Chang‐Chun Lee

3.1k total citations
200 papers, 2.4k citations indexed

About

Chang‐Chun Lee is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Mechanics of Materials. According to data from OpenAlex, Chang‐Chun Lee has authored 200 papers receiving a total of 2.4k indexed citations (citations by other indexed papers that have themselves been cited), including 139 papers in Electrical and Electronic Engineering, 53 papers in Biomedical Engineering and 33 papers in Mechanics of Materials. Recurrent topics in Chang‐Chun Lee's work include Electronic Packaging and Soldering Technologies (83 papers), 3D IC and TSV technologies (62 papers) and Semiconductor materials and devices (37 papers). Chang‐Chun Lee is often cited by papers focused on Electronic Packaging and Soldering Technologies (83 papers), 3D IC and TSV technologies (62 papers) and Semiconductor materials and devices (37 papers). Chang‐Chun Lee collaborates with scholars based in Taiwan, United States and France. Chang‐Chun Lee's co-authors include Yen Sun, Huey W. Huang, Kuo‐Ning Chiang, Faa‐Jeng Lin, Wei‐Chin Hung, Fang-Yu Chen, Pei‐Chen Huang, Shuo Qian, Ming-Tao Lee and R.-J. Wai and has published in prestigious journals such as Nano Letters, ACS Nano and Applied Physics Letters.

In The Last Decade

Chang‐Chun Lee

181 papers receiving 2.3k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Chang‐Chun Lee Taiwan 24 1.1k 461 383 276 254 200 2.4k
Hiroshi Watanabe Japan 26 1.5k 1.4× 165 0.4× 277 0.7× 382 1.4× 350 1.4× 229 2.8k
Chongyang Li China 27 459 0.4× 613 1.3× 172 0.4× 442 1.6× 788 3.1× 140 2.2k
Ho-Yong Lee South Korea 27 344 0.3× 213 0.5× 364 1.0× 686 2.5× 827 3.3× 128 2.1k
Shahid Mehmood Pakistan 27 656 0.6× 392 0.9× 1.0k 2.7× 412 1.5× 706 2.8× 143 3.1k
Xin Zheng China 35 2.0k 1.9× 323 0.7× 135 0.4× 468 1.7× 1.1k 4.3× 161 3.4k
Sung Hyun Park South Korea 33 1.3k 1.2× 477 1.0× 305 0.8× 1.5k 5.6× 756 3.0× 152 3.9k
Yannan Liu China 37 1.2k 1.1× 282 0.6× 132 0.3× 896 3.2× 1.4k 5.6× 125 3.9k
Jaeyong Kim South Korea 22 461 0.4× 72 0.2× 326 0.9× 326 1.2× 1.1k 4.2× 146 2.1k
Yiqiang Chen China 24 1.2k 1.1× 257 0.6× 84 0.2× 260 0.9× 301 1.2× 159 2.0k
Feng Lin China 30 900 0.8× 314 0.7× 130 0.3× 1.3k 4.6× 882 3.5× 141 3.0k

Countries citing papers authored by Chang‐Chun Lee

Since Specialization
Citations

This map shows the geographic impact of Chang‐Chun Lee's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Chang‐Chun Lee with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Chang‐Chun Lee more than expected).

Fields of papers citing papers by Chang‐Chun Lee

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Chang‐Chun Lee. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Chang‐Chun Lee. The network helps show where Chang‐Chun Lee may publish in the future.

Co-authorship network of co-authors of Chang‐Chun Lee

This figure shows the co-authorship network connecting the top 25 collaborators of Chang‐Chun Lee. A scholar is included among the top collaborators of Chang‐Chun Lee based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Chang‐Chun Lee. Chang‐Chun Lee is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Tseng, Shih‐Feng, Jianwei Huang, Chang‐Chun Lee, & Chil-Chyuan Kuo. (2025). Highly sensitive and flexible strain sensors based on electroplating copper/laser-induced graphene composites. Journal of Alloys and Compounds. 1022. 179928–179928. 5 indexed citations
2.
Lee, Chang‐Chun, et al.. (2025). Mechanical reliability of high-power modules via simulation-based machine learning. Engineering Applications of Artificial Intelligence. 154. 111019–111019. 1 indexed citations
3.
Trinh, Thuy, et al.. (2025). Stress-Induced Directed Self-Assembly of Perpendicularly Oriented Block Copolymer Lamellae for Lithographic Density Multiplication. ACS Applied Materials & Interfaces. 17(40). 56542–56552.
4.
Lee, Chang‐Chun, et al.. (2025). Process-induced influences on epoxy-based encapsulated reliability of high power modules. International Journal of Mechanical Sciences. 297-298. 110394–110394.
5.
Lee, Chang‐Chun, et al.. (2025). Fabrication-Induced Warpage Characterization Analysis of Micro-LED Fan-Out Packaging. IEEE Transactions on Components Packaging and Manufacturing Technology. 15(3). 603–612.
6.
Lee, Chang‐Chun, et al.. (2024). Stress-induced warpage estimation of advanced semiconductor copper interconnect processes. International Journal of Mechanical Sciences. 284. 109744–109744. 6 indexed citations
7.
Tran, Dinh-Phuc, et al.. (2024). Surface modification of nanotwinned copper and SiCN using N2 and Ar plasma activation. Applied Surface Science. 684. 161832–161832. 4 indexed citations
8.
Lee, Chang‐Chun, Kuo‐Shu Kao, & Yuan‐Cheng Huang. (2024). Experimental and Simulated Verification of Power Cycling Reliability for Thin and Low Warpage Power Modules. IEEE Transactions on Power Electronics. 39(10). 12478–12489.
9.
Tseng, Shih‐Feng, et al.. (2024). Laser-induced nano-Ag/graphene composites for highly responsive flexible strain sensors. Composites Part A Applied Science and Manufacturing. 188. 108586–108586. 10 indexed citations
10.
Lee, Chang‐Chun, et al.. (2024). Chipping-induced fracture investigation of glass interposer with dielectric coatings. Surface and Coatings Technology. 489. 131097–131097. 2 indexed citations
11.
Lee, Chang‐Chun, et al.. (2023). Comprehensive Influences of Manufacturing Process Integrated With Thermal Cycling Test Loading on Mechanical Responses of Power Module. IEEE Transactions on Components Packaging and Manufacturing Technology. 14(5). 824–831. 4 indexed citations
12.
Wang, Chi-Wei, Chang‐Chun Lee, Shou-Yi Chang, et al.. (2023). Diamond-structured nanonetwork gold as mechanical metamaterials from bottom-up approach. NPG Asia Materials. 15(1). 3 indexed citations
13.
14.
15.
Lin, Yi‐Feng, et al.. (2018). Synthesis of mechanically robust epoxy cross-linked silica aerogel membranes for CO 2 capture. Journal of the Taiwan Institute of Chemical Engineers. 87. 117–122. 32 indexed citations
16.
Sun, Tzu-Lin, Yen Sun, Chang‐Chun Lee, & Huey W. Huang. (2013). Membrane Permeability of Hydrocarbon-Cross-Linked Peptides. Biophysical Journal. 104(9). 1923–1932. 31 indexed citations
17.
Lee, Chang‐Chun, Yen Sun, & Huey W. Huang. (2012). How Type II Diabetes-Related Islet Amyloid Polypeptide Damages Lipid Bilayers. Biophysical Journal. 102(5). 1059–1068. 55 indexed citations
18.
Lee, Chang‐Chun & Shu-Tong Chang. (2012). Stress Impact of a Tensile Contact Etch Stop Layer on Nanoscale Strained NMOSFETs Embedded with a Silicon–Carbon Alloy Stressor. Journal of Nanoscience and Nanotechnology. 12(7). 5342–5346.
19.
Sun, Yen, et al.. (2010). Kinetic Process of β-Amyloid Formation via Membrane Binding. Biophysical Journal. 99(2). 544–552. 17 indexed citations
20.
Sun, Yen, Wei‐Chin Hung, Fang-Yu Chen, Chang‐Chun Lee, & Huey W. Huang. (2009). Interaction of Tea Catechin (−)-Epigallocatechin Gallate with Lipid Bilayers. Biophysical Journal. 96(3). 452a–452a. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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