Dao-Long Chen
- Mechanics of Materials top 10%
- Mechanical Behavior of Composites 6
- Metal and Thin Film Mechanics 5
- Material Properties and Processing 4
- Hardware and Architecture top 10%
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- Electronic Packaging and Soldering Technologies 27
- 3D IC and TSV technologies 24
- Electromagnetic Compatibility and Noise Suppression 5
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- Advanced Surface Polishing Techniques 4
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- Synthesis and properties of polymers 3
Dao-Long Chen
44 papers receiving 466 citations
Peers
Comparison fields: 5 of 65
- Mechanics of Materials 165
- Hardware and Architecture 32
- Electrical and Electronic Engineering 249
- Fluid Flow and Transfer Processes 21
- Materials Chemistry 93
Countries citing papers authored by Dao-Long Chen
This map shows the geographic impact of Dao-Long Chen's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Dao-Long Chen with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Dao-Long Chen more than expected).
Fields of papers citing papers by Dao-Long Chen
This network shows the impact of papers produced by Dao-Long Chen. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Dao-Long Chen. The network helps show where Dao-Long Chen may publish in the future.
Co-authorship network
The 25 scholars most cited alongside Dao-Long Chen, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2024 | 0 | |
| 2 | 2024 | 2 | |
| 3 | 2024 | 2 | |
| 4 | 2024 | 0 | |
| 5 | 2023 | 2 | |
| 6 | 2022 | 18 | |
| 7 | 2022 | 3 | |
| 8 | 2022 | 1 | |
| 9 | 2021 | 3 | |
| 10 | 2021 | 6 | |
| 11 | 2020 | 1 | |
| 12 | 2020 | 4 | |
| 13 | 2020 | 57 | |
| 14 | 2019 | 12 | |
| 15 | 2019 | 3 | |
| 16 | 2019 | 7 | |
| 17 | 2018 | 6 | |
| 18 | 2016 | 104 | |
| 19 | 2016 | 2 | |
| 20 | 2004 | 14 |
About Dao-Long Chen
Dao-Long Chen is a scholar working on Mechanics of Materials, Electrical and Electronic Engineering, Fluid Flow and Transfer Processes, Polymers and Plastics and Mechanical Engineering, having authored 53 papers that have together received 490 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (27 papers), 3D IC and TSV technologies (24 papers), Mechanical Behavior of Composites (6 papers), Electromagnetic Compatibility and Noise Suppression (5 papers), Metal and Thin Film Mechanics (5 papers), Advanced Surface Polishing Techniques (4 papers), Material Properties and Processing (4 papers) and Synthesis and properties of polymers (3 papers). The work is most often cited by research in Mechanics of Materials (165 citations), Hardware and Architecture (32 citations), Electrical and Electronic Engineering (249 citations), Fluid Flow and Transfer Processes (21 citations) and Materials Chemistry (93 citations). Dao-Long Chen has collaborated with scholars based in Taiwan, New Zealand and Singapore. Frequent co-authors include Ping‐Feng Yang, Yi‐Shao Lai, Meng-Kai Shih, C.-P Hung, Wei He, Xiling Liu, David Tarng, Tz-Cheng Chiu, Chin‐Li Kao and Yu‐Hsiang Hsiao. Their work appears in journals such as Mathematics and Mechanics of Solids, IEEE Transactions on Components Packaging and Manufacturing Technology, Microelectronics Reliability, IEEE Transactions on Device and Materials Reliability and International Journal of Solids and Structures.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.