Sven Rzepka
-
- Electronic Packaging and Soldering Technologies 108
- 3D IC and TSV technologies 57
- Silicon Carbide Semiconductor Technologies 27
- Integrated Circuits and Semiconductor Failure Analysis 20
- Electrostatic Discharge in Electronics 16
- Electromagnetic Compatibility and Noise Suppression 14
- Mechanics of Materials top 5%
- Mechanical Behavior of Composites 16
- Mechanical Engineering top 10%
- General Materials Science top 10%
-
- Advanced Surface Polishing Techniques 20
- Co-authors
- E. MeuselSteffen WieseR. DudekM. A. KorhonenBernhard WunderleBernd MichelKaustav BanerjeeB. Michel
- Journals
- Journal of Electronic Materials (1 paper)Microelectronics Reliability (12 papers)Microelectronic Engineering (1 paper)
- Partner nations
- GermanyUnited StatesUnited Kingdom
In The Last Decade
Sven Rzepka
155 papers receiving 1.0k citations
Peers
Comparison fields: 5 of 62
- Electrical and Electronic Engineering 906
- Mechanics of Materials 249
- Mechanical Engineering 319
- General Materials Science 14
- Electronic, Optical and Magnetic Materials 82
Countries citing papers authored by Sven Rzepka
This map shows the geographic impact of Sven Rzepka's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Sven Rzepka with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Sven Rzepka more than expected).
Fields of papers citing papers by Sven Rzepka
This network shows the impact of papers produced by Sven Rzepka. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Sven Rzepka. The network helps show where Sven Rzepka may publish in the future.
Co-authorship network
The 25 scholars most cited alongside Sven Rzepka, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2024 | 1 | |
| 2 | 2024 | 0 | |
| 3 | 2024 | 2 | |
| 4 | 2023 | 2 | |
| 5 | 2020 | 10 | |
| 6 | 2020 | 1 | |
| 7 | 2019 | 13 | |
| 8 | Evaluation of Ag-sinter and CuSn-TLP Based Joining Technologies on Lead Frame | 2018 | 2 |
| 9 | Reliability Investigation on SiC BJT Power Module | 2016 | 2 |
| 10 | 2016 | 9 | |
| 11 | Evaluation of pattern scale stress effects of 28nm technology during wire bond and Cu pillar flip chip assembly | 2015 | 1 |
| 12 | 2013 | 14 | |
| 13 | 2012 | 2 | |
| 14 | DoE simulations and measurements with the microDAC stress chip for material and package investigations | 2011 | 2 |
| 15 | 2010 | 3 | |
| 16 | Accelerating the temperature cycling tests of FBGA memory components with lead-free solder joints without changing the damage mechanism | 2009 | 1 |
| 17 | Thermo mechanical characterization of packaging polymers | 2009 | 7 |
| 18 | 2009 | 5 | |
| 19 | 2002 | 15 | |
| 20 | 2000 | 6 |
About Sven Rzepka
Sven Rzepka is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials and Mechanical Engineering, having authored 169 papers that have together received 1.1k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (108 papers), 3D IC and TSV technologies (57 papers), Silicon Carbide Semiconductor Technologies (27 papers), Advanced Surface Polishing Techniques (20 papers), Integrated Circuits and Semiconductor Failure Analysis (20 papers), Electrostatic Discharge in Electronics (16 papers), Mechanical Behavior of Composites (16 papers) and Electromagnetic Compatibility and Noise Suppression (14 papers). The work is most often cited by research in Electrical and Electronic Engineering (906 citations), Mechanics of Materials (249 citations) and Mechanical Engineering (319 citations). Sven Rzepka has collaborated with scholars based in Germany, United States and United Kingdom. Frequent co-authors include E. Meusel, Steffen Wiese, R. Dudek, M. A. Korhonen, Bernhard Wunderle, Bernd Michel, Kaustav Banerjee, B. Michel, Chenming Hu and Alexander Otto. Their work appears in journals such as Journal of Electronic Materials, Microelectronics Reliability and Microelectronic Engineering.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.