E. Meusel
Impact in
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Integrated Circuits and Semiconductor Failure Analysis
- Silicon Carbide Semiconductor Technologies
- Mechanical Engineering top 10%
- Aluminum Alloys Composites Properties
- Advanced Welding Techniques Analysis
- Metal Forming Simulation Techniques
Papers in
-
- Electronic Packaging and Soldering Technologies 21
- 3D IC and TSV technologies 18
- Silicon Carbide Semiconductor Technologies 3
- Electrostatic Discharge in Electronics 2
- Integrated Circuits and Semiconductor Failure Analysis 2
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- Advanced Welding Techniques Analysis 4
- Intermetallics and Advanced Alloy Properties 3
- Co-authors
- Steffen Wiese (10 shared papers)Sven Rzepka (13 shared papers)Klaus‐Jürgen Wolter (2 shared papers)Chenming Hu (1 shared paper)Kaustav Banerjee (1 shared paper)M. A. Korhonen (5 shared papers)H. Walter (1 shared paper)Andreas Schubert (1 shared paper)
- Journals
- Journal of Electronic Packaging (2 papers)IEEE Transactions on Electronics Packaging Manufacturing (1 paper)Sensors and Actuators A Physical (1 paper)Microsystem Technologies (1 paper)Polymers for Advanced Technologies (1 paper)
- Partner nations
- GermanyUnited StatesAustralia
In The Last Decade
E. Meusel
25 papers receiving 546 citations
Peers
Comparison fields: 5 of 37
- Electrical and Electronic Engineering 561
- Mechanical Engineering 271
- General Materials Science 17
- Mechanics of Materials 112
- Aerospace Engineering 74
Countries citing papers authored by E. Meusel
This map shows the geographic impact of E. Meusel's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by E. Meusel with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites E. Meusel more than expected).
Fields of papers citing papers by E. Meusel
This network shows the impact of papers produced by E. Meusel. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by E. Meusel. The network helps show where E. Meusel may publish in the future.
Co-authors
The 15 scholars most cited alongside E. Meusel, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 26 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2001 | 115 | |
| 2 | 1998 | 90 | |
| 3 | 2004 | 78 | |
| 4 | 2002 | 66 | |
| 5 | 1998 | 40 | |
| 6 | 2003 | 32 | |
| 7 | 2002 | 26 | |
| 8 | 1998 | 21 | |
| 9 | 1999 | 17 | |
| 10 | 2002 | 15 | |
| 11 | 2003 | 14 | |
| 12 | 1995 | 13 | |
| 13 | 2003 | 11 | |
| 14 | 2002 | 9 | |
| 15 | 2002 | 8 | |
| 16 | 2002 | 7 | |
| 17 | 1997 | 6 | |
| 18 | 1998 | 6 | |
| 19 | 2002 | 5 | |
| 20 | 2000 | 3 |
About E. Meusel
E. Meusel is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Mechanics of Materials, Biomedical Engineering and Automotive Engineering, having authored 26 papers that have together received 594 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (21 papers), 3D IC and TSV technologies (18 papers), Advanced Welding Techniques Analysis (4 papers), Silicon Carbide Semiconductor Technologies (3 papers), Intermetallics and Advanced Alloy Properties (3 papers), Electrostatic Discharge in Electronics (2 papers), Integrated Circuits and Semiconductor Failure Analysis (2 papers) and Additive Manufacturing and 3D Printing Technologies (2 papers). The work is most often cited by research in Electrical and Electronic Engineering (561 citations), Mechanical Engineering (271 citations), General Materials Science (17 citations), Mechanics of Materials (112 citations) and Aerospace Engineering (74 citations). E. Meusel has collaborated with scholars based in Germany, United States and Australia. Frequent co-authors include Steffen Wiese, Sven Rzepka, Klaus‐Jürgen Wolter, Chenming Hu, Kaustav Banerjee, M. A. Korhonen, H. Walter, Andreas Schubert, B. Michel and C.-Y. Li. Their work appears in journals such as Journal of Electronic Packaging, IEEE Transactions on Electronics Packaging Manufacturing, Sensors and Actuators A Physical, Microsystem Technologies and Polymers for Advanced Technologies.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.