E. Meusel

747 total citations
26 papers, 594 citations indexed

About

E. Meusel is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Mechanics of Materials. According to data from OpenAlex, E. Meusel has authored 26 papers receiving a total of 594 indexed citations (citations by other indexed papers that have themselves been cited), including 25 papers in Electrical and Electronic Engineering, 11 papers in Mechanical Engineering and 3 papers in Mechanics of Materials. Recurrent topics in E. Meusel's work include Electronic Packaging and Soldering Technologies (21 papers), 3D IC and TSV technologies (18 papers) and Advanced Welding Techniques Analysis (4 papers). E. Meusel is often cited by papers focused on Electronic Packaging and Soldering Technologies (21 papers), 3D IC and TSV technologies (18 papers) and Advanced Welding Techniques Analysis (4 papers). E. Meusel collaborates with scholars based in Germany, United States and Australia. E. Meusel's co-authors include Steffen Wiese, Sven Rzepka, Klaus‐Jürgen Wolter, Kaustav Banerjee, Chenming Hu, M. A. Korhonen, B. Michel, H. Walter, Andreas Schubert and C.-Y. Li and has published in prestigious journals such as Sensors and Actuators A Physical, Polymers for Advanced Technologies and Journal of Electronic Packaging.

In The Last Decade

E. Meusel

25 papers receiving 546 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
E. Meusel Germany	12	561	271	112	74	43	26	594
Masazumi Amagai United States	9	508 0.9×	315 1.2×	147 1.3×	72 1.0×	18 0.4×	29	549
Paresh Limaye Belgium	13	480 0.9×	177 0.7×	64 0.6×	41 0.6×	51 1.2×	30	523
B.S. Xiong Singapore	13	643 1.1×	387 1.4×	114 1.0×	117 1.6×	11 0.3×	16	661
E. Auerswald Germany	7	358 0.6×	159 0.6×	81 0.7×	49 0.7×	13 0.3×	22	399
Pilin Liu United States	8	332 0.6×	169 0.6×	42 0.4×	31 0.4×	34 0.8×	20	377
P.L. Tu Hong Kong	10	510 0.9×	358 1.3×	47 0.4×	66 0.9×	22 0.5×	18	537
R.N. Master United States	13	355 0.6×	70 0.3×	62 0.6×	15 0.2×	35 0.8×	40	414
V. Sarihan United States	12	352 0.6×	155 0.6×	167 1.5×	30 0.4×	29 0.7×	37	455
H. Pape Germany	15	578 1.0×	194 0.7×	279 2.5×	9 0.1×	23 0.5×	58	713
Yasumitsu Orii Japan	15	566 1.0×	162 0.6×	20 0.2×	23 0.3×	50 1.2×	72	622

Countries citing papers authored by E. Meusel

Since Specialization

Citations

This map shows the geographic impact of E. Meusel's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by E. Meusel with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites E. Meusel more than expected).

Fields of papers citing papers by E. Meusel

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by E. Meusel. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by E. Meusel. The network helps show where E. Meusel may publish in the future.

Co-authorship network of co-authors of E. Meusel

This figure shows the co-authorship network connecting the top 25 collaborators of E. Meusel. A scholar is included among the top collaborators of E. Meusel based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with E. Meusel. E. Meusel is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Meusel, E., et al.. (2006). Influence of Medical Sterilization on Material Systems of Electronics. 1252–1254. 1 indexed citations

Wiese, Steffen, E. Meusel, & Klaus‐Jürgen Wolter. (2004). Microstructural dependence of constitutive properties of eutectic SnAg and SnAgCu solders. 197–206. 78 indexed citations

Wiese, Steffen & E. Meusel. (2003). Characterization of Lead-Free Solders in Flip Chip Joints. Journal of Electronic Packaging. 125(4). 531–538. 32 indexed citations

Wiese, Steffen, Sven Rzepka, & E. Meusel. (2003). Time-independent plastic behaviour of solders and its effect on FEM simulations for electronics packages. 104–111. 14 indexed citations

Wiese, Steffen, et al.. (2003). Creep and crack propagation in flip chip SnPb37 solder joints. 1015–1020. 11 indexed citations

Rzepka, Sven, et al.. (2002). Stress analysis and design optimization of a wafer-level CSP by FEM simulations and experiments. 704–714. 15 indexed citations

Jakschik, S., et al.. (2002). Mechanism and growth rate of underfill delaminations in flip chips. 98–103. 5 indexed citations

Meusel, E., et al.. (2002). A cost-effective assembly process for flip chips on FR-4. 8. 427–433. 1 indexed citations

Rzepka, Sven, et al.. (2002). The effect of underfill imperfections on the reliability of flip chip modules: FEM simulations and experiments. 64. 362–370. 7 indexed citations

10.

Rzepka, Sven, et al.. (2002). Stress analysis and design optimization of a wafer-level CSP by FEM simulations and experiments. IEEE Transactions on Electronics Packaging Manufacturing. 25(2). 127–137. 8 indexed citations

11.

Meusel, E., et al.. (2002). Flexible polyimide interposer for CSP preparation. 112–115. 1 indexed citations

12.

Wiese, Steffen, et al.. (2002). Characterisation of constitutive behaviour of SnAg, SnAgCu and SnPb solder in flip chip joints. Sensors and Actuators A Physical. 99(1-2). 188–193. 66 indexed citations

13.

Wiese, Steffen, et al.. (2001). Constitutive behaviour of lead-free solders vs. lead-containing solders-experiments on bulk specimens and flip-chip joints. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 890–902. 115 indexed citations

14.

Wilde, Juergen, et al.. (2000). 3D Si‐on‐Si stack packaging. Soldering and Surface Mount Technology. 12(1). 35–39. 3 indexed citations

15.

Rzepka, Sven, et al.. (1999). 3-D finite element simulator for migration effects due to various driving forces in interconnect lines. AIP conference proceedings. 150–161. 17 indexed citations

16.

Rzepka, Sven, M. A. Korhonen, E. Meusel, & C.-Y. Li. (1998). The Effect of Underfill and Underfill Delamination on the Thermal Stress in Flip-Chip Solder Joints. Journal of Electronic Packaging. 120(4). 342–348. 40 indexed citations

17.

Meusel, E., et al.. (1998). Conductive polymers for microelectronic packaging: chip bonding to polymer films. Polymers for Advanced Technologies. 9(10-11). 806–811. 6 indexed citations

18.

Wiese, Steffen, et al.. (1998). Experimental Characterization of Material Properties of 63Sn37Pb Flip Chip Solder Joints. MRS Proceedings. 515. 21 indexed citations

19.

Meusel, E., et al.. (1997). Polypyrrole as an interlayer for bonding conductive adhesives to activated aluminum bond pads. IEEE Transactions on Components Packaging and Manufacturing Technology Part A. 20(1). 9–14. 6 indexed citations

20.

Rzepka, Sven, et al.. (1995). Adhesive stabilised and pure flip chips on various substrates under thermocycling. Microsystem Technologies. 1(3). 129–136. 13 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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