Su‐Tsai Lu

484 total citations
32 papers, 369 citations indexed

About

Su‐Tsai Lu is a scholar working on Electrical and Electronic Engineering, Automotive Engineering and Mechanical Engineering. According to data from OpenAlex, Su‐Tsai Lu has authored 32 papers receiving a total of 369 indexed citations (citations by other indexed papers that have themselves been cited), including 30 papers in Electrical and Electronic Engineering, 8 papers in Automotive Engineering and 8 papers in Mechanical Engineering. Recurrent topics in Su‐Tsai Lu's work include Electronic Packaging and Soldering Technologies (29 papers), 3D IC and TSV technologies (28 papers) and Additive Manufacturing and 3D Printing Technologies (8 papers). Su‐Tsai Lu is often cited by papers focused on Electronic Packaging and Soldering Technologies (29 papers), 3D IC and TSV technologies (28 papers) and Additive Manufacturing and 3D Printing Technologies (8 papers). Su‐Tsai Lu collaborates with scholars based in Taiwan and United States. Su‐Tsai Lu's co-authors include Wen‐Hwa Chen, Hsien‐Chie Cheng, Tai‐Hong Chen, Chau‐Jie Zhan, Tao‐Chih Chang, Yu-Min Lin, Yuhua Chen, Wei‐Chung Lo, John H. Lau and You-Wei Chen and has published in prestigious journals such as Journal of Electronic Materials, Microelectronics Reliability and IEEE Transactions on Components and Packaging Technologies.

In The Last Decade

Su‐Tsai Lu

30 papers receiving 359 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Su‐Tsai Lu Taiwan 11 322 103 67 51 48 32 369
Ser Choong Chong Singapore 12 446 1.4× 58 0.6× 60 0.9× 99 1.9× 35 0.7× 96 488
Kuo‐Shu Kao Taiwan 13 311 1.0× 81 0.8× 58 0.9× 44 0.9× 17 0.4× 42 333
R. Kahle Germany 13 312 1.0× 50 0.5× 50 0.7× 63 1.2× 44 0.9× 35 372
V. Bader Germany 11 280 0.9× 59 0.6× 37 0.6× 42 0.8× 49 1.0× 34 327
Paresh Limaye Belgium 13 480 1.5× 177 1.7× 59 0.9× 44 0.9× 64 1.3× 30 523
Jan Felba Poland 11 314 1.0× 94 0.9× 75 1.1× 127 2.5× 61 1.3× 81 416
Nitesh Kumbhat United States 11 398 1.2× 58 0.6× 55 0.8× 109 2.1× 21 0.4× 31 475
Tai Chong Chai Singapore 12 450 1.4× 111 1.1× 63 0.9× 68 1.3× 42 0.9× 56 474
Chau‐Jie Zhan Taiwan 14 451 1.4× 67 0.7× 89 1.3× 75 1.5× 18 0.4× 56 475
Woon‐Seong Kwon South Korea 15 450 1.4× 72 0.7× 40 0.6× 88 1.7× 102 2.1× 30 487

Countries citing papers authored by Su‐Tsai Lu

Since Specialization
Citations

This map shows the geographic impact of Su‐Tsai Lu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Su‐Tsai Lu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Su‐Tsai Lu more than expected).

Fields of papers citing papers by Su‐Tsai Lu

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Su‐Tsai Lu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Su‐Tsai Lu. The network helps show where Su‐Tsai Lu may publish in the future.

Co-authorship network of co-authors of Su‐Tsai Lu

This figure shows the co-authorship network connecting the top 25 collaborators of Su‐Tsai Lu. A scholar is included among the top collaborators of Su‐Tsai Lu based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Su‐Tsai Lu. Su‐Tsai Lu is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Cheng, Hsien‐Chie, et al.. (2017). Temperature effects on ink transfer performance of gravure offset printing for fine-line circuitry. 475–478. 2 indexed citations
2.
Cheng, Hsien‐Chie, You-Wei Chen, Wen‐Hwa Chen, Su‐Tsai Lu, & Shih-Ming Lin. (2017). Assessing Ink Transfer Performance of Gravure-Offset Fine-Line Circuitry Printing. Journal of Electronic Materials. 47(3). 1832–1846. 8 indexed citations
3.
Cheng, Hsien‐Chie, et al.. (2015). Hygro-thermo-mechanical Behavior of Adhesive-Based Flexible Chip-on-Flex Packaging. Journal of Electronic Materials. 44(4). 1220–1237. 14 indexed citations
4.
Cheng, Hsien‐Chie, et al.. (2013). Process-dependent Thermal-Mechanical Behaviors of anAdvanced Thin-Flip-Chip-on-Flex InterconnectTechnology with Anisotropic Conductive Film Joints. Cmc-computers Materials & Continua. 38(3). 129–154. 2 indexed citations
5.
Cheng, Hsien‐Chie, et al.. (2013). Drop Impact Reliability Analysis of 3-D Chip-on-Chip Packaging: Numerical Modeling and Experimental Validation. IEEE Transactions on Device and Materials Reliability. 14(1). 499–511. 24 indexed citations
6.
Cheng, Hsien‐Chie, et al.. (2013). Interconnect Reliability Characterization of a High-Density 3-D Chip-on-Chip Interconnect Technology. IEEE Transactions on Components Packaging and Manufacturing Technology. 3(12). 2037–2047. 19 indexed citations
7.
Chen, Wen‐Hwa, et al.. (2012). IMC growth reaction and its effects on solder joint thermal cycling reliability of 3D chip stacking packaging. Microelectronics Reliability. 53(1). 30–40. 58 indexed citations
8.
Lu, Su‐Tsai, et al.. (2012). The development of high through-put micro-bump-bonded process with non-conductive paste (NCP). 114–118. 5 indexed citations
9.
10.
Lu, Su‐Tsai, et al.. (2011). Development of micro-bump-bonded processes for 3DIC stacking with high throughput. 366–369. 5 indexed citations
11.
12.
Lu, Su‐Tsai & Wen‐Hwa Chen. (2010). Reliability and Flexibility of Ultra-Thin Chip-on-Flex (UTCOF) Interconnects With Anisotropic Conductive Adhesive (ACA) Joints. IEEE Transactions on Advanced Packaging. 33(3). 702–712. 21 indexed citations
13.
14.
Lu, Su‐Tsai & Wen‐Hwa Chen. (2010). Experimental/Numerical Analysis of Thermally Induced Warpage of Ultrathin Chip-on-Flex (UTCOF) Interconnects. IEEE Transactions on Components and Packaging Technologies. 33(4). 819–829. 7 indexed citations
15.
Lu, Su‐Tsai, et al.. (2010). Development of a Novel Compliant-Bump Structure for ACA-Bonded Chip-on-Flex (COF) Interconnects With Ultra-Fine Pitch. IEEE Transactions on Components Packaging and Manufacturing Technology. 1(1). 33–42. 10 indexed citations
16.
17.
Lu, Su‐Tsai & Wen‐Hwa Chen. (2008). Reliability of ultra-thin chip-on-flex (UTCOF) with anisotropic conductive adhesive (ACA) joints. 1287–1293. 10 indexed citations
18.
19.
Lo, Wei‐Chung, et al.. (2006). An Innovative Chip-to-Wafer and Wafer-to-Wafer Stacking. 409–414. 12 indexed citations
20.
Lu, Su‐Tsai, et al.. (2006). Development and Characterization of Rigid-Flex Interface. 82. 1836–1840. 6 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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Breakdown of academic impact, for papers by Ser Choong Chong Breakdown of academic impact, for papers by Kuo‐Shu Kao Breakdown of academic impact, for papers by R. Kahle Breakdown of academic impact, for papers by V. Bader Breakdown of academic impact, for papers by Paresh Limaye Breakdown of academic impact, for papers by Jan Felba Breakdown of academic impact, for papers by Nitesh Kumbhat Breakdown of academic impact, for papers by Tai Chong Chai Breakdown of academic impact, for papers by Chau‐Jie Zhan Breakdown of academic impact, for papers by Woon‐Seong Kwon
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