H.A. Reed

464 total citations
15 papers, 380 citations indexed

About

H.A. Reed is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Organic Chemistry. According to data from OpenAlex, H.A. Reed has authored 15 papers receiving a total of 380 indexed citations (citations by other indexed papers that have themselves been cited), including 10 papers in Electrical and Electronic Engineering, 8 papers in Biomedical Engineering and 2 papers in Organic Chemistry. Recurrent topics in H.A. Reed's work include 3D IC and TSV technologies (5 papers), Semiconductor Lasers and Optical Devices (4 papers) and Photonic and Optical Devices (3 papers). H.A. Reed is often cited by papers focused on 3D IC and TSV technologies (5 papers), Semiconductor Lasers and Optical Devices (4 papers) and Photonic and Optical Devices (3 papers). H.A. Reed collaborates with scholars based in United States and Canada. H.A. Reed's co-authors include Paul A. Kohl, Sue Ann Bidstrup Allen, Clifford L. Henderson, Muhannad S. Bakir, K. P. Martin, J.D. Meindl, Larry F. Rhodes, D. M. Bhusari, Michael D. Wedlake and V. Kesava Rao and has published in prestigious journals such as Journal of The Electrochemical Society, IEEE Transactions on Electron Devices and Journal of Applied Polymer Science.

In The Last Decade

H.A. Reed

15 papers receiving 372 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
H.A. Reed United States	9	225	158	55	41	37	15	380
Sungkoo Lee South Korea	10	188 0.8×	71 0.4×	180 3.3×	124 3.0×	4 0.1×	43	322
Makoto Hanabata Japan	13	277 1.2×	309 2.0×	33 0.6×	43 1.0×	1 0.0×	57	409
Kenta Yamazaki Japan	5	386 1.7×	34 0.2×	73 1.3×	62 1.5×	25 0.7×	15	445
Yongqi Hu China	8	143 0.6×	36 0.2×	31 0.6×	127 3.1×	2 0.1×	21	300
Masao Tomikawa United States	11	139 0.6×	62 0.4×	258 4.7×	170 4.1×	5 0.1×	44	349
Amalie Atassi United States	8	180 0.8×	97 0.6×	207 3.8×	108 2.6×	2 0.1×	15	341
Takahiro Fukumaru Japan	8	81 0.4×	97 0.6×	167 3.0×	296 7.2×	3 0.1×	8	401
Rong Zhao United States	9	142 0.6×	71 0.4×	63 1.1×	332 8.1×	3 0.1×	17	470
Stephan Knopf France	9	136 0.6×	70 0.4×	14 0.3×	128 3.1×	3 0.1×	10	355

Countries citing papers authored by H.A. Reed

Since Specialization

Citations

This map shows the geographic impact of H.A. Reed's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by H.A. Reed with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites H.A. Reed more than expected).

Fields of papers citing papers by H.A. Reed

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by H.A. Reed. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by H.A. Reed. The network helps show where H.A. Reed may publish in the future.

Co-authorship network of co-authors of H.A. Reed

This figure shows the co-authorship network connecting the top 25 collaborators of H.A. Reed. A scholar is included among the top collaborators of H.A. Reed based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with H.A. Reed. H.A. Reed is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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15 of 15 papers shown

Bakir, Muhannad S., H.A. Reed, Paul A. Kohl, K. P. Martin, & J.D. Meindl. (2003). Sea of leads ultra high-density compliant wafer-level packaging technology. 43 indexed citations

Reed, H.A., Zhen Huang, Larry F. Rhodes, et al.. (2003). Air-channel fabrication for microelectromechanical systems via sacrificial photosensitive polycarbonates. Journal of Microelectromechanical Systems. 12(2). 147–159. 69 indexed citations

Bakir, Muhannad S., H.A. Reed, Paul A. Kohl, et al.. (2003). Chip-to-Module Interconnections Using “Sea of Leads” Technology. MRS Bulletin. 28(1). 61–67. 9 indexed citations

Bakir, Muhannad S., H.A. Reed, Hiren Thacker, et al.. (2003). Sea of leads (SoL) ultrahigh density wafer-level chip input/output interconnections for gigascale integration (GSI). IEEE Transactions on Electron Devices. 50(10). 2039–2048. 44 indexed citations

Reed, H.A., Yong Wang, Larry F. Rhodes, et al.. (2003). Fabrication of Microchannels Using Polynorbornene Photosensitive Sacrificial Materials. Journal of The Electrochemical Society. 150(9). H205–H205. 27 indexed citations

Bakir, Muhannad S., et al.. (2003). Sea of leads (SoL) characterization and design for compatibility with board-level optical waveguide interconnection. 39. 491–494. 3 indexed citations

Reed, H.A., Larry F. Rhodes, Robert A. Shick, et al.. (2003). Photoinitiation systems and thermal decomposition of photodefinable sacrificial materials. Journal of Applied Polymer Science. 88(5). 1186–1195. 7 indexed citations

Reed, H.A., et al.. (2003). Fabrication of microchannels for compliant wafer level packaging using sacrificial materials. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 4979. 287–287. 1 indexed citations

Bakir, Muhannad S., H.A. Reed, S. Ponoth, et al.. (2003). Optical waveguides with embedded air-gap cladding integrated within a sea-of-leads (SoL) wafer-level package. 45. 122–124. 1 indexed citations

10.

Reed, H.A., Larry F. Rhodes, Robert A. Shick, et al.. (2002). Lithographic Characteristics and Thermal Processing of Photosensitive Sacrificial Materials. Journal of The Electrochemical Society. 149(10). G555–G555. 13 indexed citations

11.

Bhusari, D. M., et al.. (2001). Fabrication of air-channel structures for microfluidic, microelectromechanical, and microelectronic applications. Journal of Microelectromechanical Systems. 10(3). 400–408. 72 indexed citations

12.

Reed, H.A., Muhannad S. Bakir, C.S. Patel, et al.. (2001). Compliant wafer level package (CWLP) with embedded air-gaps for sea of leads (SoL) interconnections. 151–153. 8 indexed citations

13.

Reed, H.A., et al.. (2001). Fabrication of microchannels using polycarbonates as sacrificial materials. Journal of Micromechanics and Microengineering. 11(6). 733–737. 74 indexed citations

14.

Drummond, J. E., et al.. (1980). Demonstration of a high power density electrocaloric heat engine. Ferroelectrics. 27(1). 213–213. 6 indexed citations

15.

Drummond, J. E., et al.. (1980). Demonstration of a high power density electro-caloric heat engine. Ferroelectrics. 27(1). 215–218. 3 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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