Thomas Uhrmann

524 total citations
54 papers, 399 citations indexed

About

Thomas Uhrmann is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Atomic and Molecular Physics, and Optics. According to data from OpenAlex, Thomas Uhrmann has authored 54 papers receiving a total of 399 indexed citations (citations by other indexed papers that have themselves been cited), including 46 papers in Electrical and Electronic Engineering, 14 papers in Biomedical Engineering and 8 papers in Atomic and Molecular Physics, and Optics. Recurrent topics in Thomas Uhrmann's work include 3D IC and TSV technologies (34 papers), Electronic Packaging and Soldering Technologies (23 papers) and Semiconductor materials and devices (10 papers). Thomas Uhrmann is often cited by papers focused on 3D IC and TSV technologies (34 papers), Electronic Packaging and Soldering Technologies (23 papers) and Semiconductor materials and devices (10 papers). Thomas Uhrmann collaborates with scholars based in Austria, Belgium and United States. Thomas Uhrmann's co-authors include Théodoros Dimopoulos, H. Brückl, L. Bär, M. Rührig, Markus Wimplinger, Paul Lindner, A. Kohn, Eric Beyne, Sascha Weyers and Alain Phommahaxay and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Journal of Physics D Applied Physics.

In The Last Decade

Thomas Uhrmann

48 papers receiving 381 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Thomas Uhrmann Austria 13 311 110 89 59 59 54 399
Wei‐Ting Chen Taiwan 10 231 0.7× 41 0.4× 47 0.5× 69 1.2× 54 0.9× 39 318
Viorel Drăgoi Austria 13 630 2.0× 78 0.7× 179 2.0× 52 0.9× 64 1.1× 107 707
N. Bresson France 11 341 1.1× 47 0.4× 47 0.5× 22 0.4× 35 0.6× 36 365
G. Lullo Italy 12 443 1.4× 103 0.9× 39 0.4× 45 0.8× 46 0.8× 46 507
L.W. Schaper United States 15 563 1.8× 57 0.5× 117 1.3× 62 1.1× 108 1.8× 64 669
Akitsu Shigetou Japan 13 562 1.8× 60 0.5× 172 1.9× 44 0.7× 141 2.4× 54 638
Thomas Signamarcheix France 14 685 2.2× 181 1.6× 164 1.8× 39 0.7× 64 1.1× 38 741
J. Dechamp France 13 373 1.2× 81 0.7× 155 1.7× 17 0.3× 39 0.7× 35 445
J. C. Bea Japan 12 481 1.5× 46 0.4× 161 1.8× 154 2.6× 42 0.7× 53 534
Ionut Radu France 16 638 2.1× 123 1.1× 183 2.1× 27 0.5× 50 0.8× 75 757

Countries citing papers authored by Thomas Uhrmann

Since Specialization
Citations

This map shows the geographic impact of Thomas Uhrmann's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Thomas Uhrmann with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Thomas Uhrmann more than expected).

Fields of papers citing papers by Thomas Uhrmann

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Thomas Uhrmann. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Thomas Uhrmann. The network helps show where Thomas Uhrmann may publish in the future.

Co-authorship network of co-authors of Thomas Uhrmann

This figure shows the co-authorship network connecting the top 25 collaborators of Thomas Uhrmann. A scholar is included among the top collaborators of Thomas Uhrmann based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Thomas Uhrmann. Thomas Uhrmann is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Kang, Shuo, Serena Iacovo, Koen D’havé, et al.. (2025). Wafer-to-Wafer Bonding with Saddle-Shaped Wafers. 2001–2006. 1 indexed citations
2.
Ghosh, Souvik, Quentin Smets, T. Schram, et al.. (2024). EOT Scaling Via 300mm MX2 Dry Transfer - Steps Toward a Manufacturable Process Development and Device Integration. 1–2. 2 indexed citations
3.
4.
Ma, Kai, Nikolaos Bekiaris, Ching‐Hsiang Hsu, et al.. (2024). 0.5 μm Pitch Wafer-to-wafer Hybrid Bonding at Low Temperatures with SiCN Bond Layer. 331–336. 7 indexed citations
5.
Uhrmann, Thomas, et al.. (2023). Novel IR Laser Debonding for Heterogeneous and 3D Integration. IMAPSource Proceedings. 2023(DPC). 1 indexed citations
6.
Li, Ming, et al.. (2023). Direct Die to Wafer Cu Hybrid Bonding for Volume Production. 91–96. 7 indexed citations
7.
Matthias, T., et al.. (2022). Digital Lithography for Advanced Packaging and Heterogenous Integration. 47–51. 1 indexed citations
8.
9.
Uhrmann, Thomas, et al.. (2018). Combined Thick Resist Processing and Topography Patterning for Advanced Metal Plating. 191–194. 2 indexed citations
10.
Vos, Joeri De, Lan Peng, Alain Phommahaxay, et al.. (2016). Importance of alignment control during permanent bonding and its impact on via-last alignment for high density 3D interconnects. 1–5. 10 indexed citations
11.
Wimplinger, Markus, et al.. (2016). Critical Process Parameters And Failure Analysis For Temporary Bonded Wafer Stacks. Additional Conferences (Device Packaging HiTEC HiTEN & CICMT). 2016(DPC). 1255–1276. 1 indexed citations
12.
Uhrmann, Thomas, et al.. (2015). Influencing factors in high precision fusion wafer bonding for monolithic integration. 906–909. 3 indexed citations
13.
Gong, Jie, et al.. (2015). Wafer edge defect study of temporary bonded and thin wafers in TSV process flow. 1707–1712. 6 indexed citations
14.
Uhrmann, Thomas, et al.. (2014). Temporary bonding on the move towards high volume: A status update on cost-of-ownership. 378–382. 2 indexed citations
15.
Uhrmann, Thomas, et al.. (2014). Monolithic IC integration key alignment aspects for high process yield. 1–2. 4 indexed citations
16.
Uhrmann, Thomas, et al.. (2014). Fusion bonding for next- generation 3D-ICs. 1 indexed citations
17.
Uhrmann, Thomas, et al.. (2012). Wafer Bonding for Backside Illuminated Image Sensors. ECS Transactions. 44(1). 1269–1274. 1 indexed citations
18.
Lindner, Paul, T. Glinsner, Thomas Uhrmann, et al.. (2012). Key enabling processes for more-than-moore technologies. 1–2. 2 indexed citations
19.
Dimopoulos, Théodoros, et al.. (2011). Low spin current-driven dynamic excitations and metastability in spin-valve nanocontacts with unpinned artificial antiferromagnet. Applied Physics Letters. 98(4). 4 indexed citations
20.
Dimopoulos, Théodoros, Thomas Uhrmann, A. Kohn, et al.. (2009). Magnetic properties of embedded ferromagnetic contacts to silicon for spin injection. Journal of Physics D Applied Physics. 42(8). 85004–85004. 5 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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