E. J. Cotts

3.5k total citations
117 papers, 3.0k citations indexed

About

E. J. Cotts is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering and Materials Chemistry. According to data from OpenAlex, E. J. Cotts has authored 117 papers receiving a total of 3.0k indexed citations (citations by other indexed papers that have themselves been cited), including 68 papers in Mechanical Engineering, 67 papers in Electrical and Electronic Engineering and 34 papers in Materials Chemistry. Recurrent topics in E. J. Cotts's work include Electronic Packaging and Soldering Technologies (62 papers), 3D IC and TSV technologies (26 papers) and Intermetallics and Advanced Alloy Properties (25 papers). E. J. Cotts is often cited by papers focused on Electronic Packaging and Soldering Technologies (62 papers), 3D IC and TSV technologies (26 papers) and Intermetallics and Advanced Alloy Properties (25 papers). E. J. Cotts collaborates with scholars based in United States, Australia and Germany. E. J. Cotts's co-authors include L.P. Lehman, Thomas R. Bieler, Peter Børgesen, Yan Xing, L. Zavalij, Babak Arfaei, Richard R. Chromik, William L. Johnson, T. Kirkpatrick and A. Zribi and has published in prestigious journals such as Physical Review Letters, The Journal of Chemical Physics and Physical review. B, Condensed matter.

In The Last Decade

E. J. Cotts

117 papers receiving 2.8k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
E. J. Cotts United States	29	2.2k	1.6k	657	579	378	117	3.0k
Jae-Hyeok Shim South Korea	27	378 0.2×	1.4k 0.9×	1.7k 2.7×	323 0.6×	295 0.8×	95	2.8k
Chong‐Yu Wang China	34	579 0.3×	2.1k 1.3×	2.2k 3.4×	563 1.0×	430 1.1×	224	3.9k
D. Baither Germany	22	953 0.4×	844 0.5×	901 1.4×	246 0.4×	181 0.5×	68	2.2k
D. Yu. Kovalev Russia	26	410 0.2×	1.5k 0.9×	1.4k 2.1×	350 0.6×	425 1.1×	313	2.6k
Suzana G. Fries Germany	33	519 0.2×	2.7k 1.6×	2.2k 3.3×	1.2k 2.1×	302 0.8×	110	4.0k
V. Sklyarchuk Ukraine	22	805 0.4×	808 0.5×	812 1.2×	216 0.4×	76 0.2×	141	1.7k
Marek Danielewski Poland	24	501 0.2×	2.0k 1.2×	1.0k 1.5×	1.3k 2.3×	222 0.6×	163	3.0k
Richard P. Vinci United States	26	1.2k 0.5×	934 0.6×	840 1.3×	149 0.3×	939 2.5×	94	2.6k
J.P. Garandet France	27	614 0.3×	1.1k 0.7×	1.0k 1.5×	367 0.6×	96 0.3×	113	2.4k
Hideo Yoshinaga Japan	25	342 0.2×	1.9k 1.2×	1.9k 3.0×	497 0.9×	742 2.0×	173	3.0k

Countries citing papers authored by E. J. Cotts

Since Specialization

Citations

This map shows the geographic impact of E. J. Cotts's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by E. J. Cotts with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites E. J. Cotts more than expected).

Fields of papers citing papers by E. J. Cotts

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by E. J. Cotts. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by E. J. Cotts. The network helps show where E. J. Cotts may publish in the future.

Co-authorship network of co-authors of E. J. Cotts

This figure shows the co-authorship network connecting the top 25 collaborators of E. J. Cotts. A scholar is included among the top collaborators of E. J. Cotts based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with E. J. Cotts. E. J. Cotts is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Cotts, E. J., et al.. (2024). Changes in the Microstructure and Electrical Resistance of SnBi-Based Solder Joints during Current Stressing. Journal of Electronic Materials. 53(3). 1299–1312. 2 indexed citations

Cotts, E. J., et al.. (2022). The Failure of Sn-Bi-Based Solder Joints Due to Current Stressing. Journal of Electronic Materials. 52(2). 751–759. 8 indexed citations

Mutuku, Francis, Babak Arfaei, & E. J. Cotts. (2016). The Influence of Processing on Strengthening Mechanisms in Pb-Free Solder Joints. Journal of Electronic Materials. 46(4). 2067–2079. 10 indexed citations

Børgesen, Peter, E. J. Cotts, & I. Dutta. (2014). Microstructurally Adaptive Constitutive Relations and Reliability Assessment Protocols for Lead Free Solder. 16(1). 14 indexed citations

Fox, Craig R., et al.. (2014). The Nucleation of Sn in Undercooled Melts: The Effect of Metal Impurities. JOM. 66(11). 2311–2319. 21 indexed citations

Liu, Yihua, Liang Yin, Stoyan Bliznakov, et al.. (2009). Understanding, Controlling and Minimizing the Voiding, Sporadically Occurring in Solder Joints with Electroplated Copper. ECS Transactions. 19(24). 43–56. 3 indexed citations

Sharma, Anju, et al.. (2008). Thermal characterization of thermal interface material bondlines. 174–179. 6 indexed citations

Cotts, E. J., et al.. (2007). Reply to “Comment on ‘Free surface Hele-Shaw flows around an obstacle: A random walk simulation’ ”. Physical Review E. 76(3). 3 indexed citations

Cotts, E. J., et al.. (2004). Free surface Hele-Shaw flows around an obstacle: A random walk simulation. Physical Review E. 69(1). 16310–16310. 6 indexed citations

10.

Henderson, Donald W., Timothy Gosselin, David E. King, et al.. (2004). The microstructure of Sn in near-eutectic Sn–Ag–Cu alloy solder joints and its role in thermomechanical fatigue. Journal of materials research/Pratt's guide to venture capital sources. 19(6). 1608–1612. 169 indexed citations

11.

Zavalij, L., et al.. (2004). Linear coefficients of thermal expansion of Au0.5Ni0.5Sn4, Au0.75Ni0.25Sn4, and AuSn4. Scripta Materialia. 51(7). 745–749. 12 indexed citations

12.

Lehman, L.P., et al.. (2004). Growth and selection of intermetallic species in Sn-Ag-Cu No-Pb solder systems based on pad metallurgies and thermal histories. 1215–1221. 11 indexed citations

13.

Zribi, A., Peter Børgesen, L. Zavalij, & E. J. Cotts. (2000). Growth of Cu-Ni-Sn Alloys in Pb Free CuSnAg Solder/Au-Ni Metallization Reactions. MRS Proceedings. 652. 2 indexed citations

14.

Archer, Donald G., Robert J. Kematick, Clifford E. Myers, Smriti Agarwal, & E. J. Cotts. (1999). Enthalpy Increment Measurements from 4.5 K to 350 K and the Thermodynamic Properties of the Titanium Silicide TiSi(cr). Journal of Chemical & Engineering Data. 44(2). 167–172. 4 indexed citations

15.

Lehmann, G. L., et al.. (1998). Underflow Process for Direct-Chip-Attachment Packaging. MRS Proceedings. 515. 5 indexed citations

16.

Lehmann, G. L., et al.. (1998). Underflow process for direct-chip-attachment packaging. IEEE Transactions on Components Packaging and Manufacturing Technology Part A. 21(2). 266–274. 34 indexed citations

17.

Neils, W. K., et al.. (1995). Calorimetric Study of the Energetics and Kinetics of Interdiffusion in Cu/Cu₆sn₅ Thin Film Diffusion Couples. MRS Proceedings. 398. 5 indexed citations

18.

Cotts, E. J., et al.. (1993). Averaged interdiffusion coefficient during solid-state amorphization reactions between metal layers. Physical review. B, Condensed matter. 48(8). 5579–5584. 7 indexed citations

19.

Cotts, E. J., et al.. (1993). Calorimetric study of solid state reactions. Pure and Applied Chemistry. 65(5). 895–900. 4 indexed citations

20.

Suzuki, Masatsugu, Louis J. Santodonato, Itsuko S. Suzuki, B. E. White, & E. J. Cotts. (1991). Structural phase transition of high-stageMoCl5graphite intercalation compounds. Physical review. B, Condensed matter. 43(7). 5805–5814. 5 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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