R.N. Master
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- Electronic Packaging and Soldering Technologies 31
- 3D IC and TSV technologies 25
- Electromagnetic Compatibility and Noise Suppression 6
- Electrostatic Discharge in Electronics 5
- Integrated Circuits and Semiconductor Failure Analysis 4
- Silicon and Solar Cell Technologies 3
- Advancements in Photolithography Techniques 2
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- Additive Manufacturing and 3D Printing Technologies 3
- Co-authors
- Madhavan SwaminathanMaxat TouzelbaevJung-Hwan ChoiRichard C. BlishSumit Kumar RayYizhang YangDaniel F. BaldwinRao Tummala
- Journals
- IEEE Transactions on Electronics Packaging Manufacturing (2 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (1 paper)IEEE Transactions on Electromagnetic Compatibility (1 paper)
- Partner nations
- United StatesCanadaSouth Korea
In The Last Decade
R.N. Master
39 papers receiving 395 citations
Peers
Comparison fields: 5 of 43
- Electrical and Electronic Engineering 355
- Ceramics and Composites 22
- Mechanics of Materials 62
- Hardware and Architecture 15
- Nuclear Energy and Engineering 1
Countries citing papers authored by R.N. Master
This map shows the geographic impact of R.N. Master's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by R.N. Master with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites R.N. Master more than expected).
Fields of papers citing papers by R.N. Master
This network shows the impact of papers produced by R.N. Master. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by R.N. Master. The network helps show where R.N. Master may publish in the future.
Co-authorship network
The 25 scholars most cited alongside R.N. Master, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2025 | 17 | |
| 2 | 2012 | 18 | |
| 3 | 2010 | 10 | |
| 4 | 2009 | 30 | |
| 5 | 2008 | 19 | |
| 6 | 2006 | 39 | |
| 7 | 2006 | 4 | |
| 8 | 2005 | 34 | |
| 9 | 2004 | 25 | |
| 10 | 2004 | 2 | |
| 11 | 2003 | 6 | |
| 12 | 2003 | 6 | |
| 13 | 2002 | 13 | |
| 14 | 2002 | 3 | |
| 15 | 2002 | 3 | |
| 16 | 2002 | 0 | |
| 17 | 2002 | 4 | |
| 18 | Effect of mechanical shock and vibration on the second-level temperature cycling reliability of ceramic ball grid arrays with a continuous compressive load applied | 1997 | 2 |
| 19 | 1992 | 25 | |
| 20 | 1992 | 15 |
About R.N. Master
R.N. Master is a scholar working on Electrical and Electronic Engineering, General Materials Science and Industrial and Manufacturing Engineering, having authored 40 papers that have together received 414 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (31 papers), 3D IC and TSV technologies (25 papers), Electromagnetic Compatibility and Noise Suppression (6 papers), Electrostatic Discharge in Electronics (5 papers), Integrated Circuits and Semiconductor Failure Analysis (4 papers), Silicon and Solar Cell Technologies (3 papers), Additive Manufacturing and 3D Printing Technologies (3 papers) and Advancements in Photolithography Techniques (2 papers). The work is most often cited by research in Electrical and Electronic Engineering (355 citations), Ceramics and Composites (22 citations) and Mechanics of Materials (62 citations). R.N. Master has collaborated with scholars based in United States, Canada and South Korea. Frequent co-authors include Madhavan Swaminathan, Maxat Touzelbaev, Jung-Hwan Choi, Richard C. Blish, Sumit Kumar Ray, Yizhang Yang, Daniel F. Baldwin, Rao Tummala, Gamal Refai-Ahmed and C.P. Wong. Their work appears in journals such as IEEE Transactions on Electronics Packaging Manufacturing, IEEE Transactions on Components Packaging and Manufacturing Technology, IEEE Transactions on Electromagnetic Compatibility, IBM Journal of Research and Development and Science Advances.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.