Young-Bae Park
- Electrical and Electronic Engineering top 2%
- Materials Chemistry top 10%
- Electronic, Optical and Magnetic Materials top 5%
- Biomedical Engineering top 10%
- Mechanical Engineering top 5%
- Co-authors
- Shi‐Woo RheeYoung‐Chang JooHarry A. AtwaterMoon Byung-HyunKyung‐Hun ParkJaewon KimDong-Wha ParkByoung‐Joon Kim
- Topics
- Electronic Packaging and Soldering Technologies (105 papers)3D IC and TSV technologies (70 papers)Copper Interconnects and Reliability (60 papers)
- Cited by
- Electrical and Electronic EngineeringElectronic, Optical and Magnetic MaterialsMaterials Chemistry
- Partner nations
- South KoreaUnited StatesAustralia
In The Last Decade
Young-Bae Park
163 papers receiving 2.2k citations
Peers
Comparison fields: 5 of 81
- Electrical and Electronic Engineering 1.7k
- Materials Chemistry 728
- Electronic, Optical and Magnetic Materials 544
- Biomedical Engineering 441
- Mechanical Engineering 393
Countries citing papers authored by Young-Bae Park
This map shows the geographic impact of Young-Bae Park's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Young-Bae Park with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Young-Bae Park more than expected).
Fields of papers citing papers by Young-Bae Park
This network shows the impact of papers produced by Young-Bae Park. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Young-Bae Park. The network helps show where Young-Bae Park may publish in the future.
Co-authorship network of co-authors of Young-Bae Park
This figure shows the co-authorship network connecting the top 25 collaborators of Young-Bae Park. A scholar is included among the top collaborators of Young-Bae Park based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Young-Bae Park. Young-Bae Park is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 1 | |
| 2 | 3 | |
| 3 | 2 | |
| 4 | 1 | |
| 5 | 1 | |
| 6 | 2 | |
| 7 | 0 | |
| 8 | 2 | |
| 9 | 11 | |
| 10 | 1 | |
| 11 | 4 | |
| 12 | 3 | |
| 13 | 2 | |
| 14 | Effect of $N_2+H_2$ Forming Gas Annealing on the Interfacial Bonding Strength of Cu-Cu thermo-compression Bonded Interfaces | 1 |
| 15 | Study on the Intermetallic Compound Growth and Interfacial Adhesion Energy of Cu Pillar Bump | 2 |
| 16 | A Fully Integrated MMIC chip set Employing InGaP/GaAs HBT for Application to Ku band Satellite Communication System | 2 |
| 17 | 17 | |
| 18 | Dominant Migration Element in Electrochemical Migration of Eutectic SnPb Solder Alloy in D. I. Water and NaCl Solutions | 1 |
| 19 | 1 | |
| 20 | Quantitative Assessment of Myocardial Infarction by In-111 Antimyosin Antibody | 0 |
About Young-Bae Park
Young-Bae Park is a scholar working on Electronic, Optical and Magnetic Materials, Electrical and Electronic Engineering and Mechanical Engineering, having authored 173 papers that have together received 2.3k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (105 papers), 3D IC and TSV technologies (70 papers) and Copper Interconnects and Reliability (60 papers). The work is most often cited by research in Electrical and Electronic Engineering (1.7k citations), Electronic, Optical and Magnetic Materials (544 citations) and Materials Chemistry (728 citations). Young-Bae Park has collaborated with scholars based in South Korea, United States and Australia. Frequent co-authors include Shi‐Woo Rhee, Young‐Chang Joo, Harry A. Atwater, Moon Byung-Hyun, Kyung‐Hun Park, Jaewon Kim, Dong-Wha Park, Byoung‐Joon Kim, Kiwook Lee and Hak‐Joo Lee. Their work appears in journals such as Advanced Materials, ACS Nano and Applied Physics Letters.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.