Bob Chylak

839 total citations
50 papers, 636 citations indexed

About

Bob Chylak is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, Bob Chylak has authored 50 papers receiving a total of 636 indexed citations (citations by other indexed papers that have themselves been cited), including 48 papers in Electrical and Electronic Engineering, 13 papers in Mechanical Engineering and 7 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in Bob Chylak's work include Electronic Packaging and Soldering Technologies (47 papers), 3D IC and TSV technologies (43 papers) and Copper Interconnects and Reliability (7 papers). Bob Chylak is often cited by papers focused on Electronic Packaging and Soldering Technologies (47 papers), 3D IC and TSV technologies (43 papers) and Copper Interconnects and Reliability (7 papers). Bob Chylak collaborates with scholars based in United States, Singapore and Germany. Bob Chylak's co-authors include Horst Clauberg, Ivy Qin, Hui Xu, Viola L. Acoff, Zhong Chen, Chee Lip Gan, Cuong Huynh, Ali Reza Rezvani, Liming Shen and Subramanian S. Iyer and has published in prestigious journals such as Acta Materialia, Scripta Materialia and Microelectronics Reliability.

In The Last Decade

Bob Chylak

45 papers receiving 530 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Bob Chylak United States 16 549 226 120 79 62 50 636
Charles J. Vath United States 13 624 1.1× 300 1.3× 98 0.8× 67 0.8× 119 1.9× 28 711
H. Frémont France 12 365 0.7× 129 0.6× 42 0.3× 33 0.4× 73 1.2× 68 424
Ivy Qin United States 11 302 0.6× 145 0.6× 67 0.6× 47 0.6× 44 0.7× 34 361
Olaf Wittler Germany 13 468 0.9× 151 0.7× 44 0.4× 57 0.7× 150 2.4× 97 598
F. Wulff Singapore 14 410 0.7× 312 1.4× 71 0.6× 98 1.2× 133 2.1× 29 566
Ruyu Tian China 14 374 0.7× 374 1.7× 33 0.3× 73 0.9× 63 1.0× 30 563
Gaohong Xu China 19 790 1.4× 148 0.7× 269 2.2× 102 1.3× 98 1.6× 48 900
Barbara Horváth Hungary 14 355 0.6× 191 0.8× 57 0.5× 82 1.0× 38 0.6× 31 445
Paresh Limaye Belgium 13 480 0.9× 177 0.8× 51 0.4× 40 0.5× 64 1.0× 30 523
Scott Irving United States 11 423 0.8× 132 0.6× 80 0.7× 29 0.4× 122 2.0× 51 476

Countries citing papers authored by Bob Chylak

Since Specialization
Citations

This map shows the geographic impact of Bob Chylak's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Bob Chylak with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Bob Chylak more than expected).

Fields of papers citing papers by Bob Chylak

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Bob Chylak. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Bob Chylak. The network helps show where Bob Chylak may publish in the future.

Co-authorship network of co-authors of Bob Chylak

This figure shows the co-authorship network connecting the top 25 collaborators of Bob Chylak. A scholar is included among the top collaborators of Bob Chylak based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Bob Chylak. Bob Chylak is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Bajwa, Adeel, et al.. (2022). Fluxless Bonding Via In-Situ Oxide Reduction. 498–502. 3 indexed citations
2.
Chylak, Bob, et al.. (2019). Fine-Pitch (≤10 µm) Direct Cu-Cu Interconnects Using In-Situ Formic Acid Vapor Treatment. 620–627. 33 indexed citations
3.
Marte, A., et al.. (2018). Advances in Memory Die Stacking. 4. 407–418. 2 indexed citations
4.
Qin, Ivy, et al.. (2017). Advances in Wire Bonding Technology for 3D Die Stacking and Fan Out Wafer Level Package. 1309–1315. 31 indexed citations
5.
Huynh, Cuong, et al.. (2017). Wire Bonding Looping Solutions for High Density System-in-Package (SiP). IMAPSource Proceedings. 2017(1). 426–431. 4 indexed citations
6.
Boothroyd, Chris, et al.. (2016). Interfacial evolution and bond reliability in thermosonic Pd coated Cu wire bonding on aluminum metallization: Effect of palladium distribution. Microelectronics Reliability. 63. 214–223. 15 indexed citations
7.
Xu, Hui, Ivy Qin, Horst Clauberg, Bob Chylak, & Viola L. Acoff. (2016). New observation of nanoscale interfacial evolution in micro Cu–Al wire bonds by in-situ high resolution TEM study. Scripta Materialia. 115. 1–5. 29 indexed citations
8.
Qin, Ivy, et al.. (2016). Wire Bonding Looping Solutions for Advanced High Pin Count Devices. 614–621. 6 indexed citations
9.
Xu, Hui, et al.. (2015). Development of advanced wire bonding technology for QFN devices. 1385–1391. 6 indexed citations
10.
11.
Qin, Ivy, et al.. (2015). Advances in Wire Bonding Technology for Different Bonding Wire Material. IMAPSource Proceedings. 2015(1). 406–412. 13 indexed citations
12.
Clauberg, Horst, et al.. (2015). Thermocompression flip chip bonding optimization for pre-applied underfill. 1–4. 7 indexed citations
13.
Chylak, Bob, et al.. (2014). Ultra-fine pitch palladium-coated copper wire bonding: Effect of bonding parameters. Microelectronics Reliability. 54(11). 2555–2563. 19 indexed citations
14.
Clauberg, Horst, et al.. (2014). Advanced thermocompression flip chip bonding. 492–495. 1 indexed citations
15.
Rezvani, Ali Reza, et al.. (2013). Stitch Bond Process of Pd-Coated Cu Wire: Experimental and Numerical Studies of Process Parameters and Materials. IMAPSource Proceedings. 2013(1). 312–317. 2 indexed citations
16.
Qin, Ivy, et al.. (2012). Ball Bond Process Optimization with Cu and Pd-Coated Cu Wire. ECS Transactions. 44(1). 891–901. 5 indexed citations
17.
Qin, Ivy, Cuong Huynh, Horst Clauberg, et al.. (2012). Pd-coated Cu Wire Bonding Reliability Requirement for Device Design, Process Optimization and Testing. IMAPSource Proceedings. 2012(1). 396–404. 5 indexed citations
18.
Wu, Jie, et al.. (2012). Bonding of Ag-alloy wire in LED packages. 1–4. 11 indexed citations
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20.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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