R.N. Master

568 total citations
40 papers, 414 citations indexed

About

R.N. Master is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Mechanics of Materials. According to data from OpenAlex, R.N. Master has authored 40 papers receiving a total of 414 indexed citations (citations by other indexed papers that have themselves been cited), including 37 papers in Electrical and Electronic Engineering, 5 papers in Mechanical Engineering and 4 papers in Mechanics of Materials. Recurrent topics in R.N. Master's work include Electronic Packaging and Soldering Technologies (31 papers), 3D IC and TSV technologies (25 papers) and Electromagnetic Compatibility and Noise Suppression (6 papers). R.N. Master is often cited by papers focused on Electronic Packaging and Soldering Technologies (31 papers), 3D IC and TSV technologies (25 papers) and Electromagnetic Compatibility and Noise Suppression (6 papers). R.N. Master collaborates with scholars based in United States, Canada and South Korea. R.N. Master's co-authors include Madhavan Swaminathan, Maxat Touzelbaev, Richard C. Blish, Jung-Hwan Choi, Sumit Kumar Ray, Myung Jin Yim, Yizhang Yang, C.P. Wong, Daniel F. Baldwin and Rao Tummala and has published in prestigious journals such as Science Advances, IBM Journal of Research and Development and IEEE Transactions on Electromagnetic Compatibility.

In The Last Decade

R.N. Master

39 papers receiving 395 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
R.N. Master United States 13 355 70 62 45 36 40 414
Tai Chong Chai Singapore 12 450 1.3× 111 1.6× 42 0.7× 28 0.6× 68 1.9× 56 474
W. Wondrak Germany 13 493 1.4× 63 0.9× 20 0.3× 64 1.4× 37 1.0× 60 565
E. Auerswald Germany 7 358 1.0× 159 2.3× 81 1.3× 36 0.8× 34 0.9× 22 399
Srikrishna Sitaraman United States 13 516 1.5× 57 0.8× 50 0.8× 33 0.7× 76 2.1× 56 567
Siva P. Gurrum United States 9 158 0.4× 157 2.2× 36 0.6× 111 2.5× 44 1.2× 34 364
David Tarng Taiwan 13 353 1.0× 70 1.0× 46 0.7× 31 0.7× 62 1.7× 50 407
P. Alpern Germany 12 269 0.8× 64 0.9× 125 2.0× 16 0.4× 23 0.6× 32 325
Paresh Limaye Belgium 13 480 1.4× 177 2.5× 64 1.0× 40 0.9× 44 1.2× 30 523
Mirng-Ji Lii Taiwan 11 194 0.5× 130 1.9× 109 1.8× 160 3.6× 35 1.0× 32 390
Pilin Liu United States 8 332 0.9× 169 2.4× 42 0.7× 76 1.7× 18 0.5× 20 377

Countries citing papers authored by R.N. Master

Since Specialization
Citations

This map shows the geographic impact of R.N. Master's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by R.N. Master with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites R.N. Master more than expected).

Fields of papers citing papers by R.N. Master

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by R.N. Master. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by R.N. Master. The network helps show where R.N. Master may publish in the future.

Co-authorship network of co-authors of R.N. Master

This figure shows the co-authorship network connecting the top 25 collaborators of R.N. Master. A scholar is included among the top collaborators of R.N. Master based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with R.N. Master. R.N. Master is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Rahman, Md. Saifur, Ahnsei Shon, Myeong Namkoong, et al.. (2025). Soft, stretchable conductive hydrogels for high-performance electronic implants. Science Advances. 11(12). eads4415–eads4415. 17 indexed citations
2.
3.
Yang, Yizhang, R.N. Master, Gamal Refai-Ahmed, & Maxat Touzelbaev. (2012). Transient Frequency-Domain Thermal Measurements With Applications to Electronic Packaging. IEEE Transactions on Components Packaging and Manufacturing Technology. 2(3). 448–456. 18 indexed citations
4.
Touzelbaev, Maxat, et al.. (2009). Indium thermal interface material development for microprocessors. 186–192. 30 indexed citations
5.
Lee, Sangil, Myung Jin Yim, R.N. Master, C.P. Wong, & D.F. Baldwin. (2009). Near Void-Free Assembly Development of Flip Chip Using No-Flow Underfill. IEEE Transactions on Electronics Packaging Manufacturing. 32(2). 106–114. 6 indexed citations
6.
Lee, Sang-Il, Myung Jin Yim, R.N. Master, C.P. Wong, & Daniel F. Baldwin. (2008). Void Formation Study of Flip Chip in Package Using No-Flow Underfill. IEEE Transactions on Electronics Packaging Manufacturing. 31(4). 297–305. 19 indexed citations
7.
Lee, Sangil, Daniel F. Baldwin, R.N. Master, & S Parthasarathy. (2007). Assembly Yields Characterization of High IO Density, Fine Pitch Flip Chip in Package Using No-Flow Underfill. 35–41. 4 indexed citations
8.
Blish, Richard C., et al.. (2006). Investigation of Cu/Low-K Film Delamination in Flip-Chip Packages. 709–717. 39 indexed citations
9.
Master, R.N., et al.. (2004). Investigation and Minimization of Underfill Delamination in Flip Chip Packages. IEEE Transactions on Device and Materials Reliability. 4(1). 86–91. 25 indexed citations
10.
Blish, Richard C., et al.. (2004). Interfacial fracture analysis of underfill delamination and flip chip reliability optimization. 714–719. 2 indexed citations
11.
12.
Master, R.N., et al.. (2003). Heat spreader attach: a microprocessor thermal solution. 238–242. 6 indexed citations
13.
Master, R.N., et al.. (2002). Novel jet fluxing application for advanced flip chip and BGA/CGA packages. 1185–1188. 3 indexed citations
14.
Master, R.N., et al.. (2002). Ceramic ball grid array for AMD K6 microprocessor application. 702–706. 13 indexed citations
15.
Master, R.N., et al.. (2002). Kinetics of C4 bump degradation in overly aggressive HTOL. 60–63. 3 indexed citations
16.
Master, R.N., et al.. (2002). Ceramic mini-ball grid array package for high speed device. 46–50. 1 indexed citations
17.
Ray, Sumit Kumar, et al.. (2002). Flip-chip interconnection technology for advanced thermal conduction modules. 772–778. 7 indexed citations
18.
19.
Tummala, Rao, John Knickerbocker, Sarah H. Knickerbocker, et al.. (1992). High-performance glass-ceramic/copper multilayer substrate with thin-film redistribution. IBM Journal of Research and Development. 36(5). 889–904. 25 indexed citations
20.
Ray, Sumit Kumar, et al.. (1992). Device interconnection technology for advanced thermal conduction modules. IEEE Transactions on Components Hybrids and Manufacturing Technology. 15(4). 432–437. 15 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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