O. Hölck
Impact in
- Polymers and Plastics top 10%
- Polymer crystallization and properties
- Synthesis and properties of polymers
- Mechanical Engineering top 10%
- Membrane Separation and Gas Transport
- Epoxy Resin Curing Processes
Papers in ⓘ
-
- Electronic Packaging and Soldering Technologies 17
- 3D IC and TSV technologies 11
-
- Epoxy Resin Curing Processes 11
- Co-authors
- Martin Böhning (5 shared papers)Matthias Heuchel (5 shared papers)Martin Siegert (4 shared papers)Bernhard Wunderle (24 shared papers)Dieter Hofmann (4 shared papers)B. Michel (10 shared papers)Steffen Hartmann (9 shared papers)H. Walter (12 shared papers)
In The Last Decade
O. Hölck
59 papers receiving 559 citations
Peers
Comparison fields: 5 of 56
- Polymers and Plastics 134
- Mechanical Engineering 249
- Mechanics of Materials 126
- Electrical and Electronic Engineering 229
- Materials Chemistry 158
Countries citing papers authored by O. Hölck
This map shows the geographic impact of O. Hölck's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by O. Hölck with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites O. Hölck more than expected).
Fields of papers citing papers by O. Hölck
This network shows the impact of papers produced by O. Hölck. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by O. Hölck. The network helps show where O. Hölck may publish in the future.
Co-authors
The 25 scholars most cited alongside O. Hölck, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 60 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2012 | 70 | |
| 2 | 2006 | 49 | |
| 3 | 2006 | 37 | |
| 4 | 2021 | 29 | |
| 5 | 2007 | 28 | |
| 6 | 1980 | 28 | |
| 7 | 2010 | 27 | |
| 8 | 2017 | 25 | |
| 9 | 2012 | 18 | |
| 10 | 2014 | 15 | |
| 11 | 2014 | 12 | |
| 12 | 2012 | 12 | |
| 13 | 2011 | 11 | |
| 14 | 2014 | 11 | |
| 15 | 2003 | 11 | |
| 16 | 2009 | 11 | |
| 17 | 2022 | 10 | |
| 18 | 2021 | 10 | |
| 19 | 2011 | 10 | |
| 20 | 2022 | 9 |
About O. Hölck
O. Hölck is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Materials Chemistry, Mechanics of Materials and Biomedical Engineering, having authored 60 papers that have together received 579 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (17 papers), Epoxy Resin Curing Processes (11 papers), 3D IC and TSV technologies (11 papers), Force Microscopy Techniques and Applications (10 papers), Polymer crystallization and properties (10 papers), Carbon Nanotubes in Composites (9 papers), Mechanical Behavior of Composites (7 papers) and Advanced Surface Polishing Techniques (5 papers). The work is most often cited by research in Polymers and Plastics (134 citations), Mechanical Engineering (249 citations), Mechanics of Materials (126 citations), Electrical and Electronic Engineering (229 citations) and Materials Chemistry (158 citations). O. Hölck has collaborated with scholars based in Germany, Denmark and Poland. Frequent co-authors include Martin Böhning, Matthias Heuchel, Martin Siegert, Bernhard Wunderle, Dieter Hofmann, B. Michel, Steffen Hartmann, H. Walter, Olaf Wittler and J. Bauer. Their work appears in journals such as Microelectronics Reliability, Journal of Polymer Science Part B Polymer Physics, Solar Energy, Macromolecules and Journal of Membrane Science.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.