I. Turlik
Impact in
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Semiconductor materials and devices
- Electromagnetic Compatibility and Noise Suppression
- Semiconductor Lasers and Optical Devices
- Photonic and Optical Devices
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- Heat Transfer and Optimization
Papers in
-
- Electronic Packaging and Soldering Technologies 18
- 3D IC and TSV technologies 16
- Electromagnetic Compatibility and Noise Suppression 6
- Silicon Carbide Semiconductor Technologies 6
- Semiconductor Lasers and Optical Devices 5
- Photonic and Optical Devices 4
- Electrostatic Discharge in Electronics 4
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- Copper Interconnects and Reliability 5
- Co-authors
- Lih‐Tyng HwangArnold ReismanRobert DarveauxE.K.N. YungDeepak Kumar NayakK. Linga MurtyD. TempleSrikanth Sastry
- Journals
- Journal of The Electrochemical Society (4 papers)Journal of Electronic Materials (3 papers)JOM (1 paper)IEEE Transactions on Components Packaging and Manufacturing Technology Part B (3 papers)IEEE Transactions on Components Hybrids and Manufacturing Technology (10 papers)
- Partner nations
- United StatesPolandIsrael
In The Last Decade
I. Turlik
31 papers receiving 442 citations
Peers
Comparison fields: 5 of 38
- Electrical and Electronic Engineering 381
- Mechanical Engineering 142
- General Materials Science 11
- Electronic, Optical and Magnetic Materials 57
- Mechanics of Materials 48
Countries citing papers authored by I. Turlik
This map shows the geographic impact of I. Turlik's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by I. Turlik with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites I. Turlik more than expected).
Fields of papers citing papers by I. Turlik
This network shows the impact of papers produced by I. Turlik. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by I. Turlik. The network helps show where I. Turlik may publish in the future.
Co-authors
The 24 scholars most cited alongside I. Turlik, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2005 | 0 | |
| 2 | 2003 | 6 | |
| 3 | 2003 | 3 | |
| 4 | 1995 | 3 | |
| 5 | 1995 | 5 | |
| 6 | 1995 | 18 | |
| 7 | 1994 | 14 | |
| 8 | 1993 | 7 | |
| 9 | 1993 | 18 | |
| 10 | 1993 | 51 | |
| 11 | 1992 | 30 | |
| 12 | 1991 | 7 | |
| 13 | 1991 | 42 | |
| 14 | 1991 | 1 | |
| 15 | 1990 | 11 | |
| 16 | 1990 | 7 | |
| 17 | 1989 | 14 | |
| 18 | 1989 | 30 | |
| 19 | 1988 | 15 | |
| 20 | 1987 | 23 |
About I. Turlik
I. Turlik is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Polymers and Plastics, Mechanical Engineering and Atomic and Molecular Physics, and Optics, having authored 35 papers that have together received 464 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (18 papers), 3D IC and TSV technologies (16 papers), Electromagnetic Compatibility and Noise Suppression (6 papers), Silicon Carbide Semiconductor Technologies (6 papers), Copper Interconnects and Reliability (5 papers), Semiconductor Lasers and Optical Devices (5 papers), Photonic and Optical Devices (4 papers) and Electrostatic Discharge in Electronics (4 papers). The work is most often cited by research in Electrical and Electronic Engineering (381 citations), Mechanical Engineering (142 citations), General Materials Science (11 citations), Electronic, Optical and Magnetic Materials (57 citations) and Mechanics of Materials (48 citations). I. Turlik has collaborated with scholars based in United States, Poland and Israel. Frequent co-authors include Lih‐Tyng Hwang, Arnold Reisman, Robert Darveaux, E.K.N. Yung, Deepak Kumar Nayak, K. Linga Murty, D. Temple, Srikanth Sastry, P Garrou and Carol Mohler. Their work appears in journals such as Journal of The Electrochemical Society, Journal of Electronic Materials, JOM, IEEE Transactions on Components Packaging and Manufacturing Technology Part B and IEEE Transactions on Components Hybrids and Manufacturing Technology.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.