Young-Bae Park

2.7k total citations
173 papers, 2.3k citations indexed

About

Young-Bae Park is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Mechanical Engineering. According to data from OpenAlex, Young-Bae Park has authored 173 papers receiving a total of 2.3k indexed citations (citations by other indexed papers that have themselves been cited), including 160 papers in Electrical and Electronic Engineering, 60 papers in Electronic, Optical and Magnetic Materials and 35 papers in Mechanical Engineering. Recurrent topics in Young-Bae Park's work include Electronic Packaging and Soldering Technologies (105 papers), 3D IC and TSV technologies (70 papers) and Copper Interconnects and Reliability (60 papers). Young-Bae Park is often cited by papers focused on Electronic Packaging and Soldering Technologies (105 papers), 3D IC and TSV technologies (70 papers) and Copper Interconnects and Reliability (60 papers). Young-Bae Park collaborates with scholars based in South Korea, United States and Australia. Young-Bae Park's co-authors include Shi‐Woo Rhee, Young‐Chang Joo, Harry A. Atwater, Moon Byung-Hyun, Kyung‐Hun Park, Jaewon Kim, Dong-Wha Park, Byoung‐Joon Kim, Kiwook Lee and Hak‐Joo Lee and has published in prestigious journals such as Advanced Materials, ACS Nano and Applied Physics Letters.

In The Last Decade

Young-Bae Park

163 papers receiving 2.2k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Young-Bae Park South Korea 25 1.7k 728 544 441 393 173 2.3k
Hoo-Jeong Lee South Korea 29 1.7k 1.0× 1.2k 1.7× 408 0.8× 519 1.2× 504 1.3× 141 2.6k
Zhengfang Qian China 29 2.0k 1.1× 604 0.8× 339 0.6× 365 0.8× 323 0.8× 136 2.5k
Shuming Zhang China 25 1.1k 0.7× 541 0.7× 561 1.0× 343 0.8× 193 0.5× 131 2.1k
Benji Maruyama United States 25 666 0.4× 968 1.3× 303 0.6× 559 1.3× 295 0.8× 59 1.8k
Mutharasu Devarajan Malaysia 21 988 0.6× 1.0k 1.4× 224 0.4× 277 0.6× 280 0.7× 205 1.9k
Naesung Lee South Korea 28 696 0.4× 1.3k 1.8× 324 0.6× 511 1.2× 349 0.9× 97 2.1k
Sungho Choi South Korea 26 1.4k 0.8× 851 1.2× 378 0.7× 275 0.6× 212 0.5× 140 2.0k
Daming Zhuang China 26 1.2k 0.7× 1.6k 2.2× 250 0.5× 434 1.0× 413 1.1× 98 2.4k
Moo Whan Shin South Korea 25 1.1k 0.6× 425 0.6× 366 0.7× 163 0.4× 343 0.9× 101 2.0k
Sergio Ferrero Italy 22 937 0.5× 501 0.7× 401 0.7× 689 1.6× 136 0.3× 102 1.7k

Countries citing papers authored by Young-Bae Park

Since Specialization
Citations

This map shows the geographic impact of Young-Bae Park's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Young-Bae Park with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Young-Bae Park more than expected).

Fields of papers citing papers by Young-Bae Park

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Young-Bae Park. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Young-Bae Park. The network helps show where Young-Bae Park may publish in the future.

Co-authorship network of co-authors of Young-Bae Park

This figure shows the co-authorship network connecting the top 25 collaborators of Young-Bae Park. A scholar is included among the top collaborators of Young-Bae Park based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Young-Bae Park. Young-Bae Park is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Kim, Soohyun, et al.. (2025). Effects of the TiN diffusion barrier and post‑annealing between Ru and SiO2 films on the interfacial adhesion energy for advanced interconnections. Japanese Journal of Applied Physics. 64(3). 03SP46–03SP46. 1 indexed citations
2.
Park, Young-Bae, et al.. (2024). Structural, Optical, Electrical, and Nanomechanical Properties of F-Doped Sno2 Fabricated by Ultrasonic Spray Pyrolysis. Electronic Materials Letters. 20(4). 402–413. 3 indexed citations
3.
Kim, Cheol, et al.. (2022). Interfacial Adhesion Energies of Uniformly Self-Formed Cr2O3 Barriers for Advanced Co Interconnects. Electronic Materials Letters. 18(5). 447–455. 2 indexed citations
4.
Kim, Sarah Eunkyung, et al.. (2021). Effects of Ar/N 2 Two-step Plasma Treatment on the Quantitative Interfacial Adhesion Energy of Low-Temperature Cu-Cu Bonding Interface. Journal of the Microelectronics and Packaging Society. 28(2). 29–37. 1 indexed citations
5.
Kim, Sung‐Tae, et al.. (2021). Effect of Ta/Cu Film Stack Structures on the Interfacial Adhesion Energy for Advanced Interconnects. Journal of the Microelectronics and Packaging Society. 28(1). 39–46. 1 indexed citations
6.
Park, Young-Bae, et al.. (2020). Bonding Strength Evaluation of Copper Bonding Using Copper Nitride Layer. Journal of the Microelectronics and Packaging Society. 27(3). 55–60. 2 indexed citations
7.
Park, Young-Bae, et al.. (2015). Effect of Heat Treatment on Interface Behavior in Ni-P/Cr Double Layer. Journal of the Korean institute of surface engineering. 48(6). 260–268.
8.
9.
Kim, Jaewon, et al.. (2012). Improvement of Wafer-Level Cu-to-Cu Bonding Quality Using Wet Chemical Pretreatment. Journal of Nanoscience and Nanotechnology. 12(4). 3577–3581. 11 indexed citations
10.
Kim, Jeong‐Kyu, Eunkyung Lee, Mi-Sung Kim, et al.. (2012). Interfacial Adhesion Energy of Ni-P Electroless-plating Contact for Buried Contact Silicon Solar Cell using 4-point Bending Test System. Journal of the Microelectronics and Packaging Society. 19(1). 55–60. 1 indexed citations
11.
Kim, Jaewon, et al.. (2011). Characterization and observation of Cu-Cu Thermo-Compression Bonding using 4-point bending test system. Journal of the Microelectronics and Packaging Society. 18(4). 11–18. 4 indexed citations
12.
Kim, Byoung‐Joon, et al.. (2011). Relationship between Tensile Characteristics and Fatigue Failure by Folding or Bending in Cu Foil on Flexible Substrate. Journal of the Microelectronics and Packaging Society. 18(1). 55–59. 3 indexed citations
13.
Yoo, Sehoon, et al.. (2010). Effect of PCB Surface Finishs on Intermetallic Compound Growth Kinetics of Sn-3.0Ag-0.5Cu Solder Bump. Journal of the Microelectronics and Packaging Society. 17(1). 81–88. 2 indexed citations
14.
Kim, Jaewon, et al.. (2009). Effect of $N_2+H_2$ Forming Gas Annealing on the Interfacial Bonding Strength of Cu-Cu thermo-compression Bonded Interfaces. Journal of the Microelectronics and Packaging Society. 16(3). 31–37. 1 indexed citations
15.
Lee, Kiwook, et al.. (2008). Study on the Intermetallic Compound Growth and Interfacial Adhesion Energy of Cu Pillar Bump. Journal of the Microelectronics and Packaging Society. 15(4). 17–24. 2 indexed citations
16.
Park, Young-Bae, et al.. (2008). A Fully Integrated MMIC chip set Employing InGaP/GaAs HBT for Application to Ku band Satellite Communication System. ITC-CSCC :International Technical Conference on Circuits Systems, Computers and Communications. 39. 1397–1400. 2 indexed citations
17.
Diest, Kenneth, et al.. (2008). Silver diffusion bonding and layer transfer of lithium niobate to silicon. Applied Physics Letters. 93(9). 17 indexed citations
18.
Kim, Youngsik, et al.. (2006). Dominant Migration Element in Electrochemical Migration of Eutectic SnPb Solder Alloy in D. I. Water and NaCl Solutions. Journal of the Microelectronics and Packaging Society. 13(3). 1–8. 1 indexed citations
19.
Koo, Bon‐Kwon, Myoung-Mook Lee, Woo‐Young Chung, et al.. (2003). Effect of -irradiation with 188 Re-filled long-balloon on reference segments. Journal of the American College of Cardiology. 41(6). 9–9. 1 indexed citations
20.
Lee, Myung Chul, et al.. (1991). Quantitative Assessment of Myocardial Infarction by In-111 Antimyosin Antibody. The Korean Journal of Nuclear Medicine. 25(1). 37–45.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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