L.P. Lehman
- Electrical and Electronic Engineering top 5%
- Mechanical Engineering top 2%
- Aerospace Engineering top 5%
- Mechanics of Materials top 5%
- Materials Chemistry
- Co-authors
- E. J. CottsThomas R. BielerYan XingT. KirkpatrickL. ZavalijHairong JiangSeungbae ParkPeter Børgesen
- Topics
- Electronic Packaging and Soldering Technologies (16 papers)3D IC and TSV technologies (8 papers)Advanced Welding Techniques Analysis (8 papers)
- Journals
- Acta MaterialiaSurface and Coatings TechnologyJournal of materials research/Pratt's guide to venture capital sources
- Partner nations
- United StatesJapan
In The Last Decade
L.P. Lehman
23 papers receiving 1.3k citations
Peers
Comparison fields: 5 of 35
- Electrical and Electronic Engineering 1.2k
- Mechanical Engineering 781
- Aerospace Engineering 377
- Mechanics of Materials 274
- Materials Chemistry 203
Countries citing papers authored by L.P. Lehman
This map shows the geographic impact of L.P. Lehman's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by L.P. Lehman with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites L.P. Lehman more than expected).
Fields of papers citing papers by L.P. Lehman
This network shows the impact of papers produced by L.P. Lehman. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by L.P. Lehman. The network helps show where L.P. Lehman may publish in the future.
Co-authorship network of co-authors of L.P. Lehman
This figure shows the co-authorship network connecting the top 25 collaborators of L.P. Lehman. A scholar is included among the top collaborators of L.P. Lehman based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with L.P. Lehman. L.P. Lehman is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 1 | |
| 2 | 176 | |
| 3 | 10 | |
| 4 | 207 | |
| 5 | 51 | |
| 6 | 87 | |
| 7 | 12 | |
| 8 | 48 | |
| 9 | 4 | |
| 10 | 7 | |
| 11 | 29 | |
| 12 | 96 | |
| 13 | 169 | |
| 14 | 11 | |
| 15 | 121 | |
| 16 | 149 | |
| 17 | 20 | |
| 18 | 6 | |
| 19 | 23 | |
| 20 | 1 |
About L.P. Lehman
L.P. Lehman is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering and Aerospace Engineering, having authored 23 papers that have together received 1.3k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (16 papers), 3D IC and TSV technologies (8 papers) and Advanced Welding Techniques Analysis (8 papers). The work is most often cited by research in General Materials Science (66 citations), Mechanical Engineering (781 citations) and Electrical and Electronic Engineering (1.2k citations). L.P. Lehman has collaborated with scholars based in United States and Japan. Frequent co-authors include E. J. Cotts, Thomas R. Bieler, Yan Xing, T. Kirkpatrick, L. Zavalij, Hairong Jiang, Seungbae Park, Peter Børgesen, Tia‐Marje Korhonen and Donald W. Henderson. Their work appears in journals such as Acta Materialia, Surface and Coatings Technology and Journal of materials research/Pratt's guide to venture capital sources.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.