O. Hölck

744 total citations
60 papers, 579 citations indexed

About

O. Hölck is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Materials Chemistry. According to data from OpenAlex, O. Hölck has authored 60 papers receiving a total of 579 indexed citations (citations by other indexed papers that have themselves been cited), including 25 papers in Electrical and Electronic Engineering, 20 papers in Mechanical Engineering and 17 papers in Materials Chemistry. Recurrent topics in O. Hölck's work include Electronic Packaging and Soldering Technologies (17 papers), 3D IC and TSV technologies (11 papers) and Epoxy Resin Curing Processes (11 papers). O. Hölck is often cited by papers focused on Electronic Packaging and Soldering Technologies (17 papers), 3D IC and TSV technologies (11 papers) and Epoxy Resin Curing Processes (11 papers). O. Hölck collaborates with scholars based in Germany, Denmark and Poland. O. Hölck's co-authors include Matthias Heuchel, Martin Böhning, Martin Siegert, Bernhard Wunderle, Dieter Hofmann, B. Michel, Steffen Hartmann, H. Walter, Olaf Wittler and J. Bauer and has published in prestigious journals such as Journal of Applied Physics, Macromolecules and Journal of Membrane Science.

In The Last Decade

O. Hölck

59 papers receiving 559 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
O. Hölck Germany 12 249 229 158 134 126 60 579
F. Chávez Mexico 14 279 1.1× 228 1.0× 236 1.5× 52 0.4× 43 0.3× 71 657
Cheng‐Yu He China 20 296 1.2× 219 1.0× 253 1.6× 41 0.3× 38 0.3× 58 1.0k
Bowen Yu China 16 169 0.7× 129 0.6× 226 1.4× 30 0.2× 102 0.8× 36 649
T. Kaźmierczak Poland 11 94 0.4× 210 0.9× 156 1.0× 244 1.8× 98 0.8× 24 663
J. Wang China 15 185 0.7× 201 0.9× 357 2.3× 75 0.6× 61 0.5× 28 624
Kun Hu China 14 153 0.6× 198 0.9× 260 1.6× 210 1.6× 107 0.8× 37 658
Hanying Zou China 12 326 1.3× 124 0.5× 358 2.3× 67 0.5× 53 0.4× 17 722
Zenji Kato Japan 19 298 1.2× 227 1.0× 417 2.6× 32 0.2× 55 0.4× 45 801
Ke Shan China 16 131 0.5× 365 1.6× 426 2.7× 87 0.6× 72 0.6× 38 782

Countries citing papers authored by O. Hölck

Since Specialization
Citations

This map shows the geographic impact of O. Hölck's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by O. Hölck with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites O. Hölck more than expected).

Fields of papers citing papers by O. Hölck

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by O. Hölck. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by O. Hölck. The network helps show where O. Hölck may publish in the future.

Co-authorship network of co-authors of O. Hölck

This figure shows the co-authorship network connecting the top 25 collaborators of O. Hölck. A scholar is included among the top collaborators of O. Hölck based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with O. Hölck. O. Hölck is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
2.
Braun, Tanja, et al.. (2024). In-Package Characterization of Dielectrics Using Ring Resonators and Adaptive 3D EM-Simulations Around 77 GHz. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 272–275. 2 indexed citations
3.
Hölck, O., et al.. (2023). Improving Warpage Characterization of Large Wafers in Fan-Out Packaging Technology. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 1332–1338. 2 indexed citations
4.
Braun, Tanja, O. Hölck, S. Voges, et al.. (2023). A Closer Look to Fan-out Panel Level Packaging. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 1–3. 1 indexed citations
5.
Hölck, O., et al.. (2022). Multiscale warpage behaviour in a Fan-Out Panel during thermal cycles. Microelectronics Reliability. 138. 114641–114641. 9 indexed citations
6.
7.
Fleischmann, M., et al.. (2021). Cure Kinetics Modeling of a High Glass Transition Temperature Epoxy Molding Compound (EMC) Based on Inline Dielectric Analysis. Polymers. 13(11). 1734–1734. 29 indexed citations
8.
Braun, Tanja, J. Bauer, K.-F. Becker, et al.. (2015). Influence of humidity on reliability of plastic packages. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 1–6. 3 indexed citations
9.
Hartmann, Steffen, Sascha Hermann, Marc Heggen, et al.. (2015). Towards nanoreliability of CNT-based sensor applications: Investigations of CNT-metal interfaces combining molecular dynamics simulations, advanced in situ experiments and analytics. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 1–8. 3 indexed citations
10.
Vogel, D., et al.. (2014). Determination of residual stress with high spatial resolution at TSVs for 3D integration: Comparison between HR-XRD, Raman spectroscopy and fibDAC. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 2. 1–8. 2 indexed citations
11.
Hölck, O., M. C. Nuss, H. Walter, et al.. (2014). Development of process and design criteria for stress management in through silicon vias. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 625–630. 12 indexed citations
12.
Walter, H., J. Bauer, Tanja Braun, et al.. (2012). In-situ - characterization of moisture induced swelling behaviour of microelectronic relevant polymers. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 1/6–6/6. 1 indexed citations
13.
Hölck, O., et al.. (2011). Basic thermo-mechanical property estimation of a 3D-crosslinked epoxy/SiO2 interface using molecular modelling. Microelectronics Reliability. 51(6). 1027–1034. 11 indexed citations
14.
Hölck, O., et al.. (2010). A Multiscale Modeling Approach for Microelectronic Packaging Applications. TechConnect Briefs. 2(2010). 174–177. 5 indexed citations
15.
Hölck, O., et al.. (2010). Molecular modeling of a 3D-crosslinked epoxy resin and its interface to native SiO<inf>2</inf> — Property prediction in microelectronic packaging. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 135–143. 6 indexed citations
16.
Hölck, O., et al.. (2010). Molecular modelling of microelectronic packaging materials - basic thermo-mechanical property estimation of a 3D-crosslinked epoxy / SiO<inf>2</inf> interface. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 1–10. 3 indexed citations
17.
Hölck, O., et al.. (2010). Numerical approach to multiscale evaluation and analysis of Tg of crosslinked polymers. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 1–4. 2 indexed citations
18.
Wunderle, Bernhard, O. Hölck, J. Bauer, et al.. (2010). Molecular dynamics approach to structure–property correlation in epoxy resins for thermo-mechanical lifetime modeling. Microelectronics Reliability. 50(7). 900–909. 27 indexed citations
19.
Hölck, O., Matthias Heuchel, Martin Böhning, & Dieter Hofmann. (2007). Simulation of experimentally observed dilation phenomena during integral gas sorption in glassy polymers. Journal of Polymer Science Part B Polymer Physics. 46(1). 59–71. 28 indexed citations
20.
Köhl, M., Markus Heck, Ulrich Frei, et al.. (2000). Materials in Solar Thermal Collectors. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 3 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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