J. P. Lucas

2.0k total citations
39 papers, 1.7k citations indexed

About

J. P. Lucas is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering and Mechanics of Materials. According to data from OpenAlex, J. P. Lucas has authored 39 papers receiving a total of 1.7k indexed citations (citations by other indexed papers that have themselves been cited), including 28 papers in Mechanical Engineering, 26 papers in Electrical and Electronic Engineering and 8 papers in Mechanics of Materials. Recurrent topics in J. P. Lucas's work include Electronic Packaging and Soldering Technologies (23 papers), Aluminum Alloys Composites Properties (12 papers) and Intermetallics and Advanced Alloy Properties (9 papers). J. P. Lucas is often cited by papers focused on Electronic Packaging and Soldering Technologies (23 papers), Aluminum Alloys Composites Properties (12 papers) and Intermetallics and Advanced Alloy Properties (9 papers). J. P. Lucas collaborates with scholars based in United States, Ireland and United Kingdom. J. P. Lucas's co-authors include K. N. Subramanian, Thomas R. Bieler, S. Choi, Fei Guo, Fu Guo, J.J. Stephens, Hongjoo Rhee, W. W. Gerberich, Jin Gyun Lee and F.M. Hosking and has published in prestigious journals such as Materials Science and Engineering A, Scripta Materialia and Molecular Physics.

In The Last Decade

J. P. Lucas

36 papers receiving 1.7k citations

Peers

Countries citing papers authored by J. P. Lucas

Since Specialization

Citations

This map shows the geographic impact of J. P. Lucas's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by J. P. Lucas with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites J. P. Lucas more than expected).

Fields of papers citing papers by J. P. Lucas

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by J. P. Lucas. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by J. P. Lucas. The network helps show where J. P. Lucas may publish in the future.

Co-authorship network of co-authors of J. P. Lucas

This figure shows the co-authorship network connecting the top 25 collaborators of J. P. Lucas. A scholar is included among the top collaborators of J. P. Lucas based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with J. P. Lucas. J. P. Lucas is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

#	Work	Indexed citations
1	Redesign and process of reforming an existing undergraduate Nutritional Sciences program 2020 ·AJP Advances in Physiology Education ·(unknown), J. P. Lucas, Wei Li, Jenifer I. Fenton	2
2	Foreword 2006 ·Journal of Electronic Materials ·Nikhilesh Chawla, (unknown), Sung K. Kang, C. R. Kao, (unknown), J. P. Lucas, Laura J. Turbini	1
3	A narrow-band photoluminescent optical fibre sensor for the detection of high-intensity germicidal ultraviolet radiation (254 nm) from a microwave plasma ultraviolet lamp 2003 ·Journal of Optics A Pure and Applied Optics ·(unknown), Colin Fitzpatrick, Elfed Lewis, (unknown), (unknown), J. P. Lucas	2
4	Intermetallic morphology around Ni particles in Sn‐3.5Ag solder 2002 ·Soldering and Surface Mount Technology ·(unknown), Fu Guo, K. N. Subramanian, J. P. Lucas	25
5	Residual-mechanical behavior of thermomechanically fatigued Sn-Ag based solder joints 2002 ·Journal of Electronic Materials ·Jin Gyun Lee, Fei Guo, S. Choi, K. N. Subramanian, Thomas R. Bieler, J. P. Lucas	41
6	Micromechanical characterization of thermomechanically fatigued lead-free solder joints 2002 ·Journal of Materials Science Materials in Electronics ·Hongjoo Rhee, J. P. Lucas, K. N. Subramanian	45
7	Investigation of the failure mechanism of insulation subjected to repetitive fast voltage surges 2002 ·(unknown), J. P. Lucas, (unknown), (unknown), (unknown)	21
8	Microstructural characterization of damage in thermomechanically fatigued Sn-Ag based solder joints 2002 ·Journal of Electronic Materials ·S. Choi, Jin Gyun Lee, K. N. Subramanian, J. P. Lucas, Thomas R. Bieler	41
9	Creep behavior in Cu and Ag particle-reinforced composite and eutectic Sn-3.5Ag and Sn-4.0Ag-0.5Cu non-composite solder joints 2001 ·Journal of Materials Science Materials in Electronics ·Fu Guo, J. P. Lucas, K. N. Subramanian	75
10	The effect of small additions of copper on the aging kinetics of the intermetallic layer and intermetallic particles of eutectic tin-silver solder joints 2000 ·Journal of Electronic Materials ·(unknown), S. Choi, K. N. Subramanian, J. P. Lucas	26
11	Quantification of creep strain distribution in small crept lead-free in-situ composite and non composite solder joints 2000 ·Materials Science and Engineering A ·(unknown), S. Choi, Thomas R. Bieler, K. N. Subramanian, J. P. Lucas	38
12	Formation and growth of interfacial intermetallic layers in eutectic Sn-Ag solder and its composite solder joints 2000 ·Journal of Materials Science Materials in Electronics ·S. Choi, J. P. Lucas, K. N. Subramanian, Thomas R. Bieler	59
13	Creep deformation behavior in eutectic Sn-Ag solder joints using a novel mapping technique 1999 ·Journal of Electronic Materials ·J. P. Lucas, Fei Guo, (unknown), Thomas R. Bieler, K. N. Subramanian, (unknown)	30
14	Characterization of the growth of intermetallic interfacial layers of Sn-Ag and Sn-Pb eutectic solders and their composite solders on Cu substrate during isothermal long-term aging 1999 ·Journal of Electronic Materials ·S. Choi, Thomas R. Bieler, J. P. Lucas, K. N. Subramanian	198
15	A practical nonlinear furnace controller with plant model adaption 1994 ·J. P. Lucas	0
16	The effect of reinforcement stability on composition redistribution in cast aluminum metal matrix composites 1991 ·Materials Science and Engineering A ·J. P. Lucas, J.J. Stephens, F. A. Greulich	34
17	Transparent files in APL (A Preliminary Proposal) 1982 ·J. P. Lucas	1
18	Low temperature and grain size effects on the cyclic strain hardening exponent of an HSLA steel 1981 ·Scripta Metallurgica ·J. P. Lucas, W. W. Gerberich	8
19	Low temperature and grain size effects on threshold and fatigue crack propagation in a high strength low alloy steel 1981 ·Materials Science and Engineering ·J. P. Lucas, W. W. Gerberich	33
20	Observation de la résonance quadripolaire pure de l'azote et du chlore dans quelques complexes à transfert de charge 1970 ·Molecular Physics ·J. P. Lucas, L. Guibé	11

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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