafer-Level Packaging with Large Chips and Multiple Redistributed Layers. 20. 594–600. 3 indexed citations

2.

Lau, John H., Ming Li, Lei Yang, et al.. (2018). Warpage Measurements and Characterizations of Fan-Out Wafer-Level Packaging With Large Chips and Multiple Redistributed Layers. IEEE Transactions on Components Packaging and Manufacturing Technology. 8(10). 1729–1737. 40 indexed citations

3.

Li, Ming, John H. Lau, Nelson Fan, et al.. (2017). Characterizations of Fan-out Wafer-Level Packaging. IMAPSource Proceedings. 2017(1). 557–562. 5 indexed citations

4.

Chan, Catherine, et al.. (2017). Challenges of Large Format Packaging and Some of Its Assembly Solutions. IMAPSource Proceedings. 2017(1). 747–753. 1 indexed citations

5.

Fan, Nelson, et al.. (2017). Dispensing challenges of large format packaging and some of its possible solutions. 4. 1–6. 3 indexed citations

6.

Lau, John H., Ming Li, Nelson Fan, et al.. (2017). Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging. 595–602. 27 indexed citations

7.

Zhang, Li, Dong Chen, K. H. Tan, et al.. (2017). Development of chip-first and die-up fan-out wafer level packaging. 1–6. 11 indexed citations

8.

Lau, John H., Qinglong Zhang, Ming Li, et al.. (2015). Stencil Printing of Underfill for Flip Chips on Organic-Panel and Si-Wafer Substrates. IEEE Transactions on Components Packaging and Manufacturing Technology. 5(7). 1027–1035. 7 indexed citations

9.

Lau, John H., Qinglong Zhang, Ming Li, et al.. (2015). Stencil printing of underfill for flip chips on organic-panel and Si-wafer assemblies. 23. 168–174. 1 indexed citations

10.

Fan, Nelson, et al.. (2004). Effects of Wafer Thinning Condition on the Roughness, Morphology and Fracture Strength of Silicon Die. Journal of Electronic Packaging. 126(1). 110–114. 58 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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