Bernd Michel

968 total citations
90 papers, 708 citations indexed

About

Bernd Michel is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials and Mechanical Engineering. According to data from OpenAlex, Bernd Michel has authored 90 papers receiving a total of 708 indexed citations (citations by other indexed papers that have themselves been cited), including 60 papers in Electrical and Electronic Engineering, 33 papers in Mechanics of Materials and 28 papers in Mechanical Engineering. Recurrent topics in Bernd Michel's work include Electronic Packaging and Soldering Technologies (39 papers), 3D IC and TSV technologies (18 papers) and Advanced Surface Polishing Techniques (16 papers). Bernd Michel is often cited by papers focused on Electronic Packaging and Soldering Technologies (39 papers), 3D IC and TSV technologies (18 papers) and Advanced Surface Polishing Techniques (16 papers). Bernd Michel collaborates with scholars based in Germany, United Kingdom and Spain. Bernd Michel's co-authors include R. Dudek, Sven Rzepka, Bernhard Wunderle, Astrid Gollhardt, H. Reichl, Ajit Khosla, Hidemitsu Furukawa, M. J. Wolf, Nils Jürgensen and O. Ehrmann and has published in prestigious journals such as Sensors and Actuators A Physical, Journal of Microelectromechanical Systems and Advanced Engineering Materials.

In The Last Decade

Bernd Michel

86 papers receiving 687 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Bernd Michel Germany 14 519 191 189 136 96 90 708
Miloslav Ohlídal Czechia 14 141 0.3× 98 0.5× 103 0.5× 165 1.2× 112 1.2× 62 484
H. Kück Germany 14 607 1.2× 149 0.8× 68 0.4× 331 2.4× 72 0.8× 44 774
T. Kunio Japan 17 556 1.1× 121 0.6× 123 0.7× 95 0.7× 173 1.8× 72 772
Khosro Madanipour Iran 12 175 0.3× 65 0.3× 123 0.7× 119 0.9× 70 0.7× 59 462
Q. Shan United Kingdom 13 110 0.2× 121 0.6× 278 1.5× 174 1.3× 54 0.6× 29 476
Binbin Jiao China 15 363 0.7× 274 1.4× 52 0.3× 153 1.1× 111 1.2× 90 745
Guoliang Deng China 15 387 0.7× 42 0.2× 99 0.5× 159 1.2× 86 0.9× 109 714
Qinghua Mao China 12 112 0.2× 154 0.8× 97 0.5× 63 0.5× 65 0.7× 49 416
Przemysław Łopato Poland 14 276 0.5× 146 0.8× 166 0.9× 126 0.9× 13 0.1× 61 491

Countries citing papers authored by Bernd Michel

Since Specialization
Citations

This map shows the geographic impact of Bernd Michel's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Bernd Michel with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Bernd Michel more than expected).

Fields of papers citing papers by Bernd Michel

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Bernd Michel. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Bernd Michel. The network helps show where Bernd Michel may publish in the future.

Co-authorship network of co-authors of Bernd Michel

This figure shows the co-authorship network connecting the top 25 collaborators of Bernd Michel. A scholar is included among the top collaborators of Bernd Michel based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Bernd Michel. Bernd Michel is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Rzepka, Sven, et al.. (2014). An accelerated method for characterization of bi-material interfaces in microelectronic packages under cyclic loading conditions. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 24. 1–7. 10 indexed citations
2.
Michel, Bernd, et al.. (2012). Humidity effects on the fatigue of fiber reinforced polymers in micro/nano functional systems. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 199–202. 2 indexed citations
3.
Rzepka, Sven, et al.. (2011). Local stress measurement on metal lines and dielectrics of BEoL pattern by stress relief technique. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 2. 1–3. 5 indexed citations
4.
Achenbach, Sven, David M. Klymyshyn, & Bernd Michel. (2010). Special issue of the 8th International Workshop on High Aspect Ratio Micro Structure Technology, HARMST 2009. Microsystem Technologies. 16(8-9). 1285–1285. 1 indexed citations
5.
Dudek, R., et al.. (2009). An Integrated Experimental and Theoretical Approach to Evaluate Si Strength Dependent on the Processing History. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 139–145. 5 indexed citations
6.
Wolf, M. J., Bernhard Wunderle, Nils Jürgensen, et al.. (2008). High aspect ratio TSV copper filling with different seed layers. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 563–570. 90 indexed citations
7.
Rzepka, Sven, et al.. (2007). Dynamic mechanical behavior of SnAgCu BGA solder joints determined by fast shear tests and FEM simulations. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 1–4. 9 indexed citations
8.
Klein, Matthias, et al.. (2007). Optimization of Electronics Assemblies towards Robust Design under Fracture, Delamination and Fatigue Aspects. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 2. 1–7. 17 indexed citations
9.
Sabaté, N., et al.. (2006). FIB-based measurement of local residual stresses on microsystems. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 6175. 617505–617505. 2 indexed citations
10.
Gollhardt, Astrid, et al.. (2006). FibDAC - Residual Stress Determination by Combination of Focused Ion Beam Technique and Digital Image Correlation. Materials science forum. 524-525. 121–126. 6 indexed citations
11.
Wittler, Olaf, et al.. (2005). Thermo-mechanical analysis of advanced electronic packages in early system design. Microsystem Technologies. 12(1-2). 75–81. 3 indexed citations
12.
Gollhardt, Astrid, et al.. (2004). Characterization of microcracks by application of digital image correlation to SPM images. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 5392. 43–43. 3 indexed citations
13.
Gollhardt, Astrid, et al.. (2003). Evaluating microdefect structures by AFM-based deformation measurement. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 5045. 1–1. 5 indexed citations
14.
Michel, Bernd, et al.. (2001). Characterization of electronic packaging materials and components by image correlation methods. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 4596. 237–237. 3 indexed citations
15.
Michel, Bernd, et al.. (1999). <title>Strain measurement in micrometrology</title>. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 3897. 224–238. 5 indexed citations
16.
Michel, Bernd, et al.. (1999). <title>Vibration measurement of microstructures by means of laser-optical modal analysis</title>. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 3825. 72–79. 12 indexed citations
17.
Michel, Bernd, et al.. (1998). Mechanical properties of microsystem components. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 3479. 140–140. 1 indexed citations
18.
Schubert, Andreas, et al.. (1997). Fracture and Damage Evaluation in Chip Scale Packages and Flip-Chip-Assemblies by FEA and MicroDAC. 133–138. 14 indexed citations
19.
Michel, Bernd, et al.. (1994). <title>Strain and displacement measurements for microsystems technology</title>. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 2342. 209–218. 3 indexed citations
20.
Michel, Bernd. (1977). Zur elastischen Wechselwirkung von Punktdefekten und Einschlüssen in der Nähe von Festkörperoberflächen. Kristall und Technik. 12(10). 1013–1018. 5 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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