Chun-Kai Liu

434 total citations
38 papers, 334 citations indexed

About

Chun-Kai Liu is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Materials Chemistry. According to data from OpenAlex, Chun-Kai Liu has authored 38 papers receiving a total of 334 indexed citations (citations by other indexed papers that have themselves been cited), including 21 papers in Electrical and Electronic Engineering, 15 papers in Mechanical Engineering and 13 papers in Materials Chemistry. Recurrent topics in Chun-Kai Liu's work include Advanced Thermoelectric Materials and Devices (12 papers), Silicon Carbide Semiconductor Technologies (11 papers) and Thermal Radiation and Cooling Technologies (8 papers). Chun-Kai Liu is often cited by papers focused on Advanced Thermoelectric Materials and Devices (12 papers), Silicon Carbide Semiconductor Technologies (11 papers) and Thermal Radiation and Cooling Technologies (8 papers). Chun-Kai Liu collaborates with scholars based in Taiwan and United States. Chun-Kai Liu's co-authors include Fang‐Lin Chao, Ra-Min Tain, Ming-Ji Dai, Mei‐Jiau Huang, Heng-Chieh Chien, Kuo‐Ning Chiang, Guang-Li Luo, Shih‐Chiang Huang, Chih-Cheng Hsieh and Wei Li and has published in prestigious journals such as Journal of Applied Physics, International Journal of Heat and Mass Transfer and IEEE Transactions on Electron Devices.

In The Last Decade

Chun-Kai Liu

36 papers receiving 320 citations

Peers

Chun-Kai Liu
Lan Kim South Korea
Klas Brinkfeldt Sweden
Yu. I. Shtern Russia
D. Eberhard Germany
D. May Germany
Markus Baumann Germany
Gary L. Solbrekken United States
Jianzheng Hu South Korea
Atul Vir Singh India
Chih-Ting Yeh Taiwan
Lan Kim South Korea
Chun-Kai Liu
Citations per year, relative to Chun-Kai Liu Chun-Kai Liu (= 1×) peers Lan Kim

Countries citing papers authored by Chun-Kai Liu

Since Specialization
Citations

This map shows the geographic impact of Chun-Kai Liu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Chun-Kai Liu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Chun-Kai Liu more than expected).

Fields of papers citing papers by Chun-Kai Liu

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Chun-Kai Liu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Chun-Kai Liu. The network helps show where Chun-Kai Liu may publish in the future.

Co-authorship network of co-authors of Chun-Kai Liu

This figure shows the co-authorship network connecting the top 25 collaborators of Chun-Kai Liu. A scholar is included among the top collaborators of Chun-Kai Liu based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Chun-Kai Liu. Chun-Kai Liu is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
2.
Liu, Chun-Kai, et al.. (2022). Thermal Performance of Single-Phase and Two-Phase Immersion Cooling in Data Center. 1–4. 5 indexed citations
3.
4.
Liu, Chun-Kai, et al.. (2018). SiC power module for motor driving system. 363–366. 2 indexed citations
5.
Shiue, Ren-Kae, et al.. (2017). Interfacial Reaction and Bonding Strength of Ti<sub>50</sub>Ni<sub>50</sub> and Inconel 600 Dissimilar Brazed Joints. MATERIALS TRANSACTIONS. 58(9). 1308–1312. 2 indexed citations
6.
Liu, Chun-Kai, et al.. (2015). The amelioration of metabolic disorders in early stage diabetic rats by resveratrol is associated with mTORC1 regulation. Journal of Functional Foods. 18. 737–745. 1 indexed citations
7.
Liu, Chun-Kai, et al.. (2015). Development of packaging technologies for SiC power module. 269–272. 4 indexed citations
8.
Liu, Chun-Kai, et al.. (2014). Electro-thermal finite element analysis and verification of power module with aluminum wire. Microelectronic Engineering. 120. 114–120. 25 indexed citations
9.
Chien, Heng-Chieh, et al.. (2013). Evaluation of Temperature-Dependent Effective Material Properties and Performance of a Thermoelectric Module. Journal of Electronic Materials. 42(7). 2362–2370. 10 indexed citations
10.
Dai, Ming-Ji, et al.. (2013). Thermo-electric finite element analysis and characteristic of thermoelectric generator with intermetallic compound. Microelectronic Engineering. 120. 194–199. 5 indexed citations
11.
Liu, Chun-Kai, Fang‐Lin Chao, Kuo‐Shu Kao, et al.. (2012). IGBT power module packaging for EV applications. 1–4. 12 indexed citations
12.
Hsieh, Chih-Cheng, et al.. (2011). A novel single slope ADC design for wide dynamic range CMOS image sensors. 889–892. 6 indexed citations
13.
Huang, Mei‐Jiau, et al.. (2008). A theoretical study of the specific heat and Debye temperature of low-dimensional materials. International Journal of Heat and Mass Transfer. 51(17-18). 4470–4479. 19 indexed citations
14.
Liu, Chun-Kai, et al.. (2008). Stacked Thermoelectric Generator Module Integrated with Partial Electric Conducted Interposer Structure. 413. 355–360. 2 indexed citations
15.
Liu, Chun-Kai, Heng-Chieh Chien, Ming-Ji Dai, et al.. (2008). Thermal conductivity of Si/SiGe superlattice films. Journal of Applied Physics. 104(11). 46 indexed citations
16.
Liu, Chun-Kai, et al.. (2008). Thermal Measurement and Simulation of 3D stacked die packages. 8. 379–382.
17.
Liu, Chun-Kai, et al.. (2005). Cooling performance of silicon-based thermoelectric device on high power LED. 53–56. 67 indexed citations
18.
Liu, Chun-Kai, et al.. (2004). Characteristics of 1D and 2D optical scanning epi-Si-mirror devices. 5. 155–156. 2 indexed citations
19.
Liu, Chun-Kai, et al.. (2003). Thermal analysis of power amplifier package in cellular phones. 22. 415–421. 2 indexed citations
20.
Chen, Yau‐Ming & Chun-Kai Liu. (1997). A HOLOGRAPHIC INTERFEROMETRY STUDY OF THE DOUBLE-DIFFUSIVE LAYERED SYSTEM. Experimental Heat Transfer. 10(1). 67–86. 5 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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