Sven Rzepka

1.5k total citations
169 papers, 1.1k citations indexed

About

Sven Rzepka is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Mechanics of Materials. According to data from OpenAlex, Sven Rzepka has authored 169 papers receiving a total of 1.1k indexed citations (citations by other indexed papers that have themselves been cited), including 141 papers in Electrical and Electronic Engineering, 54 papers in Mechanical Engineering and 47 papers in Mechanics of Materials. Recurrent topics in Sven Rzepka's work include Electronic Packaging and Soldering Technologies (108 papers), 3D IC and TSV technologies (57 papers) and Silicon Carbide Semiconductor Technologies (27 papers). Sven Rzepka is often cited by papers focused on Electronic Packaging and Soldering Technologies (108 papers), 3D IC and TSV technologies (57 papers) and Silicon Carbide Semiconductor Technologies (27 papers). Sven Rzepka collaborates with scholars based in Germany, United States and United Kingdom. Sven Rzepka's co-authors include E. Meusel, Steffen Wiese, R. Dudek, M. A. Korhonen, Bernhard Wunderle, Bernd Michel, B. Michel, Kaustav Banerjee, Chenming Hu and Alexander Otto and has published in prestigious journals such as Journal of Electronic Materials, Microelectronics Reliability and Microelectronic Engineering.

In The Last Decade

Sven Rzepka

155 papers receiving 1.0k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Sven Rzepka Germany 15 906 319 249 123 102 169 1.1k
R. Dudek Germany 18 1.3k 1.4× 507 1.6× 421 1.7× 105 0.9× 75 0.7× 133 1.5k
Tong Yan Tee Singapore 24 1.5k 1.7× 309 1.0× 529 2.1× 62 0.5× 94 0.9× 72 1.6k
Darvin Edwards United States 15 781 0.9× 424 1.3× 159 0.6× 134 1.1× 91 0.9× 35 991
Reza Ghaffarian United States 15 634 0.7× 203 0.6× 177 0.7× 107 0.9× 65 0.6× 101 841
J. Swingler United Kingdom 17 362 0.4× 645 2.0× 323 1.3× 235 1.9× 150 1.5× 76 976
Vanessa Smet United States 16 1.7k 1.8× 316 1.0× 71 0.3× 107 0.9× 193 1.9× 92 1.9k
Chang-Lin Yeh Taiwan 20 996 1.1× 382 1.2× 305 1.2× 42 0.3× 203 2.0× 67 1.1k
Daniele Rosato Germany 19 446 0.5× 197 0.6× 350 1.4× 117 1.0× 248 2.4× 31 1.0k
Wei Xue China 17 330 0.4× 561 1.8× 152 0.6× 146 1.2× 163 1.6× 42 845
Robert Darveaux United States 18 1.9k 2.1× 821 2.6× 462 1.9× 57 0.5× 136 1.3× 50 2.1k

Countries citing papers authored by Sven Rzepka

Since Specialization
Citations

This map shows the geographic impact of Sven Rzepka's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Sven Rzepka with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Sven Rzepka more than expected).

Fields of papers citing papers by Sven Rzepka

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Sven Rzepka. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Sven Rzepka. The network helps show where Sven Rzepka may publish in the future.

Co-authorship network of co-authors of Sven Rzepka

This figure shows the co-authorship network connecting the top 25 collaborators of Sven Rzepka. A scholar is included among the top collaborators of Sven Rzepka based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Sven Rzepka. Sven Rzepka is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Rzepka, Sven, et al.. (2024). Influence of Reducing the Load Level of Mission Profiles on the Remaining Useful Life of a TO220 Analyzed with a Surrogate Model. PHM Society European Conference. 8(1). 6–6. 1 indexed citations
2.
Dudek, R., et al.. (2022). Modelling Thermal Fatigue in Power Electronics. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 1–11. 5 indexed citations
3.
Dudek, R., et al.. (2021). Lifetime modelling of sintered silver interconnected power devices by FEM and experiment. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 11 indexed citations
4.
Dudek, R., et al.. (2020). Analysis of Solder Fatigue on Mounted Test Assemblies under Thermal Cycling Loads. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 1–8. 1 indexed citations
5.
Dudek, R., et al.. (2019). A Combined Methodology to Include System Effects in Board-Level Stress Simulations. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 1–9. 1 indexed citations
6.
Otto, Alexander, R. Dudek, Weishan Wang, et al.. (2018). Evaluation of Ag-sinter and CuSn-TLP Based Joining Technologies on Lead Frame. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 1–8. 2 indexed citations
7.
Dudek, R., et al.. (2018). “3rd Level” Solder Joint Reliability Investigations for Transfer of Consumer Electronics in Automotive Use. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 173–179. 3 indexed citations
8.
Rzepka, Sven, et al.. (2018). Transient Electro-Thermal Coupled System Simulation - Modeling Approach and Experimental Validation. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 889–896. 4 indexed citations
9.
Otto, Alexander, et al.. (2016). Reliability Investigation on SiC BJT Power Module. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 1–9. 2 indexed citations
10.
Breuer, D., et al.. (2015). Evaluation of pattern scale stress effects of 28nm technology during wire bond and Cu pillar flip chip assembly. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 1–6. 1 indexed citations
11.
Rzepka, Sven, et al.. (2015). An in-situ numerical-experimental approach for fatigue delamination characterization in Microelectronic Packages. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 54. 1–6. 5 indexed citations
12.
Dudek, R., Peter Sommer, Andreas Fix, Sven Rzepka, & B. Michel. (2013). Reliability issues for high temperature interconnections based on transient liquid phase soldering. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 1–8. 14 indexed citations
13.
Dudek, R., et al.. (2013). On the crack and delamination risk optimization of a Si-interposer for LED packaging. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 1–5. 2 indexed citations
14.
Otto, Alexander, et al.. (2011). DoE simulations and measurements with the microDAC stress chip for material and package investigations. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 1–5. 2 indexed citations
15.
Otto, Alexander, et al.. (2010). DoE simulations and measurements with the MicroDAC stress chip for material and package investigations. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 1–4. 3 indexed citations
16.
Jansen, K.M.B., et al.. (2009). Thermo mechanical characterization of packaging polymers. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 1–10. 7 indexed citations
17.
Gromala, Przemyslaw Jakub, et al.. (2009). Accelerating the temperature cycling tests of FBGA memory components with lead-free solder joints without changing the damage mechanism. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 1–8. 1 indexed citations
18.
Dudek, R., et al.. (2009). An Integrated Experimental and Theoretical Approach to Evaluate Si Strength Dependent on the Processing History. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 139–145. 5 indexed citations
19.
Gromala, Przemyslaw Jakub, et al.. (2009). Accurate thermal cycle lifetime estimation for BGA memory components with lead-free solder joints. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 1–9. 3 indexed citations
20.
Rzepka, Sven & B. Neidhart. (2000). Transport processes through track-etch membrane filters in a reagent delivery cell. Fresenius Journal of Analytical Chemistry. 366(4). 336–340. 6 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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