E. Auerswald

544 citations

22 papers · 399 indexed · h-index 7

Impact in

Electrical and Electronic Engineering top 10%
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Integrated Circuits and Semiconductor Failure Analysis
- Silicon Carbide Semiconductor Technologies
- Electromagnetic Compatibility and Noise Suppression
Mechanical Engineering
- Aluminum Alloys Composites Properties
- Advanced Welding Techniques Analysis

Papers in

Biomedical Engineering 14
- Advanced Surface Polishing Techniques 10
Electrical and Electronic Engineering 14
- Electronic Packaging and Soldering Technologies 7
- 3D IC and TSV technologies 6
- Advanced MEMS and NEMS Technologies 4
- Integrated Circuits and Semiconductor Failure Analysis 3

Co-authors: B. Michel H. Reichl R. Dudek Andreas Schubert Sven Rzepka D. Vogel Bernhard Wunderle Bernd Michel
Journals: Microelectronics Reliability (3 papers)Microsystem Technologies (1 paper)Materials science forum (3 papers)Crystal Research and Technology (1 paper)Procedia Engineering (1 paper)
Partner nations: Germany United Kingdom Spain

In The Last Decade

E. Auerswald

22 papers receiving 366 citations

Peers

Countries citing papers authored by E. Auerswald

Since Specialization

Citations

This map shows the geographic impact of E. Auerswald's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by E. Auerswald with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites E. Auerswald more than expected).

Fields of papers citing papers by E. Auerswald

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by E. Auerswald. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by E. Auerswald. The network helps show where E. Auerswald may publish in the future.

Co-authors

The 22 scholars most cited alongside E. Auerswald, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with E. Auerswald Line = papers co-authored together E. Auerswald links everyone, so they are left out of the graph.

All Works

Sort: Min cites: Since: Top N: Style:

20 of 20 papers shown

#	Work
1	Paving the way for the replacement of solder interconnections in power electronics by silver-sinter using pulsed infrared thermography Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) ·築人中嶋, D.C.M. Fokoua, Hassiba Fadli, 全诚, Eduardo José Cornejo Alvarado, Dalbanbay Amantay, 勝法野村, E. Auerswald, Mohamad Abo Ras	2019	5
2	Investigations of the impact of initial stresses on fracture and delamination risks of an avionics MEMS pressure sensor Microelectronics Reliability ·姜天元, E. Auerswald, Christine Collet, Nancy Zambrano Ariza, D. Vogel, Th. Winkler, Sven Rzepka	2018	4
3	Effects of residual stresses on cracking and delamination risks of an avionics MEMS pressure sensor Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) ·Bodo Ehling, E. Auerswald, Christine Collet, Nancy Zambrano Ariza, D. Vogel, Th. Winkler, Sven Rzepka	2017	1
4	Fast and trusted intrinsic stress measurement to facilitate improved reliability assessments Microelectronics Reliability ·D. Vogel, E. Auerswald, Dny Sandra da Silva Souza, Sven Rzepka	2016	1
5	Investigating fracture strength of poly-silicon membranes using microscopic loading tests and numerical simulation Microsystem Technologies ·Fatma Şule Tanrıverdi, Alfons Dehé, E. Auerswald, R. Dudek, Мустафина Светлана Семеновна, Bernd Michel, Sven Rzepka	2015	2
6	Determination of residual stress with high spatial resolution at TSVs for 3D integration: Comparison between HR-XRD, Raman spectroscopy and fibDAC Fraunhofer-Publica (Fraunhofer-Gesellschaft) ·D. Vogel, 윤용인, E. Auerswald, O. Hölck, Peter Ramm, Bernhard Wunderle, Farzana Liza	2014	2
7	Residual stress investigations at TSVs in 3D micro structures by HR-XRD, Raman spectroscopy and fibDAC Fraunhofer-Publica (Fraunhofer-Gesellschaft) ·윤용인, D. Vogel, E. Auerswald, O. Hölck, Júlio César Dutra, Peter Ramm, Farzana Liza, Bernhard Wunderle	2014	9
8	Statistical strength investigation of poly-silicon membranes using microscopic loading tests and numerical simulation Fraunhofer-Publica (Fraunhofer-Gesellschaft) ·Fatma Şule Tanrıverdi, E. Auerswald, R. Dudek, Bernhard Wunderle, Bernd Michel, Sven Rzepka, Alfons Dehé	2014	1
9	Integrated Investigation Approach for Determining Mechanical Properties of Poly-silicon Membranes Procedia Engineering ·Fatma Şule Tanrıverdi, Alfons Dehé, E. Auerswald, R. Dudek, Bernd Michel, Sven Rzepka	2014	3
10	Design for reliability of BEoL and 3-D TSV structures – A joint effort of FEA and innovative experimental techniques AIP conference proceedings ·姜天元, Мустафина Светлана Семеновна, E. Auerswald, Sven Rzepka, Bernd Michel	2014	2
11	Stress analyses of high spatial resolution on TSV and BEoL structures Microelectronics Reliability ·D. Vogel, E. Auerswald, 姜天元, Suvarna Manjre, Raúl D. Rodriguez, Dietrich R. T. Zahn, Sven Rzepka, B. Michel	2014	18
12	Measuring techniques for deformation and stress analysis in micro-dimensions Fraunhofer-Publica (Fraunhofer-Gesellschaft) ·D. Vogel, E. Auerswald, Bodo Ehling, Sven Rzepka, B. Michel	2013	5
13	Nonlinear copper behavior of TSV for 3D-IC-integration and cracking risks during BEoL-built-up Fraunhofer-Publica (Fraunhofer-Gesellschaft) ·Bodo Ehling, Мустафина Светлана Семеновна, E. Auerswald, Sven Rzepka, Bernd Michel	2011	5
14	Accelerated Active High-Temperature Cycling Test for Power MOSFETs Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) ·Fares Djama, Bernhard Wunderle, E. Auerswald, B. Michel, H. Reichl	2006	12
15	Evaluation of Metallic Nano-Lawn Structures for Application in Microelectronic Packaging Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) ·S. Fiedler, Л. Г. Кретова, Ralf Schmidt, E. Auerswald, Matthias Klein, ЭРНЕСТ ВЛАДИМИРОВИЧ БИРИХ, H. Reichl	2006	9
16	FibDAC - Residual Stress Determination by Combination of Focused Ion Beam Technique and Digital Image Correlation Materials science forum ·سالم بن محمد السالم, Astrid Gollhardt, Мустафина Светлана Семеновна, E. Auerswald, N. Sabaté, Bodo Ehling, Bernd Michel	2006	6
17	Raman spectroscopic and X‐ray investigation of stressed states in diamond‐like carbon films Crystal Research and Technology ·М.К. Паравян, Miguel Damas-Fuentes, E. Auerswald, 秀夫落合	2004	2
18	Thermo-mechanical reliability of lead-free solder interconnects Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) ·Andreas Schubert, R. Dudek, Antoni (1944-2020). Nowakowski, H. Walter, E. Auerswald, Astrid Gollhardt, B. Michel	2002	5
19	Use of an X-Ray Imaging Plate for Stress Analysis Materials science forum ·JS Leske, Miguel Damas-Fuentes, Е И Березниченко, E. Auerswald, Marie Piraud	1994	10
20	X-Ray Analysis of Residual Stresses and Textures in Thin Coatings Materials science forum ·JS Leske, Miguel Damas-Fuentes, E. Auerswald	1993	4

About E. Auerswald

E. Auerswald is a scholar working on Biomedical Engineering, Electrical and Electronic Engineering, Mechanical Engineering, Surfaces, Coatings and Films and Mechanics of Materials, having authored 22 papers that have together received 399 indexed citations. Recurring topics across this work include Advanced Surface Polishing Techniques (10 papers), Electronic Packaging and Soldering Technologies (7 papers), 3D IC and TSV technologies (6 papers), Advanced MEMS and NEMS Technologies (4 papers), Integrated Circuits and Semiconductor Failure Analysis (3 papers), Welding Techniques and Residual Stresses (3 papers), Force Microscopy Techniques and Applications (2 papers) and Aluminum Alloy Microstructure Properties (2 papers). The work is most often cited by research in Electrical and Electronic Engineering (358 citations), Mechanical Engineering (159 citations), Mechanics of Materials (81 citations), Ceramics and Composites (12 citations) and Aerospace Engineering (49 citations). E. Auerswald has collaborated with scholars based in Germany, United Kingdom and Spain. Frequent co-authors include B. Michel, H. Reichl, R. Dudek, Andreas Schubert, Sven Rzepka, D. Vogel, Bernhard Wunderle, Bernd Michel, Astrid Gollhardt and Dietrich R. T. Zahn. Their work appears in journals such as Microelectronics Reliability, Microsystem Technologies, Materials science forum, Crystal Research and Technology and Procedia Engineering.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact