Tung‐Han Chuang
Impact in
- General Materials Science top 0.2%
- Mechanical Engineering top 0.5%
- Aluminum Alloys Composites Properties
- Intermetallics and Advanced Alloy Properties
- Advanced Welding Techniques Analysis
Papers in
-
- Aluminum Alloys Composites Properties 43
- Advanced Welding Techniques Analysis 42
- Intermetallics and Advanced Alloy Properties 41
- Co-authors
- L.C. TsaoT. C. TsaiShih‐Ying ChangM. S. YehShoei‐Shen WangWenping WengHsing‐Hua TsaiSheng‐Chi Chen
- Journals
- Journal of Electronic Materials (45 papers)Journal of Materials Engineering and Performance (22 papers)Metallurgical and Materials Transactions A (22 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (14 papers)Journal of Alloys and Compounds (12 papers)
- Partner nations
- TaiwanGermanyUnited States
In The Last Decade
Tung‐Han Chuang
203 papers receiving 3.0k citations
Peers
Comparison fields: 5 of 65
- General Materials Science 179
- Mechanical Engineering 2.0k
- Metals and Alloys 92
- Ceramics and Composites 203
- Electrical and Electronic Engineering 1.9k
Countries citing papers authored by Tung‐Han Chuang
This map shows the geographic impact of Tung‐Han Chuang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Tung‐Han Chuang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Tung‐Han Chuang more than expected).
Fields of papers citing papers by Tung‐Han Chuang
This network shows the impact of papers produced by Tung‐Han Chuang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Tung‐Han Chuang. The network helps show where Tung‐Han Chuang may publish in the future.
Co-authors
The 25 scholars most cited alongside Tung‐Han Chuang, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2025 | 1 | |
| 2 | 2025 | 0 | |
| 3 | 2024 | 1 | |
| 4 | 2023 | 1 | |
| 5 | 2023 | 13 | |
| 6 | 2023 | 1 | |
| 7 | 2023 | 1 | |
| 8 | 2023 | 2 | |
| 9 | 2021 | 1 | |
| 10 | 2021 | 1 | |
| 11 | 2021 | 10 | |
| 12 | 2021 | 4 | |
| 13 | 2020 | 7 | |
| 14 | 2020 | 7 | |
| 15 | 2019 | 5 | |
| 16 | 2012 | 45 | |
| 17 | 2004 | 24 | |
| 18 | Effects of superplastic deformation on the diffusion welding of SuperDux 65 stainless steel | 1999 | 5 |
| 19 | Transient liquid phase metallic bonding of an Inconel 718SPF superalloy | 1997 | 2 |
| 20 | On the Relationship between Electrical Conductivity and Stress Corrosion Susceptibility of 7075 and 7475 Aluminum Alloys | 1996 | 2 |
About Tung‐Han Chuang
Tung‐Han Chuang is a scholar working on General Materials Science, Mechanical Engineering, Ceramics and Composites, Metals and Alloys and Electrical and Electronic Engineering, having authored 211 papers that have together received 3.1k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (112 papers), 3D IC and TSV technologies (54 papers), Aluminum Alloys Composites Properties (43 papers), Advanced Welding Techniques Analysis (42 papers), Intermetallics and Advanced Alloy Properties (41 papers), Copper Interconnects and Reliability (29 papers), Aluminum Alloy Microstructure Properties (23 papers) and Microstructure and mechanical properties (22 papers). The work is most often cited by research in General Materials Science (179 citations), Mechanical Engineering (2.0k citations), Metals and Alloys (92 citations), Ceramics and Composites (203 citations) and Electrical and Electronic Engineering (1.9k citations). Tung‐Han Chuang has collaborated with scholars based in Taiwan, Germany and United States. Frequent co-authors include L.C. Tsao, T. C. Tsai, Shih‐Ying Chang, M. S. Yeh, Shoei‐Shen Wang, Wenping Weng, Hsing‐Hua Tsai, Sheng‐Chi Chen, Chun‐Hao Chen and Hui Sun. Their work appears in journals such as Journal of Electronic Materials, Journal of Materials Engineering and Performance, Metallurgical and Materials Transactions A, IEEE Transactions on Components Packaging and Manufacturing Technology and Journal of Alloys and Compounds.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.