L.P. Lehman

1.6k total citations
23 papers, 1.3k citations indexed

About

L.P. Lehman is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Aerospace Engineering. According to data from OpenAlex, L.P. Lehman has authored 23 papers receiving a total of 1.3k indexed citations (citations by other indexed papers that have themselves been cited), including 19 papers in Electrical and Electronic Engineering, 15 papers in Mechanical Engineering and 8 papers in Aerospace Engineering. Recurrent topics in L.P. Lehman's work include Electronic Packaging and Soldering Technologies (16 papers), 3D IC and TSV technologies (8 papers) and Advanced Welding Techniques Analysis (8 papers). L.P. Lehman is often cited by papers focused on Electronic Packaging and Soldering Technologies (16 papers), 3D IC and TSV technologies (8 papers) and Advanced Welding Techniques Analysis (8 papers). L.P. Lehman collaborates with scholars based in United States and Japan. L.P. Lehman's co-authors include E. J. Cotts, Thomas R. Bieler, Yan Xing, T. Kirkpatrick, L. Zavalij, Hairong Jiang, Seungbae Park, Peter Børgesen, Tia‐Marje Korhonen and Donald W. Henderson and has published in prestigious journals such as Acta Materialia, Surface and Coatings Technology and Journal of materials research/Pratt's guide to venture capital sources.

In The Last Decade

L.P. Lehman

23 papers receiving 1.3k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
L.P. Lehman United States 13 1.2k 781 377 274 203 23 1.3k
J. P. Lucas United States 26 1.3k 1.1× 1.4k 1.8× 290 0.8× 295 1.1× 254 1.3× 39 1.7k
Z. Mei United States 14 859 0.7× 830 1.1× 180 0.5× 212 0.8× 152 0.7× 25 1.1k
Sun-Kyoung Seo South Korea 19 518 0.4× 904 1.2× 445 1.2× 78 0.3× 237 1.2× 46 1.1k
Zhaolong Ma China 20 526 0.4× 1.0k 1.3× 636 1.7× 112 0.4× 315 1.6× 60 1.4k
Pearl Agyakwa United Kingdom 15 970 0.8× 648 0.8× 121 0.3× 98 0.4× 112 0.6× 39 1.1k
R. Sidhu United States 16 575 0.5× 662 0.8× 155 0.4× 239 0.9× 178 0.9× 27 937
Tz-Cheng Chiu Taiwan 13 907 0.8× 435 0.6× 100 0.3× 316 1.2× 88 0.4× 67 1.2k
Mohammad Motalab Bangladesh 18 690 0.6× 492 0.6× 226 0.6× 226 0.8× 410 2.0× 71 1.1k
C. C. Goldsmith United States 15 944 0.8× 524 0.7× 198 0.5× 174 0.6× 99 0.5× 36 1.0k
Won Kyoung Choi South Korea 16 977 0.8× 628 0.8× 179 0.5× 43 0.2× 73 0.4× 32 1.0k

Countries citing papers authored by L.P. Lehman

Since Specialization
Citations

This map shows the geographic impact of L.P. Lehman's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by L.P. Lehman with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites L.P. Lehman more than expected).

Fields of papers citing papers by L.P. Lehman

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by L.P. Lehman. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by L.P. Lehman. The network helps show where L.P. Lehman may publish in the future.

Co-authorship network of co-authors of L.P. Lehman

This figure shows the co-authorship network connecting the top 25 collaborators of L.P. Lehman. A scholar is included among the top collaborators of L.P. Lehman based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with L.P. Lehman. L.P. Lehman is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Andersson, Janicke, et al.. (2019). Performance of the Electromagnetic Stirring System Applied to the Flat Bath Consteel® Operation. 775–780. 1 indexed citations
2.
Lehman, L.P., Yan Xing, Thomas R. Bieler, & E. J. Cotts. (2010). Cyclic twin nucleation in tin-based solder alloys. Acta Materialia. 58(10). 3546–3556. 176 indexed citations
3.
Jang, Changsoo, et al.. (2008). Failure analysis of contact probe pins for SnPb and Sn applications. Microelectronics Reliability. 48(6). 942–947. 10 indexed citations
4.
Bieler, Thomas R., et al.. (2008). Influence of Sn Grain Size and Orientation on the Thermomechanical Response and Reliability of Pb-free Solder Joints. IEEE Transactions on Components and Packaging Technologies. 31(2). 370–381. 207 indexed citations
5.
Korhonen, Tia‐Marje, L.P. Lehman, M. A. Korhonen, & Donald W. Henderson. (2007). Isothermal Fatigue Behavior of the Near-Eutectic Sn-Ag-Cu Alloy between −25°C and 125°C. Journal of Electronic Materials. 36(2). 173–178. 51 indexed citations
6.
Park, Seungbae, et al.. (2007). Measurement of deformations in SnAgCu solder interconnects under in situ thermal loading. Acta Materialia. 55(9). 3253–3260. 87 indexed citations
7.
Park, Seungbae, et al.. (2007). Grain Deformation and Strain in Board Level SnAgCu Solder Interconnects Under Deep Thermal Cycling. IEEE Transactions on Components and Packaging Technologies. 30(1). 178–185. 12 indexed citations
8.
Børgesen, Peter, Thomas R. Bieler, L.P. Lehman, & E. J. Cotts. (2007). Pb-Free Solder: New Materials Considerations for Microelectronics Processing. MRS Bulletin. 32(4). 360–365. 48 indexed citations
9.
Lehman, L.P., et al.. (2007). Examination of the utility of commercial-off-the-shelf memory devices as X-ray detectors. 1325–1328. 4 indexed citations
10.
Park, Seungbae, et al.. (2005). Grain Formation and Intergrain Stresses in a Sn-Ag-Cu Solder Ball. 1095–1100. 7 indexed citations
11.
Lehman, L.P., Junling Wang, Yan Xing, et al.. (2005). Microstructure and Damage Evolution in Sn-Ag-Cu Solder Joints. 2. 674–681. 29 indexed citations
12.
Lehman, L.P., et al.. (2005). Effect of Sample Size on the Solidification Temperature and Microstructure of SnAgCu Near Eutectic Alloys. Journal of materials research/Pratt's guide to venture capital sources. 20(11). 2914–2918. 96 indexed citations
13.
Henderson, Donald W., Timothy Gosselin, David E. King, et al.. (2004). The microstructure of Sn in near-eutectic Sn–Ag–Cu alloy solder joints and its role in thermomechanical fatigue. Journal of materials research/Pratt's guide to venture capital sources. 19(6). 1608–1612. 169 indexed citations
14.
15.
Telang, Adwait U., Thomas R. Bieler, J. P. Lucas, et al.. (2004). Grain-boundary character and grain growth in bulk tin and bulk lead-free solder alloys. Journal of Electronic Materials. 33(12). 1412–1423. 121 indexed citations
16.
Lehman, L.P., Raj Patel, Yan Xing, et al.. (2004). Growth of Sn and intermetallic compounds in Sn-Ag-Cu solder. Journal of Electronic Materials. 33(12). 1429–1439. 149 indexed citations
17.
Korhonen, Tia‐Marje, et al.. (2004). Mechanical properties of near-eutectic Sn-Ag-Cu alloy over a wide range of temperatures and strain rates. Journal of Electronic Materials. 33(12). 1581–1588. 20 indexed citations
18.
19.
Perry, A.J., et al.. (1988). Low temperature tempering-induced changes in bulk resistivity, temperature coefficient of resistivity and stress in physically vapor-deposited TiN. Surface and Coatings Technology. 36(3-4). 605–616. 23 indexed citations
20.
Imaino, W., et al.. (1986). Determination of Case Depth in Small Sintered Parts Using Ultrasonic Waves. 32. 581–586. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact

Breakdown of academic impact, for papers by J. P. Lucas Breakdown of academic impact, for papers by Z. Mei Breakdown of academic impact, for papers by Sun-Kyoung Seo Breakdown of academic impact, for papers by Zhaolong Ma Breakdown of academic impact, for papers by Pearl Agyakwa Breakdown of academic impact, for papers by R. Sidhu Breakdown of academic impact, for papers by Tz-Cheng Chiu Breakdown of academic impact, for papers by Mohammad Motalab Breakdown of academic impact, for papers by C. C. Goldsmith Breakdown of academic impact, for papers by Won Kyoung Choi
Rankless by CCL
2026