S.H. Mannan

2.8k total citations · 1 hit paper
104 papers, 2.3k citations indexed

About

S.H. Mannan is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Mechanics of Materials. According to data from OpenAlex, S.H. Mannan has authored 104 papers receiving a total of 2.3k indexed citations (citations by other indexed papers that have themselves been cited), including 82 papers in Electrical and Electronic Engineering, 44 papers in Mechanical Engineering and 18 papers in Mechanics of Materials. Recurrent topics in S.H. Mannan's work include Electronic Packaging and Soldering Technologies (76 papers), 3D IC and TSV technologies (38 papers) and Intermetallics and Advanced Alloy Properties (16 papers). S.H. Mannan is often cited by papers focused on Electronic Packaging and Soldering Technologies (76 papers), 3D IC and TSV technologies (38 papers) and Intermetallics and Advanced Alloy Properties (16 papers). S.H. Mannan collaborates with scholars based in United Kingdom, Hong Kong and India. S.H. Mannan's co-authors include Hiren R. Kotadia, Seyed Amir Paknejad, Philip D. Howes, M.P. Clode, D.C. Whalley, David A. Hutt, Jianfeng Li, David Williams, Omid Mokhtari and N.N. Ekere and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Acta Materialia.

In The Last Decade

S.H. Mannan

101 papers receiving 2.2k citations

Hit Papers

A review: On the development of low melting temperature P... 2014 2026 2018 2022 2014 100 200 300

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
S.H. Mannan United Kingdom 23 1.7k 1.4k 310 260 178 104 2.3k
S. K. Kang United States 23 1.5k 0.9× 821 0.6× 119 0.4× 181 0.7× 166 0.9× 57 1.6k
Guna S Selvaduray United States 12 2.0k 1.2× 1.5k 1.1× 282 0.9× 419 1.6× 383 2.2× 33 2.5k
Yi‐Shao Lai Taiwan 29 2.5k 1.5× 1.1k 0.8× 646 2.1× 484 1.9× 161 0.9× 202 3.0k
Jeong‐Won Yoon South Korea 34 3.4k 2.0× 2.5k 1.8× 170 0.5× 238 0.9× 225 1.3× 180 3.6k
Da‐Yuan Shih United States 28 2.5k 1.5× 1.5k 1.1× 192 0.6× 203 0.8× 465 2.6× 73 2.7k
Jieshi Chen China 26 583 0.3× 1.2k 0.9× 377 1.2× 623 2.4× 209 1.2× 104 1.8k
Vesa Vuorinen Finland 24 2.6k 1.5× 2.1k 1.6× 171 0.6× 357 1.4× 449 2.5× 104 3.2k
Chuantong Chen Japan 34 2.3k 1.3× 2.1k 1.5× 486 1.6× 533 2.0× 166 0.9× 199 3.5k
Paul T. Vianco United States 23 2.1k 1.2× 1.6k 1.2× 262 0.8× 270 1.0× 460 2.6× 133 2.4k

Countries citing papers authored by S.H. Mannan

Since Specialization
Citations

This map shows the geographic impact of S.H. Mannan's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by S.H. Mannan with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites S.H. Mannan more than expected).

Fields of papers citing papers by S.H. Mannan

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by S.H. Mannan. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by S.H. Mannan. The network helps show where S.H. Mannan may publish in the future.

Co-authorship network of co-authors of S.H. Mannan

This figure shows the co-authorship network connecting the top 25 collaborators of S.H. Mannan. A scholar is included among the top collaborators of S.H. Mannan based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with S.H. Mannan. S.H. Mannan is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Mannan, S.H., et al.. (2025). Empowering IOT devices with solar wind databases and decentralised data storage. International Journal of Power and Energy Conversion. 16(2). 176–185.
2.
Shen, Yu-An, et al.. (2021). Observation of void formation patterns in SnAg films undergoing electromigration and simulation using random walk methods. Scientific Reports. 11(1). 8668–8668. 3 indexed citations
3.
Paknejad, Seyed Amir, et al.. (2018). Arresting high-temperature microstructural evolution inside sintered silver. Journal of Materials Science Materials in Electronics. 30(1). 463–474. 3 indexed citations
4.
Haseeb, A.S.M.A., et al.. (2016). Reactions in Electrodeposited Cu/Sn and Cu/Ni/Sn Nanoscale Multilayers for Interconnects. Materials. 9(6). 430–430. 29 indexed citations
5.
Paknejad, Seyed Amir, et al.. (2016). Tunable Ultra-high Aspect Ratio Nanorod Architectures grown on Porous Substrate via Electromigration. Scientific Reports. 6(1). 22272–22272. 15 indexed citations
6.
Kotadia, Hiren R., Shengyong Xu, Hua Lu, et al.. (2014). Electromigration in Sn–Ag solder thin films under high current density. Thin Solid Films. 565. 193–201. 18 indexed citations
7.
Kotadia, Hiren R., Philip D. Howes, & S.H. Mannan. (2014). A review: On the development of low melting temperature Pb-free solders. Microelectronics Reliability. 54(6-7). 1253–1273. 383 indexed citations breakdown →
8.
Kotadia, Hiren R., et al.. (2012). Reliability of electronics assembled using SAC + Zn solder pastes. Additional Conferences (Device Packaging HiTEC HiTEN & CICMT). 2012(HITEC). 51–57. 1 indexed citations
9.
Mokhtari, Omid, Ali Roshanghias, Hiren R. Kotadia, et al.. (2012). Disabling of Nanoparticle Effects at Increased Temperature in Nanocomposite Solders. Journal of Electronic Materials. 41(7). 1907–1914. 19 indexed citations
10.
Cobley, Andrew J., et al.. (2010). The effect of ultrasound on the gold plating of silica nanoparticles for use in composite solders. Ultrasonics Sonochemistry. 18(1). 37–41. 10 indexed citations
11.
Li, Jianfeng, S.H. Mannan, M.P. Clode, et al.. (2008). Interfacial Reaction Between Molten Sn-Bi Based Solders and Electroless Ni-P Coatings for Liquid Solder Interconnects. IEEE Transactions on Components and Packaging Technologies. 31(3). 574–585. 5 indexed citations
12.
Li, Jianfeng, S.H. Mannan, M.P. Clode, C. Johnston, & Alison Crossley. (2007). Dissolution and interfacial reaction of Nb in contact with the molten 52In–48Sn solder. Acta Materialia. 55(15). 5057–5071. 16 indexed citations
13.
Li, Jianfeng, et al.. (2006). Comparison of interfacial reactions of Ni and Ni–P in extended contact with liquid Sn–Bi-based solders. Acta Materialia. 55(2). 737–752. 53 indexed citations
14.
Li, Jianfeng, S.H. Mannan, & M.P. Clode. (2006). Edge effects in intermetallic compound crystal growth between Nb and molten 52In–48Sn solder. Applied Physics Letters. 88(10). 1 indexed citations
15.
Mannan, S.H. & M.P. Clode. (2004). Molten solder interconnects: Long term reaction studies and applications. Research Portal (King's College London). 1 indexed citations
16.
Mannan, S.H., et al.. (1997). EFFECTS OF GAP HEIGHT ON CONDUCTION WITHIN ANISOTROPIC CONDUCTING ADHESIVE ASSEMBLIES. Journal of Electronics Manufacturing. 7(3). 211–224. 3 indexed citations
17.
Mannan, S.H., et al.. (1993). Application of ink screening models to solder paste printing in SMT assembly. Journal of Electronics Manufacturing. 3(3). 113–120. 4 indexed citations
18.
King, Stephen F. & S.H. Mannan. (1992). Quark and lepton masses in extended technicolor. Nuclear Physics B. 369(1-2). 119–138. 11 indexed citations
19.
Choudhary, B.K., et al.. (1992). Development of fatigue design curves for thick-section 9Cr-1Mo ferritic steel forgings. International Journal of Fatigue. 14(4). 219–223. 4 indexed citations
20.
Mannan, S.H. & Stephen F. King. (1991). THE TOP QUARK CONDENSATE IN THE PRESENCE OF HIGHER-DIMENSIONAL OPERATORS. International Journal of Modern Physics A. 6(27). 4949–4957. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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