P. Alpern
Impact in
- Mechanics of Materials top 10%
- Mechanical Behavior of Composites
- Material Properties and Processing
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- Electronic Packaging and Soldering Technologies
- Integrated Circuits and Semiconductor Failure Analysis
- 3D IC and TSV technologies
- Silicon Carbide Semiconductor Technologies
- Semiconductor materials and devices
- Electrostatic Discharge in Electronics
Papers in
-
- Electronic Packaging and Soldering Technologies 19
- 3D IC and TSV technologies 13
- Integrated Circuits and Semiconductor Failure Analysis 8
- Electrostatic Discharge in Electronics 5
- Semiconductor materials and devices 3
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- Material Properties and Processing 5
- Ultrasonics and Acoustic Wave Propagation 4
- Co-authors
- R. TilgnerM. StecherJürgen WildeR. DudekHartmut GüntherStefan WurmR. KakoschkeMatthias Stecher
In The Last Decade
P. Alpern
32 papers receiving 311 citations
Peers
Comparison fields: 5 of 38
- Mechanics of Materials 125
- Electrical and Electronic Engineering 269
- Mechanical Engineering 64
- Electronic, Optical and Magnetic Materials 31
- Ceramics and Composites 7
Countries citing papers authored by P. Alpern
This map shows the geographic impact of P. Alpern's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by P. Alpern with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites P. Alpern more than expected).
Fields of papers citing papers by P. Alpern
This network shows the impact of papers produced by P. Alpern. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by P. Alpern. The network helps show where P. Alpern may publish in the future.
Co-authors
The 14 scholars most cited alongside P. Alpern, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2009 | 18 | |
| 2 | 2009 | 16 | |
| 3 | 2006 | 1 | |
| 4 | 2005 | 7 | |
| 5 | 2003 | 4 | |
| 6 | 2002 | 16 | |
| 7 | 2002 | 11 | |
| 8 | 2002 | 7 | |
| 9 | 2001 | 9 | |
| 10 | 2000 | 13 | |
| 11 | 1995 | 3 | |
| 12 | 1995 | 2 | |
| 13 | 1994 | 11 | |
| 14 | 1994 | 10 | |
| 15 | 1992 | 10 | |
| 16 | 1989 | 3 | |
| 17 | 1989 | 5 | |
| 18 | 1988 | 26 | |
| 19 | 1988 | 1 | |
| 20 | 1986 | 1 |
About P. Alpern
P. Alpern is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials, Industrial and Manufacturing Engineering, Mechanical Engineering and Electronic, Optical and Magnetic Materials, having authored 32 papers that have together received 325 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (19 papers), 3D IC and TSV technologies (13 papers), Integrated Circuits and Semiconductor Failure Analysis (8 papers), Material Properties and Processing (5 papers), Electrostatic Discharge in Electronics (5 papers), Ultrasonics and Acoustic Wave Propagation (4 papers), High Temperature Alloys and Creep (3 papers) and Semiconductor materials and devices (3 papers). The work is most often cited by research in Mechanics of Materials (125 citations), Electrical and Electronic Engineering (269 citations), Mechanical Engineering (64 citations), Electronic, Optical and Magnetic Materials (31 citations) and Ceramics and Composites (7 citations). P. Alpern has collaborated with scholars based in Germany and Singapore. Frequent co-authors include R. Tilgner, M. Stecher, Jürgen Wilde, R. Dudek, Hartmut Günther, Stefan Wurm, R. Kakoschke, Matthias Stecher, B. Michel and K. Müller. Their work appears in journals such as IEEE Transactions on Device and Materials Reliability, IEEE Transactions on Components and Packaging Technologies, Microelectronics Reliability, Applied Physics Letters and Journal of The Electrochemical Society.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.